| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/21/2002 | WO2002023634A2 Cmos transceiver having an integrated power amplifier |
| 03/21/2002 | WO2002023632A1 Contact device and circuit |
| 03/21/2002 | WO2002023631A2 Direct build-up layer on an encapsulated die package having a moisture barrier structure |
| 03/21/2002 | WO2002023630A2 Micromachined silicon block vias for transferring electrical signals to the backside of a silicon wafer |
| 03/21/2002 | WO2002023628A2 Semiconductor component and method of manufacturing |
| 03/21/2002 | WO2002023627A1 Semiconductor interconnection structure and method of fabrication |
| 03/21/2002 | WO2002023626A1 Improved semiconductor structure and method of fabrication |
| 03/21/2002 | WO2002023625A2 Semiconductor device and fabrication method therefor |
| 03/21/2002 | WO2002023620A2 Connection for conducting high frequency signal between a circuit and a discrete electrical component |
| 03/21/2002 | WO2002023618A1 Bonding wire for semiconductor and method of manufacturing the bonding wire |
| 03/21/2002 | WO2002023617A1 Two-metal tab tape, double-sided csp tape, bga tape, and method for manufacturing the same |
| 03/21/2002 | WO2002023616A1 Integrating metal with ultra low-k dielectrics |
| 03/21/2002 | WO2002023592A2 Method and apparatus for reducing ic die mass and thickness while improving strength characteristics |
| 03/21/2002 | WO2002023583A2 Monitor system and method for semiconductor processes |
| 03/21/2002 | WO2002023312A1 Method for jamming power consumption of an integrated circuit |
| 03/21/2002 | WO2002023115A2 Enhanced surface structures for passive immersion cooling of integrated circuits |
| 03/21/2002 | WO2002023114A1 Method and structure for temperature stabilization in semiconductor devices |
| 03/21/2002 | WO2001092594A3 Fiber-metal-matrix composite for physical vapor deposition target backing plates |
| 03/21/2002 | WO2001080316A3 Contactless interconnection system |
| 03/21/2002 | WO2001080314A3 Performance enhanced leaded packaging for electrical components |
| 03/21/2002 | WO2001080305A3 Electromigration early failure distribution in submicron interconnects |
| 03/21/2002 | WO2001017004A3 Method of forming a conductive silicide layer on a silicon comprising substrate and method of forming a conductive silicide contact |
| 03/21/2002 | US20020035720 Wiring editing method, for semiconductor package, capable of easily editing offset of wiring pattern |
| 03/21/2002 | US20020035412 Method and apparatus for controlling the strategy of compounding pharmaceutical admixtures |
| 03/21/2002 | US20020035233 Blend containing phosphorous compound |
| 03/21/2002 | US20020035201 No-flow reworkable epoxy underfills for flip-chip applications |
| 03/21/2002 | US20020034874 Method of manufacturing a semiconductor device |
| 03/21/2002 | US20020034873 Mechanical strength, thermal resistance, and adhesion to a substrate |
| 03/21/2002 | US20020034872 Semiconductor device and mounted semiconductor device structure |
| 03/21/2002 | US20020034871 Process for forming a dual damascene bond pad structure over active circuitry |
| 03/21/2002 | US20020034860 Methods of processing semiconductor wafer and producing IC card, and carrier |
| 03/21/2002 | US20020034843 Semiconductor device and method of forming a semiconductor device |
| 03/21/2002 | US20020034839 Multi-level circuit substrate, method for manufacturing same and method for adjusting a characteristic impedance therefor |
| 03/21/2002 | US20020034651 A substrate made of an aluminum/silicon carbide composite alloy comprises aluminum-silicon carbide alloy parts and non alloy silicon carbide parat dispersed therin; oxygen freesintering aluminum and silcon carbide powder compact |
| 03/21/2002 | US20020034625 Multiphase low dielectric constant material and method of deposition |
| 03/21/2002 | US20020034614 Multilayer board using a glass-ceramic material which can be fired at low temperatures |
| 03/21/2002 | US20020034582 Print head for ejecting liquid droplets and associated methods |
| 03/21/2002 | US20020034581 Micro C-4 semiconductor die and method for depositing connection sites thereon |
| 03/21/2002 | US20020034110 CMOS basic cell and method for fabricating semiconductor integrated circuit using the same |
| 03/21/2002 | US20020034088 Leadframe-based module DC bus design to reduce module inductance |
| 03/21/2002 | US20020034069 Electronic device having stacked modules and method for producing it |
| 03/21/2002 | US20020034066 Heat dissipation ball grid array package |
| 03/21/2002 | US20020034022 Method for producing solid-state imaging device |
| 03/21/2002 | US20020033745 Housing for an electronic component |
| 03/21/2002 | US20020033652 Piezoelectric device, manufacturing method therefor, and method for manufacturing piezoelectric oscillator |
| 03/21/2002 | US20020033561 Thermal conductive material and method for producing the same |
| 03/21/2002 | US20020033541 Semiconductor device manufacturing method and semiconductor device manufactured thereby |
| 03/21/2002 | US20020033539 Semiconductor device and method of manufacturing thereof |
| 03/21/2002 | US20020033537 Semiconductor device having a ground plane and manufacturing method thereof |
| 03/21/2002 | US20020033535 Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation |
| 03/21/2002 | US20020033534 Low k dielectric materials with inherent copper ion migration barrier |
| 03/21/2002 | US20020033533 Interconnect structure for use in an integrated circuit |
| 03/21/2002 | US20020033532 Electrode bonding structure for reducing the thermal expansion of the flexible printed circuit board during the bonding process |
| 03/21/2002 | US20020033531 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
| 03/21/2002 | US20020033530 Semiconductor device and semiconductor module |
| 03/21/2002 | US20020033528 Multichip module and method for manufacturing |
| 03/21/2002 | US20020033527 Semiconductor device and manufacturing process thereof |
| 03/21/2002 | US20020033526 Multichip module |
| 03/21/2002 | US20020033525 Packaging method and packaging structures of semiconductor devices |
| 03/21/2002 | US20020033524 Tape-carrier-package semiconductor device and a liquid crystal panel display using such a device as well as a method for testing the disconnection thereof |
| 03/21/2002 | US20020033523 Lead-frame for semiconductor devices |
| 03/21/2002 | US20020033519 On chip heating for electrical trimming of polysilicon and polysilicon-silicon-germanium resistors and electrically programmable fuses for integrated circuits |
| 03/21/2002 | US20020033509 Semiconductor device and manufacturing method of the same |
| 03/21/2002 | US20020033504 Si-MOS high-frequency semiconductor device and the manufacturing method of the same |
| 03/21/2002 | US20020033498 Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication |
| 03/21/2002 | US20020033489 Semiconductor device |
| 03/21/2002 | US20020033487 Semiconductor device |
| 03/21/2002 | US20020033486 Method for forming an interconnection line using a hydrosilsesquioxane (HSQ) layer as an interlayer insulating layer |
| 03/21/2002 | US20020033484 Wiring line assembly for thin film transistor array substrate and a method for fabricating the same |
| 03/21/2002 | US20020033412 Pillar connections for semiconductor chips and method of manufacture |
| 03/21/2002 | US20020033378 Printed wiring substrate and method for fabricating the same |
| 03/21/2002 | US20020033249 Heat dissipation apparatus |
| 03/21/2002 | US20020033247 Use of PCMs in heat sinks for electronic components |
| 03/21/2002 | US20020033189 Heat dissipating silicon-on-insulator structures |
| 03/21/2002 | US20020032962 Method for producing an electrically conducting connection |
| 03/21/2002 | US20020032940 Method for polishing leads for semiconductor packages |
| 03/21/2002 | DE10119813A1 Leistungsmodul Power module |
| 03/21/2002 | DE10103966A1 Semiconductor device comprises a semiconductor chip having a connecting surface-fixing surface provided with a contacting surface, an insulating layer formed on the connecting surface-fixing surface, and a conducting body |
| 03/21/2002 | DE10044148A1 Elektronisches Bauteil mit gestapelten Bausteinen und Verfahren zu seiner Herstellung Electronic component with stacked modules and process for its preparation |
| 03/21/2002 | DE10041829A1 Cooling device used in microprocessors comprises a substrate having a thermal conducting surface that forms a thermal contact with the object to be cooled and a thermal dissipating surface |
| 03/21/2002 | DE10041417A1 Elektronische Ansteuerung für Heizelemente Electronic control for heating elements |
| 03/21/2002 | DE10038999A1 Gehäuse für ein elektronisches Bauelement Housing for an electronic component |
| 03/21/2002 | CA2421799A1 Integrating metal with ultra low-k dielectrics |
| 03/21/2002 | CA2320612A1 Compact chip labelling using stepper technology |
| 03/20/2002 | EP1189345A2 High frequency module device and method for its preparation |
| 03/20/2002 | EP1189291A2 Chip type light emitting diode and method of manufacture thereof |
| 03/20/2002 | EP1189282A1 Semiconductor device, method of manufacturing electronic device, electronic device, and portable information terminal |
| 03/20/2002 | EP1189281A2 Chip-arrangement |
| 03/20/2002 | EP1189280A1 Semiconductor device |
| 03/20/2002 | EP1189279A1 Resin-sealed semiconductor device, circuit member used for the device, and method of manufacturing the circuit member |
| 03/20/2002 | EP1189278A2 Dry thermal grease |
| 03/20/2002 | EP1189277A1 Electronic circuit substrate and electronic module using such a substrate |
| 03/20/2002 | EP1189273A2 Semiconductor device and production process |
| 03/20/2002 | EP1189272A1 Module with built-in electronic elements and method of manufacture thereof |
| 03/20/2002 | EP1189271A2 Wiring boards and mounting of semiconductor devices thereon |
| 03/20/2002 | EP1189270A2 Semiconductor device |
| 03/20/2002 | EP1189262A2 Semiconductor device comprising a capacitor and method of manufacturing the same |
| 03/20/2002 | EP1188233A1 Integrated electronic circuit comprising an electronic component and a delay element which is connected to the component |
| 03/20/2002 | EP1188212A1 A multi-functional energy conditioner |
| 03/20/2002 | EP1188182A1 A method of assembling a semiconductor device package |