| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/28/2002 | US20020036224 Hermetically sealed component assembly package |
| 03/28/2002 | US20020036143 Method of electroless plating and electroless plating apparatus |
| 03/28/2002 | US20020036100 Microbeam assembly for integrated circuit interconnection to substrates |
| 03/28/2002 | US20020036054 Printed circuit board and method manufacturing the same |
| 03/28/2002 | US20020035891 Vapor phase hydrogen-reducing process using nickel chloride vapor in the presence of supplied sulfur to form an ultrafine nickel powder with low specified sulfur content; use as electrodes for ceramic capacitors, no cracking, delamination |
| 03/28/2002 | DE10145147A1 Connecting structure used for forming electrical connection in highly integrated circuits comprises connecting substrate, connecting elements mounted on horizontal surface of the substrate, base region, and spring region |
| 03/28/2002 | DE10141438A1 Halbleitervorrichtung und Anschlußeinrichtung Semiconductor device and connector means |
| 03/28/2002 | DE10121554A1 Halbleiterbauelement zum Steuern von Elektrizität Semiconductor device for controlling electricity |
| 03/28/2002 | DE10045466A1 Production of a thick layer/thin layer hybrid circuit on metal oxide substrates comprises applying conducting pathways, resistance surfaces and insulating layers on an insulating layer of a metal oxide produced |
| 03/28/2002 | DE10043512A1 Heat-conducting layer for microelectronic components is a polycrystalline diamond layer having a mean particle size that increases with increasing distance from the component surface |
| 03/28/2002 | DE10042948A1 Integrated component used in electronic devices comprises an intermediate layer acting as a diffusion barrier arranged between a copper-containing conducting pathway and a covering layer |
| 03/28/2002 | DE10042653A1 Ceramic multiple layer circuit element for linking adjacent electrically conductive elements has stacked ceramic layers with different relative permittivities and green ceramic foil with lowered crystallizing temperature. |
| 03/27/2002 | EP1191829A2 Surface electrode structure on ceramic multi-layer substrate and process for producing the same |
| 03/27/2002 | EP1191609A2 LED lamp, LED lamp assembly and fixing method of an LED lamp |
| 03/27/2002 | EP1191591A2 Method and mark for labelling integrated circuit |
| 03/27/2002 | EP1191590A2 Semiconductor device and semiconductor module |
| 03/27/2002 | EP1191589A2 Semiconductor device having lead frame and metal plate |
| 03/27/2002 | EP1191588A2 A spiral contactor and manufacturing method therefor |
| 03/27/2002 | EP1191587A2 Packaging structure and method for automotive components |
| 03/27/2002 | EP1191361A1 Heater module for optical waveguide device |
| 03/27/2002 | EP1191123A2 Dual frequency plasma enhanced chemical vapor deposition of silicon carbide layers |
| 03/27/2002 | EP1191063A1 Epoxy resin composition and semiconductor device |
| 03/27/2002 | EP1191062A1 Epoxy resin composition and semiconductor devices |
| 03/27/2002 | EP1190607A1 Integrated circuits with copper metallization for interconnections |
| 03/27/2002 | EP1190450A2 Electrostatic discharge protection of integrated circuits |
| 03/27/2002 | EP1190449A1 Interposer and method of making same |
| 03/27/2002 | EP1190448A1 Chip package with molded underfill |
| 03/27/2002 | EP1190446A1 Component and method for the production thereof |
| 03/27/2002 | EP1106040B1 Method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections |
| 03/27/2002 | CN1342331A Method for forming co-axial interconnect lines in CMOS process |
| 03/27/2002 | CN1342330A Method for forming co-axial interconnect in CMOS process |
| 03/27/2002 | CN1342042A Electronic instrument for radiator with cooling heated piece |
| 03/27/2002 | CN1342041A Electronic device of sealed electronic element and manufacturing method and printed wiring board |
| 03/27/2002 | CN1342037A Protecting circuit device using metal oxide semiconductor field effect transistor and its manufacturing method |
| 03/27/2002 | CN1342035A Circuit device and its manufacturing method |
| 03/27/2002 | CN1341967A 集成电路装置 The integrated circuit device |
| 03/27/2002 | CN1341965A Electronic part with laminated assembly and manufacturing method thereof |
| 03/27/2002 | CN1341964A Integrated electromagnetic shield device |
| 03/27/2002 | CN1341963A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 03/27/2002 | CN1341962A Semiconductor device and manufactoring method thereof |
| 03/27/2002 | CN1341960A Method for manufacturing conductive connecting wire |
| 03/27/2002 | CN1341869A Control signal part and liquid crystal display containing said control signal part |
| 03/27/2002 | CN1081664C Liquid-state epoxy resin potting material |
| 03/26/2002 | US6363329 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture |
| 03/26/2002 | US6362972 Contactless interconnection system |
| 03/26/2002 | US6362965 Clamping heat sinks to circuit boards over processors |
| 03/26/2002 | US6362964 Flexible power assembly |
| 03/26/2002 | US6362963 Heat sink clip |
| 03/26/2002 | US6362962 Clip for heat sink |
| 03/26/2002 | US6362961 CPU and heat sink mounting arrangement |
| 03/26/2002 | US6362642 Method of chip testing of chip leads constrained in dielectric media |
| 03/26/2002 | US6362641 Integrated circuit device and semiconductor wafer having test circuit therein |
| 03/26/2002 | US6362546 Rectifier device for a dynamo of a motor vehicle |
| 03/26/2002 | US6362532 Semiconductor device having ball-bonded pads |
| 03/26/2002 | US6362531 Recessed bond pad |
| 03/26/2002 | US6362530 Manufacturing methods and construction for integrated circuit packages |
| 03/26/2002 | US6362529 Stacked semiconductor device |
| 03/26/2002 | US6362528 Semiconductor device and method of manufacturing the same |
| 03/26/2002 | US6362527 Borderless vias on bottom metal |
| 03/26/2002 | US6362526 Alloy barrier layers for semiconductors |
| 03/26/2002 | US6362525 Circuit structure including a passive element formed within a grid array substrate and method for making the same |
| 03/26/2002 | US6362524 Edge seal ring for copper damascene process and method for fabrication thereof |
| 03/26/2002 | US6362523 Semiconductor device |
| 03/26/2002 | US6362522 Cool frame for protecting packaged electronic devices |
| 03/26/2002 | US6362520 Microelectronic mounting with multiple lead deformation using restraining straps |
| 03/26/2002 | US6362518 Electronic compoment to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same |
| 03/26/2002 | US6362517 High voltage package for electronic device |
| 03/26/2002 | US6362516 Electronic apparatus |
| 03/26/2002 | US6362514 Semiconductor device |
| 03/26/2002 | US6362438 Enhanced plated-through hole and via contact design |
| 03/26/2002 | US6362437 Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder, and method of mounting the same |
| 03/26/2002 | US6362436 Printed wiring board for semiconductor plastic package |
| 03/26/2002 | US6362435 Multi-layer conductor pad for reducing solder voiding |
| 03/26/2002 | US6362429 Stress relieving tape bonding interconnect |
| 03/26/2002 | US6362426 Radiused leadframe |
| 03/26/2002 | US6362102 Method of forming top metal contact to antifuse |
| 03/26/2002 | US6362099 Providing a barrier layer having a first surface that is substantially unoxidized; depositing a first copper layer onto the first surface of the barrier layer, wherein the first copper layer is deposited from a precursor |
| 03/26/2002 | US6362089 Providing semiconductor substrate; cleaning bonding surface of copper; activating bonding surface a first time in palladium bath; activating bonding surface a second time in electroless nickel-boron bath; depositing solderable/wirebondable metal |
| 03/26/2002 | US6362087 Forming barrier layer on substrate; forming barrier layer on redistribution pattern and forming terminal electrode layer |
| 03/26/2002 | US6362073 Method for forming semiconductor device having low parasite capacitance using air gap and self-aligned contact plug |
| 03/26/2002 | US6362069 Long-wavelength VCSELs and method of manufacturing same |
| 03/26/2002 | US6362024 Semiconductor memory device manufacturing method with fuse cutting performance improved |
| 03/26/2002 | US6362023 Dielectric-based anti-fuse cell with polysilicon contact plug and method for its manufacture |
| 03/26/2002 | US6362022 Multi-part lead frame with dissimilar materials and method of manufacturing |
| 03/26/2002 | US6362012 Base layer of dielectric is deposited over the surface of a semiconductor substrate, dielectric is deposited over the surface of substrate, contact plugs are provided, multiple layers of dielectric are deposited; vias are provided |
| 03/26/2002 | US6361879 Sealed semiconductors |
| 03/26/2002 | US6361857 Heat exchangers with substrates, sintering compacts of copper and tungsten, thin diamond film layer on substrate with copper and x-ray diffraction |
| 03/26/2002 | US6361831 Paste application method for die bonding |
| 03/26/2002 | US6361704 Self stop aluminum pad for copper process |
| 03/26/2002 | US6361627 Process of controlling grain growth in metal films |
| 03/26/2002 | US6361331 Spring structure with self-aligned release material |
| 03/26/2002 | US6361327 Micromachined silicon beam interconnect |
| 03/26/2002 | US6360816 Cooling apparatus for electronic devices |
| 03/26/2002 | US6360814 Cooling device boiling and condensing refrigerant |
| 03/26/2002 | US6360813 Electronic components cooling apparatus |
| 03/26/2002 | US6360812 Heat dissipating assembly |
| 03/26/2002 | US6360433 Universal package and method of forming the same |
| 03/26/2002 | CA2242802C Mounting structure for one or more semiconductor devices |
| 03/21/2002 | WO2002023966A2 Method and apparatus for temperature gradient control in an electronic system |
| 03/21/2002 | WO2002023674A2 Thick film millimeter wave transceiver module |