| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/02/2002 | US6365453 Method and structure for reducing contact aspect ratios |
| 04/02/2002 | US6365443 Method of manufacturing a semiconductor device having data pads formed in scribed area |
| 04/02/2002 | US6365441 Partial underfill for flip-chip electronic packages |
| 04/02/2002 | US6365440 Method for contacting a circuit chip |
| 04/02/2002 | US6365439 Method of manufacturing a ball grid array type semiconductor package |
| 04/02/2002 | US6365438 Process for manufacturing semiconductor package and circuit board assembly |
| 04/02/2002 | US6365437 Method of connecting a die in an integrated circuit module |
| 04/02/2002 | US6365433 Semiconductor device and manufacturing method thereof |
| 04/02/2002 | US6365432 Fabrication process of semiconductor package and semiconductor package |
| 04/02/2002 | US6365426 Method of determining the impact of plasma-charging damage on yield and reliability in submicron integrated circuits |
| 04/02/2002 | US6365327 Forming a stack including insulating layers, a stop layer and two masks; tantalum or silicon element or compound dielectrics; copper, aluminum, tungsten, nickel, polysilicon,or gold conductor |
| 04/02/2002 | US6365320 Process for forming anti-reflective film for semiconductor fabrication using extremely short wavelength deep ultraviolet photolithography |
| 04/02/2002 | US6365303 Electrostatic discharge damage prevention method on masks |
| 04/02/2002 | US6365269 Plastic compositions for sheathing a metal or semiconductor body |
| 04/02/2002 | US6365260 Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules |
| 04/02/2002 | US6365042 Sequestering metals |
| 04/02/2002 | US6364965 Heating in vacuum |
| 04/02/2002 | US6364743 Composite lapping monitor resistor |
| 04/02/2002 | US6364669 Spring contact for providing high current power to an integrated circuit |
| 04/02/2002 | US6364009 Cooling devices |
| 04/02/2002 | US6364003 Device and method for absorbing and radiating heat in very small space by alternately pushing two fluids |
| 04/02/2002 | US6363976 Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
| 04/02/2002 | CA2255701C Apparatus and method for mounting an electronic component to a substrate |
| 04/02/2002 | CA2080832C Fluorinated poly(arylene ethers) |
| 04/02/2002 | CA2070836C Electronic articles containing a fluorinated poly(arlene ether) dielectric |
| 03/28/2002 | WO2002026008A1 Hermetically sealed component assembly package |
| 03/28/2002 | WO2002025825A2 Method for assembling components and antennae in radio frequency identification devices |
| 03/28/2002 | WO2002025777A2 Press (non-soldered) contacts for high current electrical connections in power modules |
| 03/28/2002 | WO2002025736A1 A high voltage semiconductor |
| 03/28/2002 | WO2002025732A2 Power module with integrated capacitor |
| 03/28/2002 | WO2002025731A1 Electronic equipment |
| 03/28/2002 | WO2002025709A2 Integrated thin film capacitor/inductor/interconnect system and method |
| 03/28/2002 | WO2002025704A2 Leadframe-based module dc bus design to reduce module inductance |
| 03/28/2002 | WO2002025703A2 Substrate-level dc bus design to reduce module inductance |
| 03/28/2002 | WO2002025702A2 Semiconductor product with a silver and gold alloy |
| 03/28/2002 | WO2002025698A2 Cooling body, especially for cooling electronic components |
| 03/28/2002 | WO2002024808A1 Epoxy resin molding material for sealing |
| 03/28/2002 | WO2002024391A1 Polymer collar for solder bumps |
| 03/28/2002 | WO2001091184A3 Semiconductor component comprising a surface metallization |
| 03/28/2002 | WO2001088956A3 Rf integrated circuit layout |
| 03/28/2002 | WO2001080315A3 Shaped springs and methods of fabricating and using shaped springs |
| 03/28/2002 | WO2001078093A3 Distributed capacitor |
| 03/28/2002 | WO2001063662A3 Resistor arrays for mask-alignment detection |
| 03/28/2002 | WO2001060242A3 Test structure for metal cmp process control |
| 03/28/2002 | WO2001059829A3 Method for mounting integrated circuits on a conductor support and resulting support |
| 03/28/2002 | WO2001056083A3 Ldmos power package with a plurality of ground signal paths |
| 03/28/2002 | WO2001043193A3 Dual-die integrated circuit package |
| 03/28/2002 | US20020038161 Methods and apparatus for calculating alignment of layers during semiconductor processing |
| 03/28/2002 | US20020037804 Compacts; low temperature sintering; barium, titanium, rare earth oxides |
| 03/28/2002 | US20020037756 Battery-operated wireless-communication apparatus and method |
| 03/28/2002 | US20020037672 Socket, circuit board, and sub-circuit board for semiconductor integrated circuit device |
| 03/28/2002 | US20020037657 Spiral contactor and manufacturing method for this apparatus, and a semiconductor inspecting equipment and electronical parts using this apparatus |
| 03/28/2002 | US20020037651 Method for minimizing damage of process charging phenomena |
| 03/28/2002 | US20020037648 Etching method |
| 03/28/2002 | US20020037643 Semiconductor device with fuse to be blown with energy beam and method of manufacturing the semiconductor device |
| 03/28/2002 | US20020037633 Disk-like gettering unit, integrated circuit, encapsulated semiconductor device, and method for manufacturing the same |
| 03/28/2002 | US20020037618 Semiconductor device and method of manufacturing the same |
| 03/28/2002 | US20020037611 Contact hole for exposing an active region of a substrate is self-aligned and ions are locally implanted only on a channel region |
| 03/28/2002 | US20020037606 Inductive fuse for semiconductor device |
| 03/28/2002 | US20020037604 Lead frame, semiconductor package having lead frame, and method of manufacturing semiconductor package |
| 03/28/2002 | US20020037603 Microelectronic device package with conductive elements and associated method of manufacture |
| 03/28/2002 | US20020037598 High frequency, low cost package for semiconductor devices |
| 03/28/2002 | US20020037442 A dielectric material having two or more phases comprising: a first phase consisting of Silicon, Carbon, Oxygen and hydrogen, and atleast one second phase consisting of carbon and hydrogen and multiplicity of nanometer-sized pores |
| 03/28/2002 | US20020037435 Circuit substrate |
| 03/28/2002 | US20020037434 Integrated circuit having a micromagnetic device and method of manufacture therefor |
| 03/28/2002 | US20020037419 Thermal conductive sheet with conductive foil |
| 03/28/2002 | US20020037412 Immersing a copper containing alloy substrate in acid to reduce the copper content of a surface region and roughen exposed metal at the surface, then forming a thin diamond layer by vapor deposition; good adhesion; for electronics |
| 03/28/2002 | US20020037372 For applying paste to adhere a semiconductor chip on a substrate |
| 03/28/2002 | US20020037233 Following extraction of the organic binder the green micromolds or micromold components are sintered to full density, upon which they shrink by accurately predetermined amounts; complex-shaped micrometer/ nanometer-sized precision |
| 03/28/2002 | US20020037232 Method for controlling the dimensions of bodies made from sinterable materials |
| 03/28/2002 | US20020036895 Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card |
| 03/28/2002 | US20020036893 Turbinate heat sink |
| 03/28/2002 | US20020036891 Clip for heat sink |
| 03/28/2002 | US20020036890 Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module |
| 03/28/2002 | US20020036505 Evaluating pattern for measuring an erosion of a semiconductor wafer polished by a chemical mechanical polishing |
| 03/28/2002 | US20020036464 Led lamp, led lamp assembly and fixing method of an led lamp |
| 03/28/2002 | US20020036357 Semiconductor device comprising layered positional detection marks and manufacturing method thereof |
| 03/28/2002 | US20020036356 Microstructure array, mold for forming a microstructure array, and method of fabricating the same |
| 03/28/2002 | US20020036355 Semiconductor devices |
| 03/28/2002 | US20020036354 Semiconductor device |
| 03/28/2002 | US20020036353 Semiconductor device having a metal silicide layer and method for manufacturing the same |
| 03/28/2002 | US20020036352 Method for fabricating semiconductor device capable of reducing parasitic capacitance and semiconductor device thereby |
| 03/28/2002 | US20020036351 Method for reducing surface defects of semiconductor substrates |
| 03/28/2002 | US20020036350 Semiconductor device and method of manufacturing the same |
| 03/28/2002 | US20020036349 Semiconductor device and manufacturing |
| 03/28/2002 | US20020036348 Semiconductor device having multi-layered wiring structure |
| 03/28/2002 | US20020036346 Semiconductor device having damascene interconnection structure that prevents void formation between interconnections |
| 03/28/2002 | US20020036345 High frequency flip chip module and assembling method thereof |
| 03/28/2002 | US20020036344 Semiconductor device provided with low melting point metal bumps |
| 03/28/2002 | US20020036342 Substrate cooling unit |
| 03/28/2002 | US20020036341 Printed board unit |
| 03/28/2002 | US20020036340 Stacked circuit device and method for evaluating an integrated circuit substrate using the stacked circuit device |
| 03/28/2002 | US20020036339 Semiconductor device |
| 03/28/2002 | US20020036337 Semiconductor device and fabricating method therefor |
| 03/28/2002 | US20020036336 High K dielectric de-coupling capacitor embedded in backend interconnect |
| 03/28/2002 | US20020036330 Semiconductor device with SOI structure and method of manufacturing the same |
| 03/28/2002 | US20020036325 RF power transistor |
| 03/28/2002 | US20020036322 SOI stacked dram logic |
| 03/28/2002 | US20020036309 Semiconductor device and method for fabricating the same |
| 03/28/2002 | US20020036235 Semiconductor device and an information management system thereof |