| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/04/2002 | US20020038582 Impregnating filler with polyarylene ether; melting; uniformdispersion |
| 04/04/2002 | US20020038509 Bump structure and method for making the same |
| 04/04/2002 | DE10143968A1 A method of producing a vacuum container with an internal vacuum cavity |
| 04/04/2002 | DE10138982A1 Zuleitungsrahmen, unter Verwendung desselben hergestelltes Halbleiter-Bauelement und Verfahren zum Herstellen des Halbleiter-Bauelements Lead frame, manufactured using the same semiconductor device and method of manufacturing the semiconductor device |
| 04/04/2002 | DE10102119C1 Optoelectronic component has electromagnetic screening provided by conductor strip region projecting from component housing and wrapped around outside of latter |
| 04/04/2002 | DE10065722C1 Electrical connection formation method uses 2 separate bonding wires between spaced contact surfaces provided via ball-wedge bonding method |
| 04/04/2002 | DE10057846A1 Integrated circuit chip and manufacturing process has temperature sensor to control chip operation speed |
| 04/04/2002 | DE10053240A1 Kühlkörper für Halbleiterelemente, Verfahren zu seiner Herstellung sowie Formwerkzeug dafür Heat sink for semiconductor elements, process for its preparation and to mold it |
| 04/04/2002 | DE10045696A1 Kontakteinrichtung und Schaltungsanordnung Contactor and circuit |
| 04/04/2002 | DE10045534A1 Electronic component has capillary elements as connection elements, which are connected with contact areas of a carrier |
| 04/04/2002 | DE10044502A1 Verfahren und Markierung zum Kennzeichnen integrierter Schaltkreise And marking method for identifying integrated circuits |
| 04/04/2002 | DE10043955A1 Halbleiterchip mit einer Schutzabdeckung und zugehöriges Herstellungsverfahren Semiconductor chip having a protective cover and manufacturing method thereof |
| 04/04/2002 | DE10043947A1 Current conductor of integrated circuit, producing magnetic field with transitive effect, includes recess modifying field produced |
| 04/04/2002 | DE10043511A1 Kompositstruktur für elektronische Mikrosysteme sowie Verfahren zur Herstellung der Kompositstruktur The composite structure for electronic microsystems, and process for producing the composite structure |
| 04/04/2002 | DE10043350A1 Process for studying structures on a wafer places circuits with test structures on the wafer light mask to detect electric parameters |
| 04/04/2002 | DE10042839A1 Electronic component with metal heatsink, comprises chips arranged on substrate with track conductors insulated from metal by layer of oxide formed upon it |
| 04/03/2002 | EP1194030A1 Method for mounting semiconductor element to circuit board, and semiconductor device |
| 04/03/2002 | EP1194022A1 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board |
| 04/03/2002 | EP1193803A1 IC socket |
| 04/03/2002 | EP1193774A1 Thermoelectric material and method for manufacturing the same |
| 04/03/2002 | EP1193770A2 Sealed airtight container for optical-semiconductors and optical-semiconductor module |
| 04/03/2002 | EP1193768A1 Process for driving a turn-off power semiconductor device and device for carrying out this process |
| 04/03/2002 | EP1193761A2 Semiconductor device including intermediate wiring element |
| 04/03/2002 | EP1193760A2 Semiconductor device with SOI structure and method of manufacturing the same |
| 04/03/2002 | EP1193759A1 Ic device and its production method, and information carrier mounted with ic device and its production method |
| 04/03/2002 | EP1193758A1 Anti-deciphering contacts |
| 04/03/2002 | EP1193757A2 Conductive metal particles, conductive composite metal particles and applied products using the same |
| 04/03/2002 | EP1193756A1 Method for a device with power semiconductors and an apparatus |
| 04/03/2002 | EP1193755A1 Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them |
| 04/03/2002 | EP1193750A2 Micro soldering method and apparatus |
| 04/03/2002 | EP1193744A1 Reinforcement material for silicon wafer and method of manufacturing ic chip using the reinforcement material |
| 04/03/2002 | EP1193233A1 Ceramic substrate for semiconductor production/inspection device |
| 04/03/2002 | EP1192844A1 Arrangement for dissipating thermal energy generated by heat source |
| 04/03/2002 | EP1192842A1 A method and an arrangement for the electrical contact of components |
| 04/03/2002 | EP1192659A1 Multichip module and method for producing a multichip module |
| 04/03/2002 | EP1192658A1 Stackable flex circuit ic package and method of making the same |
| 04/03/2002 | EP1192656A1 Method of protecting an underlying wiring layer during dual damascene processing |
| 04/03/2002 | EP1192592A1 Device and method for making devices comprising at least a chip fixed on a support |
| 04/03/2002 | EP1192524A1 Micro cooling device |
| 04/03/2002 | EP0995235B1 Contact for very small liaison contacts and method for producing a contact |
| 04/03/2002 | EP0835275B1 Improved poly(arylene ether) compositions and the method for their manufacture |
| 04/03/2002 | EP0834242B1 Connection substrate |
| 04/03/2002 | CN2484644Y Radiating apparatus |
| 04/03/2002 | CN2484643Y Forming structure of radiating fins |
| 04/03/2002 | CN2484642Y Positioning buckling element of radiating fin |
| 04/03/2002 | CN2484641Y Radiating apparatus of combined with buckle-assembled elements |
| 04/03/2002 | CN2484640Y Radiating device of central processor |
| 04/03/2002 | CN2484639Y Radiating apparatus |
| 04/03/2002 | CN2484638Y CPU-radiating-fin combined buckling component |
| 04/03/2002 | CN2484637Y CPU-radiating-fin combined buckling component |
| 04/03/2002 | CN2484636Y Inlaid-type power semiconductor packaging structure |
| 04/03/2002 | CN1343440A Method and arrangement for electrical contact of componnets |
| 04/03/2002 | CN1343372A Air gap dielectric in self-aligned via structures |
| 04/03/2002 | CN1343086A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 04/03/2002 | CN1343043A Piezoelectric device and manufacturing method thereof and manufacturing method for piezoelectric oscillator |
| 04/03/2002 | CN1343007A Semiconductor device, manufacturing method, thereof, circuit base plate and electronic equipment |
| 04/03/2002 | CN1343006A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 04/03/2002 | CN1082332C Multilayer printed circuit board |
| 04/03/2002 | CN1082067C Epopxy resin composition for sealing photosenmiconductor device |
| 04/02/2002 | US6366770 High-frequency semiconductor device and radio transmitter/receiver device |
| 04/02/2002 | US6366487 Plurality of integrated circuit chips |
| 04/02/2002 | US6366468 Self-aligned common carrier |
| 04/02/2002 | US6366463 Cooling mechanism, heat sink, electronic equipment and fabrication method therefor |
| 04/02/2002 | US6366461 System and method for cooling electronic components |
| 04/02/2002 | US6366110 Configuration for testing chips |
| 04/02/2002 | US6365980 Thermally enhanced semiconductor ball grid array device and method of fabrication |
| 04/02/2002 | US6365979 Semiconductor device and manufacturing method thereof |
| 04/02/2002 | US6365978 Electrical redundancy for improved mechanical reliability in ball grid array packages |
| 04/02/2002 | US6365976 Integrated circuit device with depressions for receiving solder balls and method of fabrication |
| 04/02/2002 | US6365975 Chip with internal signal routing in external element |
| 04/02/2002 | US6365974 Flex circuit substrate for an integrated circuit package |
| 04/02/2002 | US6365973 Filled solder |
| 04/02/2002 | US6365972 Transmutation layer being formed of a compound of type cu3b2, cu3p, cu3si or cun, or an oxide type of cu(bo2)2, cu3(po4)2, cusio4 or cuno3; and a conductive layer formed on the insulator layer |
| 04/02/2002 | US6365971 Unlanded vias with a low dielectric constant material as an intraline dielectric |
| 04/02/2002 | US6365970 Bond pad structure and its method of fabricating |
| 04/02/2002 | US6365967 Interconnect structure |
| 04/02/2002 | US6365964 Heat-dissipating assembly for removing heat from a flip chip semiconductor device |
| 04/02/2002 | US6365963 Stacked-chip semiconductor device |
| 04/02/2002 | US6365962 Flip-chip on flex for high performance packaging applications |
| 04/02/2002 | US6365961 High-frequency input/output feedthrough and package for housing high-frequency semiconductor element using same |
| 04/02/2002 | US6365960 Integrated circuit package with EMI shield |
| 04/02/2002 | US6365959 Semiconductor device and method for fabricating the same |
| 04/02/2002 | US6365958 Sacrificial structures for arresting insulator cracks in semiconductor devices |
| 04/02/2002 | US6365939 Semiconductor protection device |
| 04/02/2002 | US6365938 Integrated circuit devices that use antiparallel diodes to reduce damage during plasma processing |
| 04/02/2002 | US6365918 Method and device for interconnected radio frequency power SiC field effect transistors |
| 04/02/2002 | US6365905 Focused ion beam processing apparatus |
| 04/02/2002 | US6365861 Method for sorting integrated circuit devices |
| 04/02/2002 | US6365860 Method for sorting integrated circuit devices |
| 04/02/2002 | US6365833 Integrated circuit package |
| 04/02/2002 | US6365828 Electromagnetic interference suppressing device and circuit |
| 04/02/2002 | US6365821 Thermoelectrically cooling electronic devices |
| 04/02/2002 | US6365521 Passivation for tight metal geometry |
| 04/02/2002 | US6365513 Method of making a semiconductor device including testing before thinning the semiconductor substrate |
| 04/02/2002 | US6365502 Microelectronic interconnect material with adhesion promotion layer and fabrication method |
| 04/02/2002 | US6365501 Mask repattern process |
| 04/02/2002 | US6365500 Composite bump bonding |
| 04/02/2002 | US6365499 Chip carrier and method of manufacturing and mounting the same |
| 04/02/2002 | US6365498 Integrated process for I/O redistribution and passive components fabrication and devices formed |
| 04/02/2002 | US6365489 Creation of subresolution features via flow characteristics |