| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/09/2002 | US6368956 Method of manufacturing a semiconductor device |
| 04/09/2002 | US6368953 Encapsulated metal structures for semiconductor devices and MIM capacitors including the same |
| 04/09/2002 | US6368952 Diffusion inhibited dielectric structure for diffusion enhanced conductor layer |
| 04/09/2002 | US6368951 Semiconductor device manufacturing method and semiconductor device |
| 04/09/2002 | US6368939 Multilevel interconnection structure having an air gap between interconnects |
| 04/09/2002 | US6368937 Method of manufacturing semiconductor device |
| 04/09/2002 | US6368936 Method for forming a semiconductor integrated circuit |
| 04/09/2002 | US6368933 Tap connections for circuits with leakage suppression capability |
| 04/09/2002 | US6368910 Method of fabricating ruthenium-based contact plug for memory devices |
| 04/09/2002 | US6368902 Enhanced efuses by the local degradation of the fuse link |
| 04/09/2002 | US6368900 Method of fabricating an antifuse element |
| 04/09/2002 | US6368899 Electronic device packaging |
| 04/09/2002 | US6368898 Solid-state image sensing device |
| 04/09/2002 | US6368896 Method of wafer level chip scale packaging |
| 04/09/2002 | US6368895 Method of producing an electronic circuit device |
| 04/09/2002 | US6368894 Multi-chip semiconductor module and manufacturing process thereof |
| 04/09/2002 | US6368893 Method of fabricating semiconductor device |
| 04/09/2002 | US6368880 Depositing barrier/wetting layer over surfaces of aperture, the barrier/wetting layer comprising tantalum, tantalum nitride, tungsten, tungsten nitride, and combinations thereof, depositing a conformal metal layer over the surface |
| 04/09/2002 | US6368704 Conductive paste of high thermal conductivity and electronic part using the same |
| 04/09/2002 | US6368484 Lining workpiece, then adding and selectively removing a seed layer before electroplating; reduces waste, cost, and time |
| 04/09/2002 | US6368412 Apparatus with high temperature gas releasing means for vapor deposition of parylene polymer without peeling |
| 04/09/2002 | US6367544 Thermal jacket for reducing condensation and method for making same |
| 04/09/2002 | US6367543 Liquid-cooled heat sink with thermal jacket |
| 04/09/2002 | US6367542 Heat sink assembly with dual fans |
| 04/09/2002 | US6367541 Conforming heat sink assembly |
| 04/09/2002 | US6367509 Thermal harness using encased carbon-based fiber and end attachment brackets |
| 04/09/2002 | US6367263 Integrated circuit refrigeration device |
| 04/09/2002 | US6367152 Method for manufacturing a heat sink |
| 04/09/2002 | US6367149 Method of assembling an IC socket for interconnecting articles with different terminal pitches |
| 04/04/2002 | WO2002028160A2 Microfluidic devices for heat transfer |
| 04/04/2002 | WO2002027794A2 Integral capacitor with electromagnetic radiation reduction |
| 04/04/2002 | WO2002027793A2 Method and apparatus for providing a variable inductor on a semiconductor chip |
| 04/04/2002 | WO2002027792A2 Low inductive wire bond chip packaging |
| 04/04/2002 | WO2002027791A2 Polymer stud grid array and method for production thereof |
| 04/04/2002 | WO2002027790A1 Barrier layers for solder joints |
| 04/04/2002 | WO2002027789A1 Connecting device |
| 04/04/2002 | WO2002027788A2 Structure and process for reducing die corner and edge stresses in microelectronic packages |
| 04/04/2002 | WO2002027787A1 Semiconductor mounting board, its manufacturing method, semiconductor package comprising this board, and its manufacturing method |
| 04/04/2002 | WO2002027786A1 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 04/04/2002 | WO2002027785A2 Direct heatpipe attachment to die using center point loading |
| 04/04/2002 | WO2002027784A2 Making of fuses and antifuses with a vertical dram process |
| 04/04/2002 | WO2002027780A1 Resin-sealed semiconductor device, and die bonding material and sealing material for use therein |
| 04/04/2002 | WO2002027779A2 Singulation of semiconductor packages by tie bar cutting |
| 04/04/2002 | WO2002027768A2 Fabrication of semiconductor devices |
| 04/04/2002 | WO2002026479A2 Carbon-carbon fiber composite heat spreader |
| 04/04/2002 | WO2002011506A3 Vapor chamber with integrated pin array |
| 04/04/2002 | WO2002008660A3 Heat exchanger having silicon nitride substrate for mounting high power electronic components |
| 04/04/2002 | WO2001093324A3 Substrate adapted to accommodate a circuit configuration and method for producing the same |
| 04/04/2002 | WO2001088983A3 Power semiconductor module |
| 04/04/2002 | WO2001088982A3 Housing device and contact element used therein |
| 04/04/2002 | WO2001086718A3 Semiconductor device with fuses and method of manufacturing same |
| 04/04/2002 | WO2001084619A3 Method of depositing low stress films |
| 04/04/2002 | WO2001082375A3 Improved pillar connections for semiconductor chips and method of manufacture |
| 04/04/2002 | WO2001078146A3 Bonding pad in semiconductor device |
| 04/04/2002 | WO2001078145A3 Boding pad in semiconductor device |
| 04/04/2002 | WO2001071799A3 Semiconductor element and method for producing the same |
| 04/04/2002 | WO2001067494A3 Precision electroplated solder bumps and method for manufacturing thereof |
| 04/04/2002 | WO2001056079A3 A method for transferring and stacking of semiconductor devices |
| 04/04/2002 | WO2001035463A3 Overvoltage protection arrangement |
| 04/04/2002 | US20020039854 IC socket |
| 04/04/2002 | US20020039847 Grid interposer |
| 04/04/2002 | US20020039840 Semiconductor device having a multilayered interconnection structure |
| 04/04/2002 | US20020039835 Method of depositing a conformal hydrogen-rich silicon nitride layer onto a patterned structure |
| 04/04/2002 | US20020039811 A method of manufacturing a semiconductor device |
| 04/04/2002 | US20020039808 Capable of meeting miniaturization and high integration |
| 04/04/2002 | US20020039807 Manufacturing method of a semiconductor device |
| 04/04/2002 | US20020039801 Semiconductor device and test method for manufacturing same |
| 04/04/2002 | US20020039650 Thickness of a monitor wafer is made smaller than a prescribed standard thickness with respect to the wafer diameter. |
| 04/04/2002 | US20020039644 Particularly, it relates to a printed wiring board for a very thin ball grid array type plastic package. |
| 04/04/2002 | US20020039542 Stress resistant alloy |
| 04/04/2002 | US20020039464 Optical reflective structures and method for making |
| 04/04/2002 | US20020039285 Device for reducing electromagnetic interference in a processor assembly |
| 04/04/2002 | US20020039282 Heat sink provided with coupling means, memory module attached with the heat sink and maunfacturing method thereof |
| 04/04/2002 | US20020039281 Electronic Component Cooling Apparatus |
| 04/04/2002 | US20020039280 Microfluidic devices for heat transfer |
| 04/04/2002 | US20020039279 Cooling unit for cooling a heat generating component and electronic apparatus having the cooling unit |
| 04/04/2002 | US20020038914 Semiconductor integrated circuit device |
| 04/04/2002 | US20020038913 Integrated circuit chip carrier assembly |
| 04/04/2002 | US20020038912 Semiconductor wafer, semiconductor device and manufacturing method therefor |
| 04/04/2002 | US20020038911 Surface modified interconnects |
| 04/04/2002 | US20020038910 Semiconductor device and method of manufacturing the same |
| 04/04/2002 | US20020038909 Semiconductor device and semiconductor device mounting interconnection board |
| 04/04/2002 | US20020038908 Thermal enhanced ball grid array package |
| 04/04/2002 | US20020038907 Semiconductor device |
| 04/04/2002 | US20020038906 Chip package capable of reducing moisture penetration |
| 04/04/2002 | US20020038905 Semiconductor device provided in thin package and method for manufacturing the same |
| 04/04/2002 | US20020038904 Area array type semiconductor package and fabrication method |
| 04/04/2002 | US20020038903 High density metal capacitor using dual-damascene copper interconnect |
| 04/04/2002 | US20020038902 IC chip and semiconductor device |
| 04/04/2002 | US20020038894 Fet whose source electrode overhangs gate electrode and its manufacture method |
| 04/04/2002 | US20020038890 Semiconductor device and method for manufacturing the same, semiconductor wafer and semiconductor device manufactured thereby |
| 04/04/2002 | US20020038873 Semiconductor device including intermediate wiring element |
| 04/04/2002 | US20020038779 Method for sorting integrated circuit devices |
| 04/04/2002 | US20020038726 Polymer stud grid array and method for producing such a polymer stud grid array |
| 04/04/2002 | US20020038724 Chip scale package, printed circuit board, and method of designing a piinted circuit board |
| 04/04/2002 | US20020038721 Wiring circuit board having bumps and method of producing same |
| 04/04/2002 | US20020038714 Method of making an integrated circuit package |
| 04/04/2002 | US20020038704 Carbon-carbon and/or metal-carbon fiber composite heat spreaders |
| 04/04/2002 | US20020038699 Cooling apparatus for electrronic devices |
| 04/04/2002 | US20020038664 Sealing composition for sealing solar cell, and solar cell module and building material-integral type solar cell module using said composition |