| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/11/2002 | US20020041009 Transmission line assembly chip and a manufacturing method thereof in a multi-chip module |
| 04/11/2002 | US20020041006 Multilayer electronic device |
| 04/11/2002 | US20020041002 Semiconductor raised source-drain structure |
| 04/11/2002 | US20020041001 Semiconductor raised source-drain structure |
| 04/11/2002 | US20020040990 Nonvolatile semiconductor memory device and nonvolatile semiconductor memory system |
| 04/11/2002 | US20020040988 Semiconductor device and method for the manufacture thereof |
| 04/11/2002 | US20020040986 Semiconductor device having a dummy pattern |
| 04/11/2002 | US20020040808 Method of making a gasket on a PCB and a PCB |
| 04/11/2002 | US20020040804 Electrically conductive wire |
| 04/11/2002 | US20020040801 Electronic packaging device and method |
| 04/11/2002 | US20020040800 Packaging structure of a chip |
| 04/11/2002 | US20020040760 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
| 04/11/2002 | DE10124141A1 Verbindungseinrichtung Connecting means |
| 04/11/2002 | DE10100844A1 Abschirmungsschaltung und integrierte Schaltung, in der die Abschirmungsschaltung verwendet wird Shielding circuit and integrated circuit in which the shield circuit is used |
| 04/11/2002 | DE10058078C1 Integrated circuit with analyzer protection has gaps left by first group of conducting tracks in wiring plane and filled by second group of conducting tracks provided for protection of IC |
| 04/11/2002 | DE10049723A1 Arrangement of active semiconductors for controlling an electric energy flux with heat dispersion |
| 04/11/2002 | DE10047213A1 Electric or electronic component e.g. for microelectronics, has electrically-conducting connection element between contact surface of component and section of contact path |
| 04/10/2002 | EP1195839A1 Waveguide coupler |
| 04/10/2002 | EP1195820A2 Integrated magnetoresistive circuit |
| 04/10/2002 | EP1195813A2 Semiconductor device, semiconductor module and hard disk |
| 04/10/2002 | EP1195812A2 Semiconductor device, semiconductor module and hard disk |
| 04/10/2002 | EP1195811A1 Semiconductor device |
| 04/10/2002 | EP1195810A1 Aluminum-silicon carbide semiconductor substrate and method for producing the same |
| 04/10/2002 | EP1195805A2 Heat radiation substrate and semiconductor module |
| 04/10/2002 | EP1195784A1 Laminated body, capacitor, electronic part, and method and device for manufacturing the laminated body, capacitor, and electronic part |
| 04/10/2002 | EP1195783A2 Multilayer electronic device |
| 04/10/2002 | EP1195746A2 Semiconductor device, semiconductor module and hard disk |
| 04/10/2002 | EP1195451A1 Method of decreasing the dielectric constant in a SiOC layer |
| 04/10/2002 | EP1195081A1 Transition between asymmetric stripline and microstrip in cavity |
| 04/10/2002 | EP1195079A1 An arrangement for mounting chips in multilayer printed circuit boards |
| 04/10/2002 | EP1194955A1 High-density electronic package, and method for making same |
| 04/10/2002 | EP1194953A1 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent |
| 04/10/2002 | EP1194886A1 Chip card with a flexible chip |
| 04/10/2002 | EP0915919B1 Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor |
| 04/10/2002 | EP0807318B1 Process for producing a glass-coated article and article produced thereby |
| 04/10/2002 | EP0754351B1 Integrated circuits with borderless vias |
| 04/10/2002 | CN2485798Y Fluid cooling radiator |
| 04/10/2002 | CN2485797Y Water cooling radiator for semiconductor |
| 04/10/2002 | CN2485796Y Quick attached/detached blades for fan |
| 04/10/2002 | CN2485795Y Radiator |
| 04/10/2002 | CN2485794Y Telescopic heat conducter |
| 04/10/2002 | CN2485793Y Separated fastener for radiator |
| 04/10/2002 | CN2485792Y Plastic package for communication element |
| 04/10/2002 | CN2485791Y No package chip substrate module |
| 04/10/2002 | CN1344426A Improved integrated oscillators and tuning circuits |
| 04/10/2002 | CN1344425A Lead frame moisture barrier for molded plastic electronic packages |
| 04/10/2002 | CN1344065A Piezoelectric device and its mfg. method |
| 04/10/2002 | CN1344036A Flat type LED and mfg. method thereof |
| 04/10/2002 | CN1344032A 半导体器件 Semiconductor devices |
| 04/10/2002 | CN1344026A 多芯片组件 Multi-chip module |
| 04/10/2002 | CN1344024A Lead frame and semiconductor pack having same and mfg. method of semiconductor pack |
| 04/10/2002 | CN1344023A Cooling appts. for boiling and condensing refrigerant |
| 04/10/2002 | CN1344022A Surface electrode structure on ceramic multilayer substrate and its mfg. method |
| 04/10/2002 | CN1344019A Method for forming end face electrode |
| 04/10/2002 | CN1344014A Semiconductor device and semiconductor assembly |
| 04/10/2002 | CN1082783C Multilayer printed circuit boards |
| 04/10/2002 | CN1082724C Radiator assembly and radiating method thereof |
| 04/10/2002 | CN1082721C Mfg. method of semiconductor device |
| 04/10/2002 | CN1082422C Process for mfg. resin-encapsulated electronic product |
| 04/09/2002 | USRE37637 Smart cards having thin die |
| 04/09/2002 | US6370680 Device to determine line edge roughness effect on device performance |
| 04/09/2002 | US6370032 Compliant microelectronic mounting device |
| 04/09/2002 | US6370027 Semiconductor module and heat sink used in such module |
| 04/09/2002 | US6370026 Mounting structure for mounting power elements to heat dissipation member |
| 04/09/2002 | US6370025 Electronic module |
| 04/09/2002 | US6370024 Heat sink clip |
| 04/09/2002 | US6370015 Laminated ceramic electronic device |
| 04/09/2002 | US6370013 Electric element incorporating wiring board |
| 04/09/2002 | US6370012 Capacitor laminate for use in printed circuit board and as an interconnector |
| 04/09/2002 | US6370010 Multi-layer capacitor, wiring board, and high-frequency circuit |
| 04/09/2002 | US6369678 RF assembly with ground-plane slot between components and method therefor |
| 04/09/2002 | US6369654 Semiconductor device |
| 04/09/2002 | US6369456 Semiconductor device and producing method thereof |
| 04/09/2002 | US6369455 Externally-embedded heat-dissipating device for ball grid array integrated circuit package |
| 04/09/2002 | US6369454 Semiconductor package and method for fabricating the same |
| 04/09/2002 | US6369453 Semiconductor wafer for measurement and recordation of impurities in semiconductor insulators |
| 04/09/2002 | US6369452 Cap attach surface modification for improved adhesion |
| 04/09/2002 | US6369451 Solder balls and columns with stratified underfills on substrate for flip chip joining |
| 04/09/2002 | US6369449 Method and apparatus for injection molded flip chip encapsulation |
| 04/09/2002 | US6369447 Plastic-packaged semiconductor device including a plurality of chips |
| 04/09/2002 | US6369446 Multilayered semiconductor device |
| 04/09/2002 | US6369445 Method and apparatus for edge connection between elements of an integrated circuit |
| 04/09/2002 | US6369443 Semiconductor device with stacked vias |
| 04/09/2002 | US6369442 Hydrogen getter for integrated microelectronic assembly |
| 04/09/2002 | US6369441 Method of producing a semiconductor chip having an underplate metal layer |
| 04/09/2002 | US6369440 Semiconductor substrate and manufacturing method thereof |
| 04/09/2002 | US6369439 Strip of semiconductor package |
| 04/09/2002 | US6369437 Vertical fuse structure for integrated circuits and a method of disconnecting the same |
| 04/09/2002 | US6369423 Semiconductor device with a thin gate stack having a plurality of insulating layers |
| 04/09/2002 | US6369411 Semiconductor device for controlling high-power electricity with improved heat dissipation |
| 04/09/2002 | US6369407 Semiconductor device |
| 04/09/2002 | US6369335 Mother substrate, substrate element and method for manufacturing the same |
| 04/09/2002 | US6369332 Metal-base multilayer circuit substrate with heat conducting adhesive |
| 04/09/2002 | US6369331 Printed circuit board for semiconductor package and method of making same |
| 04/09/2002 | US6369324 High-frequency input/output feedthrough and package for housing a high-frequency semiconductor element |
| 04/09/2002 | US6368980 Resist mark having measurement marks for measuring the accuracy of overlay of a photomask disposed on semiconductor wafer and method for manufacturing semiconductor wafer having it |
| 04/09/2002 | US6368972 Method for making an integrated circuit including alignment marks |
| 04/09/2002 | US6368966 Addition of zinc to copper in very low quantities assists in solving the diffusion and self-passivation problems, |
| 04/09/2002 | US6368961 Graded compound seed layers for semiconductors |
| 04/09/2002 | US6368959 Method of manufacturing semiconductor device |