Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2013
12/04/2013CN103426871A High-density hybrid stacked package structure and production method thereof
12/04/2013CN103426870A Semiconductor package and manufacturing method thereof
12/04/2013CN103426869A Stacking encapsulation part and manufacturing method thereof
12/04/2013CN103426868A Packaging structure and packaging method thereof
12/04/2013CN103426867A Conformal shielding and packaging assembly
12/04/2013CN103426866A Fence-interval design rule test circuit
12/04/2013CN103426865A Structure and method for testing contact resistance of W-sinks in semiconductor product
12/04/2013CN103426864A TSV structure applicable to adapter board and preparation method of TSV structure
12/04/2013CN103426863A Via structure for three-dimensional circuit integration and method for forming the same
12/04/2013CN103426862A Copper interconnect structure and formation method thereof
12/04/2013CN103426861A Reliable area joints for power semiconductors
12/04/2013CN103426860A Shielded coplanar line
12/04/2013CN103426859A Distributed active transformer, microelectronic element having transformer thereon, and method of making distributed active transformer
12/04/2013CN103426858A Package with metal-insulator-metal capacitor and method of manufacturing the same
12/04/2013CN103426857A Wafer level package resistance monitor scheme
12/04/2013CN103426856A Chip package and method for forming the same
12/04/2013CN103426855A Semiconductor package and fabrication method thereof
12/04/2013CN103426854A Heat radiation structure based on flexible substrate encapsulation and manufacturing technology thereof
12/04/2013CN103426853A Packaged circuit with lead frame and laminate substrate
12/04/2013CN103426852A Wiring member and semiconductor module having the same
12/04/2013CN103426851A Voltage regulator
12/04/2013CN103426850A Wafer-level chip size packaging structure
12/04/2013CN103426849A Three-dimensional chip stack and method of forming the same
12/04/2013CN103426848A Chip and manufacturing method thereof
12/04/2013CN103426847A Through-silicon via (TSV) semiconductor devices having via pad inlays
12/04/2013CN103426846A Wafer-level packaging mechanisms
12/04/2013CN103426845A Two-sided independent multi-pin self-locking circuit terminals
12/04/2013CN103426844A Broadband full-sealed package of microwave devices
12/04/2013CN103426843A Cooling fin for central processing unit (CPU)
12/04/2013CN103426842A Sheet structure, method of manufacturing sheet structure, and electronic device
12/04/2013CN103426841A Power semiconductor device cooling unit
12/04/2013CN103426840A Switching device with freewheel diode
12/04/2013CN103426839A 半导体封装 The semiconductor package
12/04/2013CN103426838A Chip package and method for forming the same
12/04/2013CN103426837A Semiconductor packages and methods of formation thereof
12/04/2013CN103426836A Sensing device package structure and method of fabricating the same
12/04/2013CN103426835A Semiconductor device and method of controlling warpage in semiconductor package
12/04/2013CN103426834A Pressure stabilizing device for electronic sealing device
12/04/2013CN103426833A Compression joint type power module
12/04/2013CN103426832A Chip package and method for forming the same
12/04/2013CN103426831A Seal rings in electrochemical processors
12/04/2013CN103426830A Flip-chip-bonded surface-mount shell structure based on low temperature co-fired ceramics
12/04/2013CN103426829A High-power ceramic-packaged IGBT (insulated gate bipolar transistor) efficient two-side-cooling integral tube shell
12/04/2013CN103426817A Semiconductor device and method of producing semiconductor device
12/04/2013CN103426816A Semiconductor reflow processing for high aspect ratio fill
12/04/2013CN103426815A Semiconductor reflow processing for feature fill
12/04/2013CN103426811A Semiconductor component manufacturing method and semiconductor component
12/04/2013CN103426780A Solder ball array used as height cushion block and solder fixture
12/04/2013CN103426779A Chip packages and methods for manufacturing a chip package
12/04/2013CN103426778A Tamper resistant IC (integrated circuit)
12/04/2013CN103426777A Method for manufacturing electronic component, and electronic apparatus
12/04/2013CN103426730A Method for improving Q value of inductor which is integrated passive device
12/04/2013CN103426729A Method for improving Q value of inductor which is integrated passive device
12/04/2013CN103426728A 电容器结构及其制作方法 Capacitor structure and manufacturing method thereof
12/04/2013CN103426727A Split-grid resistor structure and manufacturing method thereof
12/04/2013CN103421275A Epoxy resin composition used for electronic packaging and preparation method thereof
12/04/2013CN103421272A Epoxy resin composition used for electronic packaging and preparation method thereof
12/04/2013CN103420324A 混合集成的构件 Hybrid integrated components
12/04/2013CN102446895B Metal-oxide-metal capacitor and manufacturing method thereof
12/04/2013CN102446882B Semiconductor PiP (package in package) system structure and manufacturing method thereof
12/04/2013CN102420107B Copper Damascus process MIM (metal-insulator-metal) capacitor manufacturing process and structure
12/04/2013CN102356170B A method for the removal of hydrogen from a hydrogen sensitive device by means of a non-evaporable yttrium based getter alloy
12/04/2013CN102354689B Quad flat non-lead (QFN) package with leads arranged in plane array and manufacturing method
12/04/2013CN102299081B Method for manufacturing packaging substrate and packaging substrate
12/04/2013CN102237326B 半导体装置 Semiconductor device
12/04/2013CN102224579B Semiconductor device and electronic device
12/04/2013CN102224577B Composition for sealing semiconductor, semiconductor device, and process for manufacturing semiconductor device
12/04/2013CN102222657B Multi-ring-arranged double-integrated circuit (IC) chip packaging piece and production method thereof
12/04/2013CN102199404B Film-like circuit connecting material and connection structure for circuit member
12/04/2013CN102153957B Adhesive film, and connection structure and connecting method for circuit member
12/04/2013CN102130571B Power supply package and device thereof
12/04/2013CN102117789B Semiconductor chip packaging structure and packaging method
12/04/2013CN102067305B Concentric vias in electronic substrate
12/04/2013CN102017339B Substrate incorporating ESD protection function
12/04/2013CN101989739B Protective circuit
12/04/2013CN101986429B Chip package and forming method thereof
12/04/2013CN101847597B 集成电路结构 Integrated circuit structure
12/04/2013CN101841988B Fastener
12/04/2013CN101814911B Semiconductor component and method of determining temperature
12/03/2013US8601332 Systems and methods for monitoring a memory system
12/03/2013US8599596 Semiconductor device
12/03/2013US8599571 Memory card
12/03/2013US8598719 Semiconductor element mounting board
12/03/2013US8598718 Three-dimensional multichip module
12/03/2013US8598717 Semiconductor device and method for manufacturing the same
12/03/2013US8598716 Semiconductor apparatus having stacked semiconductor components
12/03/2013US8598715 Bump-on-trace structures in packaging
12/03/2013US8598714 Semiconductor device comprising through hole vias having a stress relaxation mechanism
12/03/2013US8598713 Deep silicon via for grounding of circuits and devices, emitter ballasting and isolation
12/03/2013US8598712 Semiconductor structure formed by double patterning technique
12/03/2013US8598711 Semiconductor device and method for forming the same
12/03/2013US8598710 Semiconductor device with dummy contacts
12/03/2013US8598709 Method and system for routing electrical connections of semiconductor chips
12/03/2013US8598708 Carbon nanotube-based interconnection element
12/03/2013US8598707 Solder alloy and semiconductor device
12/03/2013US8598705 Composite substrate for a semiconductor chip
12/03/2013US8598704 Semiconductor device
12/03/2013US8598703 Semiconductor device
12/03/2013US8598702 Semiconductor package
12/03/2013US8598701 Semiconductor device