Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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12/04/2013 | CN103426871A High-density hybrid stacked package structure and production method thereof |
12/04/2013 | CN103426870A Semiconductor package and manufacturing method thereof |
12/04/2013 | CN103426869A Stacking encapsulation part and manufacturing method thereof |
12/04/2013 | CN103426868A Packaging structure and packaging method thereof |
12/04/2013 | CN103426867A Conformal shielding and packaging assembly |
12/04/2013 | CN103426866A Fence-interval design rule test circuit |
12/04/2013 | CN103426865A Structure and method for testing contact resistance of W-sinks in semiconductor product |
12/04/2013 | CN103426864A TSV structure applicable to adapter board and preparation method of TSV structure |
12/04/2013 | CN103426863A Via structure for three-dimensional circuit integration and method for forming the same |
12/04/2013 | CN103426862A Copper interconnect structure and formation method thereof |
12/04/2013 | CN103426861A Reliable area joints for power semiconductors |
12/04/2013 | CN103426860A Shielded coplanar line |
12/04/2013 | CN103426859A Distributed active transformer, microelectronic element having transformer thereon, and method of making distributed active transformer |
12/04/2013 | CN103426858A Package with metal-insulator-metal capacitor and method of manufacturing the same |
12/04/2013 | CN103426857A Wafer level package resistance monitor scheme |
12/04/2013 | CN103426856A Chip package and method for forming the same |
12/04/2013 | CN103426855A Semiconductor package and fabrication method thereof |
12/04/2013 | CN103426854A Heat radiation structure based on flexible substrate encapsulation and manufacturing technology thereof |
12/04/2013 | CN103426853A Packaged circuit with lead frame and laminate substrate |
12/04/2013 | CN103426852A Wiring member and semiconductor module having the same |
12/04/2013 | CN103426851A Voltage regulator |
12/04/2013 | CN103426850A Wafer-level chip size packaging structure |
12/04/2013 | CN103426849A Three-dimensional chip stack and method of forming the same |
12/04/2013 | CN103426848A Chip and manufacturing method thereof |
12/04/2013 | CN103426847A Through-silicon via (TSV) semiconductor devices having via pad inlays |
12/04/2013 | CN103426846A Wafer-level packaging mechanisms |
12/04/2013 | CN103426845A Two-sided independent multi-pin self-locking circuit terminals |
12/04/2013 | CN103426844A Broadband full-sealed package of microwave devices |
12/04/2013 | CN103426843A Cooling fin for central processing unit (CPU) |
12/04/2013 | CN103426842A Sheet structure, method of manufacturing sheet structure, and electronic device |
12/04/2013 | CN103426841A Power semiconductor device cooling unit |
12/04/2013 | CN103426840A Switching device with freewheel diode |
12/04/2013 | CN103426839A 半导体封装 The semiconductor package |
12/04/2013 | CN103426838A Chip package and method for forming the same |
12/04/2013 | CN103426837A Semiconductor packages and methods of formation thereof |
12/04/2013 | CN103426836A Sensing device package structure and method of fabricating the same |
12/04/2013 | CN103426835A Semiconductor device and method of controlling warpage in semiconductor package |
12/04/2013 | CN103426834A Pressure stabilizing device for electronic sealing device |
12/04/2013 | CN103426833A Compression joint type power module |
12/04/2013 | CN103426832A Chip package and method for forming the same |
12/04/2013 | CN103426831A Seal rings in electrochemical processors |
12/04/2013 | CN103426830A Flip-chip-bonded surface-mount shell structure based on low temperature co-fired ceramics |
12/04/2013 | CN103426829A High-power ceramic-packaged IGBT (insulated gate bipolar transistor) efficient two-side-cooling integral tube shell |
12/04/2013 | CN103426817A Semiconductor device and method of producing semiconductor device |
12/04/2013 | CN103426816A Semiconductor reflow processing for high aspect ratio fill |
12/04/2013 | CN103426815A Semiconductor reflow processing for feature fill |
12/04/2013 | CN103426811A Semiconductor component manufacturing method and semiconductor component |
12/04/2013 | CN103426780A Solder ball array used as height cushion block and solder fixture |
12/04/2013 | CN103426779A Chip packages and methods for manufacturing a chip package |
12/04/2013 | CN103426778A Tamper resistant IC (integrated circuit) |
12/04/2013 | CN103426777A Method for manufacturing electronic component, and electronic apparatus |
12/04/2013 | CN103426730A Method for improving Q value of inductor which is integrated passive device |
12/04/2013 | CN103426729A Method for improving Q value of inductor which is integrated passive device |
12/04/2013 | CN103426728A 电容器结构及其制作方法 Capacitor structure and manufacturing method thereof |
12/04/2013 | CN103426727A Split-grid resistor structure and manufacturing method thereof |
12/04/2013 | CN103421275A Epoxy resin composition used for electronic packaging and preparation method thereof |
12/04/2013 | CN103421272A Epoxy resin composition used for electronic packaging and preparation method thereof |
12/04/2013 | CN103420324A 混合集成的构件 Hybrid integrated components |
12/04/2013 | CN102446895B Metal-oxide-metal capacitor and manufacturing method thereof |
12/04/2013 | CN102446882B Semiconductor PiP (package in package) system structure and manufacturing method thereof |
12/04/2013 | CN102420107B Copper Damascus process MIM (metal-insulator-metal) capacitor manufacturing process and structure |
12/04/2013 | CN102356170B A method for the removal of hydrogen from a hydrogen sensitive device by means of a non-evaporable yttrium based getter alloy |
12/04/2013 | CN102354689B Quad flat non-lead (QFN) package with leads arranged in plane array and manufacturing method |
12/04/2013 | CN102299081B Method for manufacturing packaging substrate and packaging substrate |
12/04/2013 | CN102237326B 半导体装置 Semiconductor device |
12/04/2013 | CN102224579B Semiconductor device and electronic device |
12/04/2013 | CN102224577B Composition for sealing semiconductor, semiconductor device, and process for manufacturing semiconductor device |
12/04/2013 | CN102222657B Multi-ring-arranged double-integrated circuit (IC) chip packaging piece and production method thereof |
12/04/2013 | CN102199404B Film-like circuit connecting material and connection structure for circuit member |
12/04/2013 | CN102153957B Adhesive film, and connection structure and connecting method for circuit member |
12/04/2013 | CN102130571B Power supply package and device thereof |
12/04/2013 | CN102117789B Semiconductor chip packaging structure and packaging method |
12/04/2013 | CN102067305B Concentric vias in electronic substrate |
12/04/2013 | CN102017339B Substrate incorporating ESD protection function |
12/04/2013 | CN101989739B Protective circuit |
12/04/2013 | CN101986429B Chip package and forming method thereof |
12/04/2013 | CN101847597B 集成电路结构 Integrated circuit structure |
12/04/2013 | CN101841988B Fastener |
12/04/2013 | CN101814911B Semiconductor component and method of determining temperature |
12/03/2013 | US8601332 Systems and methods for monitoring a memory system |
12/03/2013 | US8599596 Semiconductor device |
12/03/2013 | US8599571 Memory card |
12/03/2013 | US8598719 Semiconductor element mounting board |
12/03/2013 | US8598718 Three-dimensional multichip module |
12/03/2013 | US8598717 Semiconductor device and method for manufacturing the same |
12/03/2013 | US8598716 Semiconductor apparatus having stacked semiconductor components |
12/03/2013 | US8598715 Bump-on-trace structures in packaging |
12/03/2013 | US8598714 Semiconductor device comprising through hole vias having a stress relaxation mechanism |
12/03/2013 | US8598713 Deep silicon via for grounding of circuits and devices, emitter ballasting and isolation |
12/03/2013 | US8598712 Semiconductor structure formed by double patterning technique |
12/03/2013 | US8598711 Semiconductor device and method for forming the same |
12/03/2013 | US8598710 Semiconductor device with dummy contacts |
12/03/2013 | US8598709 Method and system for routing electrical connections of semiconductor chips |
12/03/2013 | US8598708 Carbon nanotube-based interconnection element |
12/03/2013 | US8598707 Solder alloy and semiconductor device |
12/03/2013 | US8598705 Composite substrate for a semiconductor chip |
12/03/2013 | US8598704 Semiconductor device |
12/03/2013 | US8598703 Semiconductor device |
12/03/2013 | US8598702 Semiconductor package |
12/03/2013 | US8598701 Semiconductor device |