| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/17/2015 | US8955217 Method for edge sealing barrier films |
| 02/17/2015 | US8955216 Method of making a compliant printed circuit peripheral lead semiconductor package |
| 02/12/2015 | WO2015021277A2 Microelectronic package with integrated bearing surfaces |
| 02/12/2015 | WO2015021265A2 Embedded packaging with preformed vias |
| 02/12/2015 | WO2015021264A1 Micro mechanical anchor for 3d architecture |
| 02/12/2015 | WO2015021194A2 Ultra high performance interposer |
| 02/12/2015 | WO2015021184A1 High voltage hybrid polymeric-ceramic dielectric capacitor |
| 02/12/2015 | WO2015021160A1 Method to enhance reliability of through mold via package on package assemblies |
| 02/12/2015 | WO2015020856A1 Stacked redistribution layers on die |
| 02/12/2015 | WO2015019931A1 Solid state image pickup device and image pickup device |
| 02/12/2015 | WO2015019890A1 Heat sink, power module, and method for manufacturing heat sink |
| 02/12/2015 | WO2015019846A1 Resin sheet for hollow electronic device encapsulation and method for manufacturing hollow electronic device package |
| 02/12/2015 | WO2015019817A1 Method for producing semiconductor package |
| 02/12/2015 | WO2015019816A1 Method for producing semiconductor package |
| 02/12/2015 | WO2015019770A1 Resin sheet for sealing electronic device, and method for manufacturing electronic device package |
| 02/12/2015 | WO2015019769A1 Resin sheet for electronic device encapsulation and method for manufacturing electronic device package |
| 02/12/2015 | WO2015019767A1 Curing resin composition and semiconductor device employing same |
| 02/12/2015 | WO2015019763A1 Group of separator-provided electronic-device-sealing resin sheets, and method for selecting separator-provided electronic-device-sealing resin sheet |
| 02/12/2015 | WO2015019717A1 Method for producing metal oxide film and method for producing transistor |
| 02/12/2015 | WO2015019705A1 Curable resin composition |
| 02/12/2015 | WO2015019602A1 Circuit substrate and semiconductor device |
| 02/12/2015 | WO2015018843A1 Optoelectronic component and method for the production thereof |
| 02/12/2015 | WO2015018784A1 Process for manufacturing a semiconductor structure with temporary bonding via metal layers |
| 02/12/2015 | WO2015018721A1 Power electronic circuit having planar electrical contacting |
| 02/12/2015 | WO2015018310A1 High-resistivity material-based packaging element for electric field sensor |
| 02/12/2015 | WO2015018174A1 First-etched and later-packaged three-dimensional system-in- package normal chip stack package structure and processing method thereof |
| 02/12/2015 | WO2015018173A1 First-packaged and later-etched normal chip three dimension system-in-package metal circuit board structure and processing method thereof |
| 02/12/2015 | WO2015018145A1 Packaging-before-etching flip chip 3d system-level metal circuit board structure and technique thereof |
| 02/12/2015 | WO2015018144A1 Etching-before-packaging horizontal chip 3d system-level metal circuit board structure and technique thereof |
| 02/12/2015 | WO2015018143A1 Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological method |
| 02/12/2015 | WO2015017988A1 Crimping power module |
| 02/12/2015 | WO2015017959A1 First-packaged and later-etched three-dimensional flip-chip system-in-package structure and processing method therefor |
| 02/12/2015 | WO2014203955A9 Insulating and heat-conductive sheet |
| 02/12/2015 | US20150045487 Method of preparing a curable polyorganosiloxane composition |
| 02/12/2015 | US20150044870 Method of manufacturing a semiconductor device using a self-aligned opl replacement contact and patterned hsq and a semiconductor device formed by same |
| 02/12/2015 | US20150044867 Barrier Layer for Copper Interconnect |
| 02/12/2015 | US20150044864 Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip |
| 02/12/2015 | US20150044863 Systems and methods to fabricate a radio frequency integrated circuit |
| 02/12/2015 | US20150044862 Phase changing on-chip thermal heat sink |
| 02/12/2015 | US20150044854 Semiconductor device and method of fabricating the same |
| 02/12/2015 | US20150044832 Resistive random access memory |
| 02/12/2015 | US20150044824 Fan-Out WLP With Package |
| 02/12/2015 | US20150044822 Circuit module and method of producing circuit module |
| 02/12/2015 | US20150044821 Method for fabricating multi-chip stack structure |
| 02/12/2015 | US20150044820 Method of fabricating low cte interposer without tsv structure |
| 02/12/2015 | US20150044819 Packaging Methods and Structures for Semiconductor Devices |
| 02/12/2015 | US20150044794 Semiconductor light-emitting device and method for forming the same |
| 02/12/2015 | US20150044787 Semiconductor test and monitoring structure to detect boundaries of safe effective modulus |
| 02/12/2015 | US20150044786 Alignment Systems and Wafer Bonding Systems and Methods |
| 02/12/2015 | US20150043167 Heat sinks with interdigitated heat pipes |
| 02/12/2015 | US20150042384 Packaged power transistors and power packages |
| 02/12/2015 | US20150041995 Chip package and fabrication method thereof |
| 02/12/2015 | US20150041994 Semiconductor package having recessed solder terminals |
| 02/12/2015 | US20150041993 Method for manufacturing a chip arrangement, and a chip arrangement |
| 02/12/2015 | US20150041992 Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus |
| 02/12/2015 | US20150041990 Wiring substrate and manufacturing method therefor |
| 02/12/2015 | US20150041989 Semiconductor appratus and semiconductor system using the same |
| 02/12/2015 | US20150041988 Ultra high performance interposer |
| 02/12/2015 | US20150041987 3D Packages and Methods for Forming the Same |
| 02/12/2015 | US20150041986 Manufacturing method of a semiconductor device and method for creating a layout thereof |
| 02/12/2015 | US20150041985 Semiconductor Device and Method of Making Wafer Level Chip Scale Package |
| 02/12/2015 | US20150041984 Electronic Component and Method |
| 02/12/2015 | US20150041983 Semiconductor-device manufacturing method and semiconductor device |
| 02/12/2015 | US20150041982 Stacked redistribution layers on die |
| 02/12/2015 | US20150041981 Semiconductor interconnect structure having a graphene-based barrier metal layer |
| 02/12/2015 | US20150041980 Semiconductor Package with Reduced Thickness |
| 02/12/2015 | US20150041979 Method to enhance reliability of through mold via tmva part on part pop devices |
| 02/12/2015 | US20150041978 Semiconductor device |
| 02/12/2015 | US20150041977 Structures and methods for improving solder bump connections in semiconductor devices |
| 02/12/2015 | US20150041976 Semiconductor device sealed in a resin section and method for manufacturing the same |
| 02/12/2015 | US20150041975 Semiconductor package and fabricating method thereof |
| 02/12/2015 | US20150041974 Sintered body of silver fine particle |
| 02/12/2015 | US20150041973 Semiconductor devices including unitary supports |
| 02/12/2015 | US20150041972 Semiconductor package and fabrication method thereof |
| 02/12/2015 | US20150041971 Stacked semiconductor apparatus |
| 02/12/2015 | US20150041970 Semiconductor device |
| 02/12/2015 | US20150041969 Semiconductor package and fabrication method thereof |
| 02/12/2015 | US20150041968 Image forming apparatus, chip, and chip package |
| 02/12/2015 | US20150041967 Molded Semiconductor Package with Backside Die Metallization |
| 02/12/2015 | US20150041964 Apparatus and Methods for Low K Dielectric Layers |
| 02/12/2015 | US20150041961 Through silicon via structure |
| 02/12/2015 | US20150041960 Semiconductor device and method for manufacturing the same |
| 02/12/2015 | US20150041955 Multi-Die Fine Grain Integrated Voltage Regulation |
| 02/12/2015 | US20150041952 Semiconductor structure |
| 02/12/2015 | US20150041951 Electronic fuse vias in interconnect structures |
| 02/12/2015 | US20150041950 Conductor with sub-lithographic self-aligned 3d confinement |
| 02/12/2015 | US20150041944 Image sensor, fabricating method thereof, and device comprising the image sensor |
| 02/12/2015 | US20150041919 Semiconductor device |
| 02/12/2015 | US20150041914 Matching techniques for wide-bandgap power transistors |
| 02/12/2015 | US20150041861 Iii-n device structures and methods |
| 02/12/2015 | US20150041859 Redistribution Board, Electronic Component and Module |
| 02/12/2015 | US20150041827 Bonding structure including metal nano particles and bonding method using metal nano particles |
| 02/12/2015 | US20150041525 Method for manufacturing semiconductor device, heat insulating load jig, and method for setting up heat insulating load jig |
| 02/12/2015 | US20150041208 Micro mechanical anchor for 3d architecture |
| 02/12/2015 | US20150041204 Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods |
| 02/12/2015 | DE112011102577B4 Integriertes Schaltungsmodul mit elektrochemischer Leistungsversorgung, Computersystem, aufweisend integriertes Schaltungsmodul mit elektrochemischer Leistungsversorgung und Verfahren zum Betreiben desselben Of the same integrated circuit module having electrochemical power supply, computer system comprising an integrated circuit module having electrochemical power supply and method of operating |
| 02/12/2015 | DE102014213541A1 Halbleitervorrichtung Semiconductor device |
| 02/12/2015 | DE102014111439A1 Elektronikmodul und Verfahren zu dessen Herstellung Electronic module and method for its production |
| 02/12/2015 | DE102014111438A1 Gekapselte Leistungstransistoren und Leistungsbausteine Encapsulated power transistors and power devices |
| 02/12/2015 | DE102014111420A1 Gemoldetes Halbleitergehäuse mit Rückseitennacktchipmetallisierung Gemoldetes semiconductor package with Rückseitennacktchipmetallisierung |