Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2002
04/16/2002US6372670 Method and apparatus for forming an interlayer insulating film, and semiconductor device
04/16/2002US6372652 Method for forming a thin-film, electrically blowable fuse with a reproducible blowing wattage
04/16/2002US6372641 Method of forming self-aligned via structure
04/16/2002US6372637 Method for making semiconductor devices having gradual slope contacts
04/16/2002US6372630 Semiconductor device and fabrication method thereof
04/16/2002US6372628 Insulating film comprising amorphous carbon fluoride, a semiconductor device comprising such an insulating film, and a method for manufacturing the semiconductor device
04/16/2002US6372626 Method of reducing step heights in integrated circuits by using dummy conductive lines, and integrated circuits fabricated thereby
04/16/2002US6372625 Semiconductor device having bonding wire spaced from semiconductor chip
04/16/2002US6372623 Semiconductor device and method of fabrication
04/16/2002US6372622 Fine pitch bumping with improved device standoff and bump volume
04/16/2002US6372621 Method of forming a bonding pad on a semiconductor chip
04/16/2002US6372619 Method for fabricating wafer level chip scale package with discrete package encapsulation
04/16/2002US6372600 Etch stops and alignment marks for bonded wafers
04/16/2002US6372586 Method for LDMOS transistor with thick copper interconnect
04/16/2002US6372562 Method of producing a semiconductor device
04/16/2002US6372556 Semiconductor device having a fuse and fabricating method therefor
04/16/2002US6372555 Semiconductor integrated circuit device and method of manufacturing the same
04/16/2002US6372554 Semiconductor integrated circuit device and method for production of the same
04/16/2002US6372553 Disposable mold runner gate for substrate based electronic packages
04/16/2002US6372552 Semiconductor device, ball grid array connection system, and method of making
04/16/2002US6372551 Method of manufacturing an image-sensor integrated circuit package without resin flash on lead frame and with increased wire bondability
04/16/2002US6372550 Semiconductor device and method for manufacturing same
04/16/2002US6372549 Semiconductor package and semiconductor package fabrication method
04/16/2002US6372548 Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrate
04/16/2002US6372547 Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board
04/16/2002US6372546 Method of producing semiconductor device and configuration thereof, and lead frame used in said method
04/16/2002US6372543 Wrap-around interconnect for fine pitch ball grid array
04/16/2002US6372540 Moisture-resistant integrated circuit chip package and method
04/16/2002US6372539 Leadless packaging process using a conductive substrate
04/16/2002US6372527 Methods of making semiconductor chip assemblies
04/16/2002US6372526 Method of manufacturing semiconductor components
04/16/2002US6372525 Wafer-level antenna effect detection pattern for VLSI
04/16/2002US6372522 Use of optimized film stacks for increasing absorption for laser repair of fuse links
04/16/2002US6372409 Bonds pads equipped with heat dissipating rings and method for forming
04/16/2002US6372351 Laser markability, electrical properties, moldability, reliability and package surface appearance
04/16/2002US6372337 Mixture of aluminum in oil
04/16/2002US6372301 Method of improving adhesion of diffusion layers on fluorinated silicon dioxide
04/16/2002US6372291 In situ deposition and integration of silicon nitride in a high density plasma reactor
04/16/2002US6372114 Method of forming a semiconductor device
04/16/2002US6372081 Process to prevent copper contamination of semiconductor fabs
04/16/2002US6372080 Process for fabricating a crack resistant resin encapsulated semiconductor chip package
04/16/2002US6372044 Method for dispensing a liquid
04/16/2002US6371782 Sliding contact for electrical connections
04/16/2002US6370774 Radiator with thin fins and method for producing the same
04/16/2002CA2258388C Surface processing of thin film cvd diamond coatings for improved resistive properties and integrated circuit packages incorporating processed coatings
04/11/2002WO2002029892A2 High-density metal capacitor using dual-damascene copper interconnect
04/11/2002WO2002029125A1 High purity zirconium or hafnium, sputtering target comprising the high purity zirconium or hafnium and thin film formed using the target, and method for producing high purity zirconium or hafnium and method for producing powder of high purity zirconium or hafnium
04/11/2002WO2002028940A1 Polyphenol resin, process for its production, epoxy resin composition and its use
04/11/2002WO2002028574A1 Functional alloy particles
04/11/2002WO2002017698A8 Distributed thermal management system for electronic components
04/11/2002WO2002005317A3 Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures
04/11/2002WO2002003423A8 Capacitor and capacitor contact process for stack capacitor drams
04/11/2002WO2001093330A3 Electronic device and method using crystalline, conductive regions and amorphous, insulating regions of a layer
04/11/2002WO2001084627A3 Electronic devices with diffusion barrier and process for making same
04/11/2002WO2001071773A3 Method and device for connecting at least one chip to a rewiring arrangement
04/11/2002WO2001045166A3 Encasing arrangement for a semiconductor component
04/11/2002US20020042218 Automotive bridge rectifier assembly with thermal protection
04/11/2002US20020042210 Ionic additives for extreme low dielectric constant chemical formulations
04/11/2002US20020042209 Method of manufacturing semiconductor device prevented from peeling of wirings from insulating film
04/11/2002US20020042196 Method of manufacturing a semiconductor device using anti-reflective layer and self-aligned contact technique and semiconductor device manufactured thereby
04/11/2002US20020042195 Electrostatic discharge-protection semiconductor device
04/11/2002US20020042193 Fabrication method of semiconductor integrated circuit device
04/11/2002US20020042188 Semiconductor raised source-drain structure
04/11/2002US20020042186 Method of filling gaps on a semiconductor wafer
04/11/2002US20020042164 Electronic device assembly and a method of connecting electronic devices constituting the same
04/11/2002US20020042163 Stacked semiconductor package and fabricating method thereof
04/11/2002US20020042160 Method of making a cavity ball grid array apparatus
04/11/2002US20020042153 Method for determining the internal orientation of a wafer
04/11/2002US20020041959 High thermal conductivity composite material, and method for producing the same
04/11/2002US20020041489 Semiconductor package with stress inhibiting intermediate mounting substrate
04/11/2002US20020041488 Heat sink and power source unit employing the same
04/11/2002US20020041487 Method of manufacturing a U-shaped heat sink assembly
04/11/2002US20020041486 Apparatus and system for cooling electronic circuitry, heat sinks, and related components
04/11/2002US20020041476 Automotive bridge rectifier assembly with thermal protection
04/11/2002US20020041216 Method and apparatus for synthesizing dual band high-frequency signals for wireless communications
04/11/2002US20020041039 Semiconductor device without use of chip carrier and method for making the same
04/11/2002US20020041038 Semiconductor device and manufacturing method thereof
04/11/2002US20020041037 Semiconductor device and process of producing same
04/11/2002US20020041036 Microelectronic assemblies with composite conductive elements
04/11/2002US20020041035 Semiconductor device fabrication method for interconnects that suppresses loss of interconnect metal
04/11/2002US20020041034 Interconnections for a semiconductor device and method for forming same
04/11/2002US20020041033 Semiconductor device and method of production of same
04/11/2002US20020041031 Silicon nitride film, semiconductor device, and method for fabricating semiconductor device
04/11/2002US20020041030 Semiconductor device for suppressing detachment of conductive layer and method for manufacturing the semiconductor device
04/11/2002US20020041028 Method for forming damascene interconnection of semiconductor device and damascene interconnection fabricated thereby
04/11/2002US20020041027 Semiconductor device
04/11/2002US20020041026 Method and apparatus for routing die interconnections using intermediate connection elements secured to the die face
04/11/2002US20020041025 Semiconductor device and method of manufacturing the same
04/11/2002US20020041023 Semiconductor device, semiconductor module and hard disk
04/11/2002US20020041022 Radiation substrate and semiconductor module
04/11/2002US20020041021 Semiconductor device, semiconductor module and hard disk
04/11/2002US20020041019 Semiconductor package having implantable conductive lands and method for manufacturing the same
04/11/2002US20020041018 Semiconductor chip package and manufacturing method thereof
04/11/2002US20020041017 Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them
04/11/2002US20020041016 Semiconductor device and manufacturing method thereof
04/11/2002US20020041014 Semiconductor component having a chip carrier with openings for making contact
04/11/2002US20020041013 Semiconductor device
04/11/2002US20020041012 Semiconductor device, semiconductor module and hard disk
04/11/2002US20020041011 Semiconductor device
04/11/2002US20020041010 Semiconductor device and lead frame used therefor