| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/18/2002 | US20020043090 Method of forming a package for electronic parts |
| 04/18/2002 | US20020042995 Thermally conductive material and method of using the same |
| 04/18/2002 | DE3828700C2 Kupferplattierter Leiterrahmen für Halbleiter-Kunststoff-Gehäuse Copper-lead frame for semiconductor plastic housing |
| 04/18/2002 | DE10138711A1 Electrical sub-assembly includes components coupled to different regions of casing for thermal dissipation, which are thermally-isolated from each other |
| 04/18/2002 | DE10125004A1 Halbleiter-Bauelement Semiconductor component |
| 04/18/2002 | DE10104221A1 Interference-radiation protected semiconductor component, such as magnetic memory devices, esp. MRAMs, uses covering hood on main face of leadframe to surround integrated circuit |
| 04/18/2002 | DE10101948A1 Verfahren zum Anordnen eines Halbleiterchips auf einem Substrat und auf einem Substrat montierbarer Halbleiterbaustein A method for disposing a semiconductor chip on a substrate and on a substrate mountable semiconductor module |
| 04/18/2002 | DE10051338A1 Liquid-cooling device for high-power semiconductor module, has housing with cooling surface and enclosing a liquid-flowed space |
| 04/18/2002 | DE10049288A1 Elektronische Bauteile und eine Folienband zum Verpacken von Bonddrahtverbindungen elektronischer Bauteile sowie deren Herstellungsverfahren Electronic components and foil tape for packing bonding wire connections of electronic components as well as their method of preparation |
| 04/18/2002 | DE10048859A1 Pressure contact arrangement, is designed for uniform pressure distribution when holding electronic component between contact surfaces |
| 04/18/2002 | DE10048436A1 Electronic switch for heavy currents at high voltage and low temperatures comprises parallel FET power semiconductors between pressure plates |
| 04/18/2002 | DE10047897A1 Electronic subassembly e.g. for SMD-components, has metal bridges/webs embedded in electrically-insulating material of assembly board |
| 04/18/2002 | DE10043215C1 Verfahren zur Herstellung einer Antifuse, Antifuse zur selektiven elektrischen Verbindung von benachbarten leitenden Bereichen und integrierte Schaltung mit einer Antifuse A process for producing an antifuse, an antifuse for the selective electrical connection of adjacent conductive regions and integrated circuit having an antifuse |
| 04/18/2002 | DE10042235A1 Verfahren zur Herstellung einer elektrisch leitenden Verbindung A process for producing an electrically conductive connection |
| 04/18/2002 | DE10029630C2 Vorrichtung zum Schutz von elektronischen Baugruppen gegen Zerstörung durch elektrostatische Entladung Device for protecting electronic components against damage caused by electrostatic discharge |
| 04/18/2002 | DE10028145C2 Integrierte Schaltungsanordnung zum Testen von Transistoren und Halbleiterscheibe mit einer solchen Schaltungsanordnung An integrated circuit device for testing transistors and semiconductor wafer having a circuit arrangement |
| 04/18/2002 | DE10006764C1 Electrical connector has contact layer with rare metal on ceramic substrate, with thickness of contact layer being less than that of conductor, which has layers of different thickness and resistivity |
| 04/17/2002 | EP1198164A1 A method of making a gasket on a PCB and a PCB. |
| 04/17/2002 | EP1198006A2 Compound semiconductor device and method for manufacturing |
| 04/17/2002 | EP1198005A1 Semiconductor module and method of mounting |
| 04/17/2002 | EP1198004A2 Semiconductor device having power distribution lines thereon |
| 04/17/2002 | EP1198003A1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
| 04/17/2002 | EP1198002A2 Electric or Electronic Component and Method of Manufacturing the Same |
| 04/17/2002 | EP1198001A2 Method of testing and mounting devices using a resilient contact structure |
| 04/17/2002 | EP1198000A1 Semiconductor device and assembly board |
| 04/17/2002 | EP1197972A1 Heat-softening heat-radiation sheet |
| 04/17/2002 | EP1197586A2 Electrolyte |
| 04/17/2002 | EP1197517A1 Crosslinkable elastomer composition and formed article prepared from said composition |
| 04/17/2002 | EP1197514A1 Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board |
| 04/17/2002 | EP1197130A1 Circuitry with integrated passive components and method for producing same |
| 04/17/2002 | EP1196948A2 Process for designing a mask |
| 04/17/2002 | EP1196946A1 Fabrication process for dishing-free cu damascene structures |
| 04/17/2002 | EP1196820A2 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 04/17/2002 | EP1196800A1 Optomodule |
| 04/17/2002 | EP1196485A1 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
| 04/17/2002 | EP1050078B1 Microsystem and method for the production thereof |
| 04/17/2002 | EP0933802B1 Process for the production of semiconductor device |
| 04/17/2002 | EP0804313B1 Method and cutting insert for threading |
| 04/17/2002 | EP0792408A4 Downhole system for extending the life span of electronic components |
| 04/17/2002 | EP0735152B1 Molybdenum-tungsten material for wiring, molybdenum-tungsten target for wiring, process for producing the same, and molybdenum-tungsten wiring thin film |
| 04/17/2002 | EP0539384B1 Process for producing a marker indicating the orientation of the crystal lattice of a wafer |
| 04/17/2002 | CN2487112Y Improved structure of radiator fin fixing base clip |
| 04/17/2002 | CN2487111Y Radiator fin |
| 04/17/2002 | CN2487110Y Group buckle device for radiator |
| 04/17/2002 | CN2487109Y Semiconductor package device |
| 04/17/2002 | CN1345527A Cooler for electronic devices |
| 04/17/2002 | CN1345467A Heat sink material and method of manufacturing the heat sink material |
| 04/17/2002 | CN1345176A Manufacture of modular board |
| 04/17/2002 | CN1345087A Contact component and its manufacture and probe contact assembly using the contact component |
| 04/17/2002 | CN1345083A Semiconductor device and its manufacture |
| 04/17/2002 | CN1083156C Method for munufacture of semiconductor device and apparatus for same |
| 04/17/2002 | CN1083155C Method of bulging substrate by holding soldering paste stacking |
| 04/17/2002 | CN1083152C Method for mfg. of semiconductor device |
| 04/17/2002 | CN1083115C Castable composition and rough dielectric sheet |
| 04/17/2002 | CN1082938C Highly heat-conductive silicon nitride sinter, and using the same and pressure-welded structure |
| 04/17/2002 | CA2343486A1 Method of preparing thermally conductive compounds by liquid metal bridged particle clusters |
| 04/16/2002 | US6374391 Method for estimating parasitic capacitance coupled to signal line longer than critical length at high-speed |
| 04/16/2002 | US6373740 Transmission lines for CMOS integrated circuits |
| 04/16/2002 | US6373719 Over-voltage protection for electronic circuits |
| 04/16/2002 | US6373717 Electronic package with high density interconnect layer |
| 04/16/2002 | US6373705 Electronic semiconductor module |
| 04/16/2002 | US6373704 Clip for heat dissipation device |
| 04/16/2002 | US6373703 Integral design features for heatsink attach for electronic packages |
| 04/16/2002 | US6373701 Heat dissipation assembly |
| 04/16/2002 | US6373700 Heat sink modular structure inside an electronic product |
| 04/16/2002 | US6373699 Heat dissipation device |
| 04/16/2002 | US6373673 Multi-functional energy conditioner |
| 04/16/2002 | US6373576 Method for measuring concentrations of dopants in a liquid carrier on a wafer surface |
| 04/16/2002 | US6373348 High speed differential attenuator using a low temperature co-fired ceramic substrate |
| 04/16/2002 | US6373275 Electronic device capable of greatly improving signal transmission speed in a bus wiring system |
| 04/16/2002 | US6373273 Test insert containing vias for interfacing a device containing contact bumps with a test substrate |
| 04/16/2002 | US6373141 Bondable compliant pads for packaging of a semiconductor chip and method therefor |
| 04/16/2002 | US6373140 Semiconductor device |
| 04/16/2002 | US6373139 Layout for a ball grid array |
| 04/16/2002 | US6373138 Integrated circuit with conductive lines disposed within isolation regions |
| 04/16/2002 | US6373137 Copper interconnect for an integrated circuit and methods for its fabrication |
| 04/16/2002 | US6373136 Damascene wiring structure and semiconductor device with damascene wirings |
| 04/16/2002 | US6373135 Semiconductor structure and method of fabrication |
| 04/16/2002 | US6373134 Semiconductor device and fabrication method introducing horizontal side-steps into vertical steps |
| 04/16/2002 | US6373133 Multi-chip module and heat-sink cap combination |
| 04/16/2002 | US6373132 Semiconductor die with attached heat sink and transfer mold |
| 04/16/2002 | US6373131 TBGA semiconductor package |
| 04/16/2002 | US6373130 Electrical or electronic component encapsulated in a sealed manner |
| 04/16/2002 | US6373129 Semiconductor apparatus with pressure contact semiconductor chips |
| 04/16/2002 | US6373128 Semiconductor assemblies with reinforced peripheral regions |
| 04/16/2002 | US6373127 Integrated capacitor on the back of a chip |
| 04/16/2002 | US6373126 Method for reducing IC package delamination by use of internal baffles |
| 04/16/2002 | US6373125 Chip scale package with direct attachment of chip to lead frame |
| 04/16/2002 | US6373124 Lead frame and method of producing the same, and a semiconductor device using the same |
| 04/16/2002 | US6373122 Method of fabricating various-sized passivated integrated circuit chips from a borderless gate array |
| 04/16/2002 | US6373120 Semiconductor device for simultaneously achieving high reliability to laser light radiation and small occupation region and method of manufacturing it |
| 04/16/2002 | US6373107 Semiconductor storage device having four-transistor memory cells |
| 04/16/2002 | US6373101 Solid-state relay |
| 04/16/2002 | US6373082 Compound semiconductor field effect transistor |
| 04/16/2002 | US6373011 Method for sorting integrated circuit devices |
| 04/16/2002 | US6372999 Multilayer wiring board and multilayer wiring package |
| 04/16/2002 | US6372997 Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink |
| 04/16/2002 | US6372985 Package for electronic components |
| 04/16/2002 | US6372928 Layer forming material and wiring forming method |
| 04/16/2002 | US6372859 Thermoresistance adhesive and semiconductor device using the same |