| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/23/2002 | US6376055 Composition for ceramic substrate and ceramic circuit component |
| 04/23/2002 | US6376048 Organosilicon compound adhesive |
| 04/23/2002 | US6375868 Method for manufacturing paste for electroconductive thick film, paste for electroconductive thick film and laminated ceramic electronic part |
| 04/23/2002 | US6375857 Method to form fuse using polymeric films |
| 04/23/2002 | US6375708 W-cu-ni alloy formed by direct sintering of a powder blend which eliminates the formation of brittle intermetallics and slumping |
| 04/23/2002 | US6375687 Filling connection hole with wiring material by using centrifugal force |
| 04/23/2002 | US6375476 LGA package socket |
| 04/23/2002 | US6375418 Heat sink-equipped cooling apparatus |
| 04/23/2002 | US6375340 Led component group with heat dissipating support |
| 04/23/2002 | US6375159 High laser absorption copper fuse and method for making the same |
| 04/23/2002 | US6375064 Method of forming projecting electrodes and method of manufacturing semiconductor device provided with projecting electrodes |
| 04/23/2002 | US6375062 Surface bumping method and structure formed thereby |
| 04/23/2002 | US6374906 Heat sink having a captive handle |
| 04/23/2002 | US6374905 Scalable and modular heat sink-heat pipe cooling system |
| 04/23/2002 | US6374770 Apparatus for improving film stability of halogen-doped silicon oxide films |
| 04/18/2002 | WO2002032203A1 A method of making a gasket on a pcb and a pcb |
| 04/18/2002 | WO2002032002A1 High-frequency composite switch module |
| 04/18/2002 | WO2002031881A1 Electronic unit and process for the production thereof |
| 04/18/2002 | WO2002031876A1 Semiconductor device and production method therefor |
| 04/18/2002 | WO2002031868A1 Stacked wafer alignment method |
| 04/18/2002 | WO2002031763A1 Module having a lead frame equipped with components on both sides |
| 04/18/2002 | WO2002031231A1 Semiconductor production device and production method for semiconductor device |
| 04/18/2002 | WO2002031018A1 Die-attaching paste and semiconductor device |
| 04/18/2002 | WO2002013585A3 Electrical assembly and method for producing said electrical assembly |
| 04/18/2002 | WO2001097584A3 Encapsulation using microcellular foamed materials |
| 04/18/2002 | WO2001086721A3 A semiconductor device including an integrated circuit housed in an array package having signal terminals arranged about centrally located power supply terminals |
| 04/18/2002 | WO2001063672A3 Integrated circuit interconnect system having matched impedance and capacitance |
| 04/18/2002 | WO2001063648A3 Method of using optical proximity effects to create electrically blown fuses with sub-critical dimension neck downs |
| 04/18/2002 | WO2000074448A9 Surface mount package for power semiconductor devices |
| 04/18/2002 | US20020045709 Liquid epoxy resin composition and semiconductor device |
| 04/18/2002 | US20020045394 Wiring board and a process of producing a wiring board |
| 04/18/2002 | US20020045365 Socket for testing IC package |
| 04/18/2002 | US20020045359 Fluorine-containing materials and processes |
| 04/18/2002 | US20020045355 Method of manufacturing a semiconductor device having a silicide layer |
| 04/18/2002 | US20020045346 Formation of diamond particle interconnects |
| 04/18/2002 | US20020045339 Manufacture method for semiconductor with small variation in MOS threshold voltage |
| 04/18/2002 | US20020045338 Semiconductor device and method for manufacturing the same |
| 04/18/2002 | US20020045336 Methods for forming improved passivation layers for integrated circuits |
| 04/18/2002 | US20020045335 Passivation integrity improvements |
| 04/18/2002 | US20020045334 Interconnection system and method for producing the same |
| 04/18/2002 | US20020045333 Semiconductor device manufacturing method and semiconductor device |
| 04/18/2002 | US20020045298 Method for forming semiconductor device |
| 04/18/2002 | US20020045297 Membrane 3D IC fabrication |
| 04/18/2002 | US20020045295 Detectors |
| 04/18/2002 | US20020045294 A method for creating printed circuit board substrates having solder mask-free edges |
| 04/18/2002 | US20020045293 Structure for mounting a bare chip using an interposer |
| 04/18/2002 | US20020045292 Semiconductor device, method for manufacturing same and portable device |
| 04/18/2002 | US20020045291 High density direct connect LOC assembly |
| 04/18/2002 | US20020045107 Reticle for creating resist-filled vias in a dual damascene process |
| 04/18/2002 | US20020044580 Light receiving element and semiconductor laser device |
| 04/18/2002 | US20020044431 Microchip controller board and manufacturing method thereof |
| 04/18/2002 | US20020044424 Heat sinks for CPUs for use in personal computers |
| 04/18/2002 | US20020044423 Method and apparatus for mounting and packaging electronic components |
| 04/18/2002 | US20020044401 Multi-functional energy conditioner |
| 04/18/2002 | US20020044329 Electrooptical unit and electronic apparatus |
| 04/18/2002 | US20020044228 Array substrate for a liquid crystal display and method for fabricating thereof |
| 04/18/2002 | US20020044227 In-plane switching type liquid crystal display device and a method for manufacturing the same |
| 04/18/2002 | US20020044124 Display panel, display panel inspection method, and display panel manufacturing method |
| 04/18/2002 | US20020044033 Waveguide coupler |
| 04/18/2002 | US20020044030 Radio frequency module parts including surface elastic wave elements and manufacturing method thereof |
| 04/18/2002 | US20020044010 Semiconductor device provided with noise cut filter |
| 04/18/2002 | US20020043986 Ball grid array chip packages having improved testing and stacking characteristics |
| 04/18/2002 | US20020043892 Surface acoustic wave device |
| 04/18/2002 | US20020043728 Resin composition for sealing semiconductor, semiconductor device using the same, semiconductor wafer and mounted structure of semiconductor device |
| 04/18/2002 | US20020043727 Bonding pad structure |
| 04/18/2002 | US20020043726 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer |
| 04/18/2002 | US20020043724 Semiconductor device and method of fabricating same |
| 04/18/2002 | US20020043723 Semiconductor device and manufacturing method thereof |
| 04/18/2002 | US20020043722 Semiconductor device and method of manufacturing the same |
| 04/18/2002 | US20020043721 Chip package with molded underfill |
| 04/18/2002 | US20020043720 Semiconductor device in a recess of a semiconductor plate |
| 04/18/2002 | US20020043719 Semiconductor device |
| 04/18/2002 | US20020043717 Semiconductor device |
| 04/18/2002 | US20020043716 Improve heat sink for use in cooling an integrated circuit |
| 04/18/2002 | US20020043715 Semiconductor device with dummy wiring layers |
| 04/18/2002 | US20020043714 Premold type semiconductor package and process for manufacturing same |
| 04/18/2002 | US20020043713 COF-use tape carrier and COF-structured semiconductor device using the same |
| 04/18/2002 | US20020043712 Circuit structure integrating the power distribution functions of circuits and leadframes into the chip surface |
| 04/18/2002 | US20020043711 Stereolithographic method and apparatus for fabricating stabilizers for flip-chip type semiconductor devices and resulting structures |
| 04/18/2002 | US20020043709 Stackable integrated circuit |
| 04/18/2002 | US20020043706 Miniature Microdevice Package and Process for Making Thereof |
| 04/18/2002 | US20020043705 Semiconductor device and its manufacturing method |
| 04/18/2002 | US20020043704 Tape for chip on film and semiconductor therewith |
| 04/18/2002 | US20020043703 Injection mold for an optical semiconductor package and corresponding optical semiconductor package |
| 04/18/2002 | US20020043702 Semiconductor package comprising substrate with mounting leads and manufacturing method therefor |
| 04/18/2002 | US20020043701 Leadframe for chips, having low resistance connections |
| 04/18/2002 | US20020043700 Semiconductor device and method for manufacturing the same |
| 04/18/2002 | US20020043694 Semiconductor raised source-drain structure |
| 04/18/2002 | US20020043678 Semiconductor integrated device and method of fabrication therof |
| 04/18/2002 | US20020043664 Semiconductor device |
| 04/18/2002 | US20020043658 Apparatus and methods of packaging and testing die |
| 04/18/2002 | US20020043402 Printed circuit board with integral heat sink for semiconductor package |
| 04/18/2002 | US20020043400 Semiconductor device |
| 04/18/2002 | US20020043399 Multilayered wiring board, a production process for, and semiconductor device using, the same |
| 04/18/2002 | US20020043397 Method of selectively adjusting surface tension of soldermask material |
| 04/18/2002 | US20020043396 Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof |
| 04/18/2002 | US20020043390 Micro-Ball Grid Array package tape including tap for testing |
| 04/18/2002 | US20020043364 Heat radiator for electronic device and method of making it |
| 04/18/2002 | US20020043360 Heatsink for electronic component |
| 04/18/2002 | US20020043359 Heat sink for electronic parts and manufacture thereof |