| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/25/2002 | US20020048948 Tape having implantable conductive lands for semiconductor packaging process and method for manufacturing the same |
| 04/25/2002 | US20020048946 Local interconnect structures for integrated circuits and methods for making the same |
| 04/25/2002 | US20020048945 Method for manufacturing semiconductor devices |
| 04/25/2002 | US20020048944 Multi-level circuit structure |
| 04/25/2002 | US20020048942 Method of manufacturing semiconductor device with two step formation of contact hole |
| 04/25/2002 | US20020048938 Crystal grains of large grain sizes can be formed by using a gas containing hydrogen and a borane, such as diborane, for forming a tungsten film |
| 04/25/2002 | US20020048935 Semiconductor device and method for manufacturing the same |
| 04/25/2002 | US20020048933 Technique for intralevel capacitive isolation of interconnect paths |
| 04/25/2002 | US20020048931 Damascene structure and method of making |
| 04/25/2002 | US20020048930 Interconnects are held to a minimum in length by using polyimide or polyarylenecyclobutane as an intermetal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment |
| 04/25/2002 | US20020048928 Semiconductor device and method for fabricating the same |
| 04/25/2002 | US20020048927 Embedded capacitor multi-chip modules |
| 04/25/2002 | US20020048926 Method for forming a self-aligned copper capping diffusion barrier |
| 04/25/2002 | US20020048924 For connecting a nonconducting substrate and a chip without lateral shorting |
| 04/25/2002 | US20020048923 Routing power supply voltage electrodes and reference voltage electrodes which makes efficient use of chip area, maximizes decoupling capacitance, and reduces voltage drops due to electrode resistance |
| 04/25/2002 | US20020048922 Semiconductor processing methods and structures for determining alignment during semiconductor wafer processing |
| 04/25/2002 | US20020048921 A diffusion region is formed in semiconductive material, conductive line is formed which is laterally spaced from the diffusion region; integrated memory circuitry |
| 04/25/2002 | US20020048916 Thinned, stackable semiconductor device having low profile |
| 04/25/2002 | US20020048907 Methods of processing semiconductor wafer and producing IC card, and carrier |
| 04/25/2002 | US20020048906 Semiconductor device, method of manufacturing the device and mehtod of mounting the device |
| 04/25/2002 | US20020048905 Conductive resin film configured as a plurality of interconnect lines connected to the bump front electrodes; large number can be made at same time |
| 04/25/2002 | US20020048903 Semiconductor device |
| 04/25/2002 | US20020048902 Method for forming overlay verniers for semiconductor devices |
| 04/25/2002 | US20020048889 Method of manufacturing semiconductor device with sidewall metal layers |
| 04/25/2002 | US20020048886 Semiconductor device and method for fabricating the same |
| 04/25/2002 | US20020048865 Method of forming a local interconnect |
| 04/25/2002 | US20020048854 Laser-programmable interconnect of integrated circuit chips |
| 04/25/2002 | US20020048853 Method of manufacturing a semiconductor device and a support plate, and a semiconductor device obtained by means of said method |
| 04/25/2002 | US20020048852 Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes |
| 04/25/2002 | US20020048851 Process for making a semiconductor package |
| 04/25/2002 | US20020048849 Integrated circuits; sealed by conductive epoxy resin |
| 04/25/2002 | US20020048848 Flip-chip type semiconductor device having split voids within under-fill layer and its manufacturing method |
| 04/25/2002 | US20020048847 Method of mounting semiconductor chip part on substrate |
| 04/25/2002 | US20020048846 Die paddle clamping method for wire bond enhancement |
| 04/25/2002 | US20020048845 Plastic ball grid array assembly |
| 04/25/2002 | US20020048843 Method and apparatus for packaging a microelectronic die |
| 04/25/2002 | US20020048842 Image sensing component package and manufacture method thereof |
| 04/25/2002 | US20020048828 Semiconductor device and method of manufacturing the same |
| 04/25/2002 | US20020048668 Ferrite magnetic film structure having magnetic anisotropy, method of manufacturing the same, and planar magnetic device employing ferrite magnetic film structure having magnetic anisotropy |
| 04/25/2002 | US20020048666 Multilayered ceramic board, method for fabricating the same, and electronic device using multilayered ceramic board |
| 04/25/2002 | US20020048636 Method for fabricating electrode structure and method for fabricating semiconductor device |
| 04/25/2002 | US20020048630 Constructed to prevent corners from peeling and raising off a substrate; has a spiral configuration and includes straight lines and corners connected to the straight lines. |
| 04/25/2002 | US20020048158 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 04/25/2002 | US20020048157 Memory module having series-connected printed circuit boards |
| 04/25/2002 | US20020048156 Flexible wiring substrate and its manufacturing method |
| 04/25/2002 | US20020048154 Fin-shaped heat dissipation apparatus for electronic device |
| 04/25/2002 | US20020048153 Electronic assembly and cooling thereof |
| 04/25/2002 | US20020048152 IC heat radiation structure and display device |
| 04/25/2002 | US20020048147 Heat sink unit and electronic apparatus using the same |
| 04/25/2002 | US20020047956 Display apparatus |
| 04/25/2002 | US20020047772 Electrical-resistant via hole and process of fabricating the same |
| 04/25/2002 | US20020047728 Integrated circuit |
| 04/25/2002 | US20020047724 Multi-state test structures and methods |
| 04/25/2002 | US20020047721 Probe pin for a probe card |
| 04/25/2002 | US20020047567 Organic led display device of active matrix drive type and fabrication method therefor |
| 04/25/2002 | US20020047218 Bond pad of semiconductor device and method of fabricating the same |
| 04/25/2002 | US20020047216 Ball grid array |
| 04/25/2002 | US20020047215 Semiconductor device and its manufacturing method |
| 04/25/2002 | US20020047214 Multi-chip package-type semiconductor device |
| 04/25/2002 | US20020047212 Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate |
| 04/25/2002 | US20020047210 Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device |
| 04/25/2002 | US20020047208 Method and structure for improving electromigration of chip interconnects |
| 04/25/2002 | US20020047207 Semiconductor device and method for fabricating the same |
| 04/25/2002 | US20020047206 Wiring structures containing interconnected metal and wiring levels including a continous, single crystalline or polycrystalline conductive material having one or more twin boundaries |
| 04/25/2002 | US20020047205 Local interconnect structure for integrated circuit devices, source structure for the same, and method for fabricating the same |
| 04/25/2002 | US20020047200 Low profile optically-sensitive semiconductor package |
| 04/25/2002 | US20020047199 Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device |
| 04/25/2002 | US20020047198 Semiconductor device package and lead frame with die overhanging lead frame pad |
| 04/25/2002 | US20020047196 Multi-chip module with extension |
| 04/25/2002 | US20020047195 Semiconductor device and method for manufacturing same |
| 04/25/2002 | US20020047194 Semiconductor device and lead frame assembly/lead frame for making a semiconductor device |
| 04/25/2002 | US20020047193 Circuit carrier, in particular printed circuit board |
| 04/25/2002 | US20020047190 Optical device using a lead frame and a process for manufacturing the same |
| 04/25/2002 | US20020047189 Semiconductor device and its manufacturing method |
| 04/25/2002 | US20020047187 Semiconductor device |
| 04/25/2002 | US20020047186 Semiconductor leadframes comprising silver plating |
| 04/25/2002 | US20020047185 Lead frame tooling design for bleed barrier groove |
| 04/25/2002 | US20020047184 Electronic component having a semiconductor chip |
| 04/25/2002 | US20020047182 Reducing magnetic coupling using triple well |
| 04/25/2002 | US20020047179 Semiconductor device |
| 04/25/2002 | US20020047133 Chip carrier film, method of manufacturing the chip carrier film and liquid crystal dispaly using the chip carrier film |
| 04/25/2002 | US20020047132 Semiconductor device for controlling electricity |
| 04/25/2002 | US20020047117 Technique for attaching die to leads |
| 04/25/2002 | US20020046880 Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board |
| 04/25/2002 | US20020046874 Thin film metal barrier for electrical interconnections |
| 04/25/2002 | US20020046873 Method for making a flexible circuit interposer having high-aspect ratio conductors |
| 04/25/2002 | US20020046857 Stress relieving tape bonding interconnect |
| 04/25/2002 | US20020046854 Ball grid array semiconductor package with exposed base layer |
| 04/25/2002 | US20020046826 CPU cooling structure |
| 04/25/2002 | US20020046825 Cooling device using magnetizated thermal-conduction liquid |
| 04/25/2002 | US20020046804 Process for making semiconductor chip assembly |
| 04/25/2002 | US20020046450 Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card |
| 04/25/2002 | DE10144201A1 Halbleiteranordnung Semiconductor device |
| 04/25/2002 | DE10143919A1 Electroconductive paste for forming through hole conductor, contains organic vehicle containing solvent and binder spherical/granular form electroconductive metal powder, and resin powder having low water absorptivity |
| 04/25/2002 | DE10127268A1 Printed circuit board as a circuit carrier with two metal outer layers and a metal intermediate layer has insulating layers between the outer and intermediate layers with a cooling component on an outer layer linked via a heat path. |
| 04/25/2002 | DE10054936C1 Production of an integrated circuit comprises forming metallizing regions in a substrate, applying an intermediate layer, removing the layer to form an oxide film, and partially converting the oxide film to produce a conducting connection |
| 04/25/2002 | DE10051547A1 Mounting rack for electrical or electronic components, comprises at least one conduction web with small thermal conduction selection |
| 04/25/2002 | DE10047147A1 Circuit for use in integrated semiconductor memories and semiconductor circuit module allows lines for addresses, data and control to lead from a chip-type package to external connector pins. |
| 04/25/2002 | DE10047146A1 Casing for insulating electronic circuit structures has a surface area between two vertically separated contact areas in the casing with a raised effective surface in order to form a raised leakage path between the contact areas. |
| 04/25/2002 | DE10047135A1 Production of an integrated component comprises preparing an integrated circuit with contact pads connected to electrically conducting humps, applying the circuit onto a substrate |