| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/24/2002 | EP1199795A1 Lc oscillator |
| 04/24/2002 | EP1199751A2 Chip arrangement |
| 04/24/2002 | EP1199750A2 Post passivation interconnection schemes on top of the IC chips |
| 04/24/2002 | EP1199749A1 Heat sink |
| 04/24/2002 | EP1199748A1 Improved heat dissipater structure |
| 04/24/2002 | EP1199747A1 Improved structure computer heat dissipater |
| 04/24/2002 | EP1199746A2 Resin-moulded semiconductor device with heat radiating electrode |
| 04/24/2002 | EP1199744A1 Microcap wafer-level package |
| 04/24/2002 | EP1199328A1 Thermally conductive polymer sheet |
| 04/24/2002 | EP1198965A1 Mobile station supervision of the forward dedicated control channel when in the discontinuous transmission mode |
| 04/24/2002 | EP1198837A1 Monolithic low dielectric constant platform for passive components and method |
| 04/24/2002 | EP1198836A1 Fuse for semiconductor device |
| 04/24/2002 | EP1198835A1 Dual wafer attachment process |
| 04/24/2002 | EP1198831A1 Method for selectively coating ceramic surfaces |
| 04/24/2002 | EP1198745A1 Cooling device for electronic components |
| 04/24/2002 | EP1198692A1 Heat exchanger |
| 04/24/2002 | EP0968523B1 Method for forming a structured metallization on a semiconductor wafer |
| 04/24/2002 | CN2488176Y Radiator fixer |
| 04/24/2002 | CN2488175Y Sealing stopper for heat-tube radiator |
| 04/24/2002 | CN2488174Y Fastener for radiator of IC |
| 04/24/2002 | CN1346516A Intelligent gate-level fill methods for reducing global pattern density effects |
| 04/24/2002 | CN1346515A Methods for packaging integrated circuit devices including cavities adjacent active regions and related structures |
| 04/24/2002 | CN1346514A Electrostatic discharge protection of integrated circuits |
| 04/24/2002 | CN1346513A Metal core substrate printed wiring board enabling thermally enhanced ball grid array (BGA) packages and method |
| 04/24/2002 | CN1346473A System for providing an integrated circuit withunique identification |
| 04/24/2002 | CN1346375A Sealing agent for liquid-crystal display, cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element |
| 04/24/2002 | CN1346177A Method for making RF module element iwth sound wave surface wave unit |
| 04/24/2002 | CN1346172A Heat radiation increased and over current load avoided small sized power supply |
| 04/24/2002 | CN1346150A 环氧树脂组合物和半导体装置 Epoxy resin composition and a semiconductor device |
| 04/24/2002 | CN1346149A Chip size plug-in piece, printed circuit board and method for designing printed circuit board |
| 04/24/2002 | CN1346147A Circuit board with convex and making method thereof |
| 04/24/2002 | CN1346132A Non-volatile semiconductor memory and system |
| 04/24/2002 | CN1345896A 环氧树脂组合物和半导体装置 Epoxy resin composition and a semiconductor device |
| 04/24/2002 | CN1083619C Semiconductor device with damp-proof separator for anti-moisture |
| 04/23/2002 | US6378120 Power bus and method for generating power slits therein |
| 04/23/2002 | US6378118 Semiconductor integrated circuit having a MPU and a DRAM cache memory |
| 04/23/2002 | US6377742 Lead frame, optical module, and a method of optical module |
| 04/23/2002 | US6377474 Electrical grounding schemes for socketed processor and heatsink assembly |
| 04/23/2002 | US6377466 Header, a method of manufacture thereof and an electronic device employing the same |
| 04/23/2002 | US6377465 Printing wiring board |
| 04/23/2002 | US6377464 Multiple chip module with integrated RF capabilities |
| 04/23/2002 | US6377463 Retention module for processor and chipset thermal solutions |
| 04/23/2002 | US6377461 Power electronic module packaging |
| 04/23/2002 | US6377460 Electronic circuit having a flexible intermediate layer between electronic components and a heat sink |
| 04/23/2002 | US6377459 Chip cooling management |
| 04/23/2002 | US6377458 Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump |
| 04/23/2002 | US6377457 Electronic assembly and cooling thereof |
| 04/23/2002 | US6377453 Field replaceable module with enhanced thermal interface |
| 04/23/2002 | US6377315 System and method for providing a low power receiver design |
| 04/23/2002 | US6376924 Position check mark |
| 04/23/2002 | US6376923 Liquid epoxy resin, curing agent, copolymer of alkenyl group-containing epoxy resin and an sih group-containing organopolysiloxane, inorganic filler surface treated with an aminosilane or organosilazane |
| 04/23/2002 | US6376921 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame |
| 04/23/2002 | US6376920 Semiconductor chip having a low-noise ground line |
| 04/23/2002 | US6376919 Circuit edit interconnect structure through the backside of an integrated circuit die |
| 04/23/2002 | US6376917 Semiconductor device |
| 04/23/2002 | US6376916 Tape carrier for BGA and semiconductor device using the same |
| 04/23/2002 | US6376915 Semiconductor device and semiconductor chip |
| 04/23/2002 | US6376914 Dual-die integrated circuit package |
| 04/23/2002 | US6376913 Integrated semiconductor chip having leads to one or more external terminals |
| 04/23/2002 | US6376911 Planarized final passivation for semiconductor devices |
| 04/23/2002 | US6376910 Solder-on back metal for semiconductor die |
| 04/23/2002 | US6376909 Mixed-mode stacked integrated circuit with power supply circuit part of the stack |
| 04/23/2002 | US6376908 Semiconductor plastic package and process for the production thereof |
| 04/23/2002 | US6376907 Ball grid array type package for semiconductor device |
| 04/23/2002 | US6376906 Mounting structure of semiconductor element |
| 04/23/2002 | US6376905 Semiconductor package |
| 04/23/2002 | US6376904 Redistributed bond pads in stacked integrated circuit die package |
| 04/23/2002 | US6376903 Semiconductor chip package with multilevel leads |
| 04/23/2002 | US6376901 Palladium-spot leadframes for solder plated semiconductor devices and method of fabrication |
| 04/23/2002 | US6376899 Planar guard ring |
| 04/23/2002 | US6376894 Semiconductor device |
| 04/23/2002 | US6376892 Semiconductor device and method of manufacturing the same |
| 04/23/2002 | US6376887 Semiconductor memory having buried digit lines |
| 04/23/2002 | US6376881 Protective element formed in an SOI substrate for preventing a breakdown in an oxide film located below a diffused resistor |
| 04/23/2002 | US6376782 Resinous circuit board with pins improved in joining strength |
| 04/23/2002 | US6376769 High-density electronic package, and method for making same |
| 04/23/2002 | US6376389 Method for eliminating anti-reflective coating in semiconductors |
| 04/23/2002 | US6376371 Method of forming a semiconductor device |
| 04/23/2002 | US6376369 Robust pressure aluminum fill process |
| 04/23/2002 | US6376365 Forming dielectric; etching a recess |
| 04/23/2002 | US6376364 Method of fabricating semiconductor device |
| 04/23/2002 | US6376363 Forming method of copper interconnection and semiconductor wafer with copper interconnection formed thereon |
| 04/23/2002 | US6376362 Production of semiconductor device |
| 04/23/2002 | US6376359 Method of manufacturing metallic interconnect |
| 04/23/2002 | US6376357 Method for manufacturing a semiconductor device with voids in the insulation film between wirings |
| 04/23/2002 | US6376354 Wafer-level packaging process |
| 04/23/2002 | US6376353 Aluminum and copper bimetallic bond pad scheme for copper damascene interconnects |
| 04/23/2002 | US6376349 Forming dielectric; then amorphous metal; siliciding |
| 04/23/2002 | US6376344 Semiconductor device with fully self-aligned local interconnects, and method for fabricating the device |
| 04/23/2002 | US6376327 Formation of a capacitor with low leakage current |
| 04/23/2002 | US6376283 Mono-chip multimediacard fabrication method |
| 04/23/2002 | US6376282 Inner-digitized bond fingers on bus bars of semiconductor device package |
| 04/23/2002 | US6376280 Microcap wafer-level package |
| 04/23/2002 | US6376279 method for manufacturing a semiconductor package |
| 04/23/2002 | US6376278 Methods for making a plurality of flip chip packages with a wafer scale resin sealing step |
| 04/23/2002 | US6376277 Semiconductor package |
| 04/23/2002 | US6376266 Semiconductor package and method for forming same |
| 04/23/2002 | US6376264 Test photomask and method for investigating ESD-induced reticle defects |
| 04/23/2002 | US6376101 Epoxy resin composition and semiconductor devices |
| 04/23/2002 | US6376100 Blend of epoxy resin and filler |