Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2002
05/02/2002US20020051564 Method and device for optically monitoring fabrication processes of finely structured surfaces in a semiconductor production
05/02/2002US20020051353 High-frequency ceramic package
05/02/2002US20020051352 Stackable ball grid array package
05/02/2002US20020051343 Novel system and method of heat extraction from an integrated circuit die
05/02/2002US20020051342 Radiator for electronic parts, electronic device, electric circuit device, and computer
05/02/2002US20020051341 Direct heatpipe attachment to die using center point loading
05/02/2002US20020051101 Liquid crystal display
05/02/2002US20020050967 Liquid crystal display device
05/02/2002US20020050910 Protection of electrical devices with voltage variable materials
05/02/2002US20020050836 Reduced terminal testing system
05/02/2002US20020050833 Temperature control of electronic devices using power following feedback
05/02/2002US20020050655 Method for adding features to a design layout and process for designing a mask
05/02/2002US20020050654 Method and apparatus for packaging a microelectronic die
05/02/2002US20020050653 Semiconductor devcice and its manufacturing method
05/02/2002US20020050652 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
05/02/2002US20020050651 Semiconductor device and method for fabricating the same
05/02/2002US20020050650 Semiconductor device and method for making the same
05/02/2002US20020050649 Metal interconnect layer of semiconductor device and method for forming a metal interconnect layer
05/02/2002US20020050648 Semiconductor device and method for fabricating the same
05/02/2002US20020050647 Semiconductor device and method of manufacturing the same
05/02/2002US20020050646 Semiconductor device having dummy interconnection and method for manufacturing the same
05/02/2002US20020050643 Conductive adhesive agent, packaging structrue, and method for manufacturing the same structure
05/02/2002US20020050642 Semiconductor device and method of manufacturing the same
05/02/2002US20020050641 Apparatus and methods of semiconductor packages having circuit-bearing interconnect components
05/02/2002US20020050640 Semiconductor device
05/02/2002US20020050639 Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer
05/02/2002US20020050638 Condensed memory matrix
05/02/2002US20020050637 Semiconductor device
05/02/2002US20020050636 Semiconductor device and its manufacturing method
05/02/2002US20020050635 Integrated circuit device
05/02/2002US20020050633 Semiconductor module
05/02/2002US20020050632 Magnetic shielding for integrated circuits
05/02/2002US20020050631 Semiconductor device and method for fabricating the same
05/02/2002US20020050630 Protective envelope for a semiconductor integrated circuit
05/02/2002US20020050629 Semiconductor passivation deposition process for interfacial adhesion
05/02/2002US20020050628 Metallization structures for microelectronic applications and process for forming the structures
05/02/2002US20020050625 Junctionless antifuses and systems containing junctionless antifuses
05/02/2002US20020050620 Semiconductor integrated circuit device having capacitor element
05/02/2002US20020050591 Apparatus and method for marking defective sections of laminate substrates
05/02/2002US20020050586 Contains copper; for forming via hole conductors to be converted to external electrode terminals
05/02/2002US20020050585 Magnetic field is applied to boron nitride powder increasing thermoconductivity; dielectrics
05/02/2002US20020050510 Metal-ceramic circuit board and manufacturing method thereof
05/02/2002US20020050459 Forming insulating film above substrate, forming a to be filled region of interconnecting groove and hole in film, forming conductive film containing catalyst which accelerates electroless plating, forming second and third conductive films
05/02/2002US20020050407 Ground via structures in semiconductor packages
05/02/2002US20020050406 Substrate for mounting semiconductor integrated circuit device
05/02/2002US20020050404 Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof
05/02/2002US20020050403 Semiconductor device
05/02/2002US20020050401 Integrated EMI shield utilizing a hybrid edge
05/02/2002US20020050398 Stress resistant land grid array (LGA) module and method of forming the same
05/02/2002US20020050397 Semiconductor module and method of manufacturing the same
05/02/2002US20020050381 Flexible printed circuit board, integrated circuit chip mounting flexible printed circuit board, display apparatus incorporating, integrated circuit chip mounted structure, and bonding method of integrated circuit chip mounting flexible printed circuit board
05/02/2002US20020050380 Electronic package with plurality of solder-applied areas providing heat transfer
05/02/2002US20020050371 Radiation shielding of three dimensional multi-chip modules
05/02/2002US20020050344 Cooling device boiling and cooling refrigerant, with main wick and auxiliary wick
05/02/2002US20020050339 Heat sink and method for manufacturing same
05/02/2002US20020050333 Heat sink manufacturing device and manufacturing method
05/02/2002US20020050316 Laminated green base layers containing low temperature sinterable ceramic material, green constraining layer contacting at least one of base layers and containing an unsinterable inorganic material, wiring conductor
05/02/2002US20020050148 Thermal management device
05/02/2002US20020050144 Spray cooling system
05/02/2002EP1202350A2 Semiconductor device and manufacturing method thereof
05/02/2002EP1202349A2 Semiconductor module and method of manufacturing the same
05/02/2002EP1202348A2 Semiconductor device and method of manufacturing same
05/02/2002EP1202347A2 Method of manufacturing a metal frame, metal frame and using the same
05/02/2002EP1202346A1 Heat sink arrangement
05/02/2002EP1202345A2 Semiconductor power element heat dissipation board, conductor plate therefor, heat sink material and solder material
05/02/2002EP1202344A1 Heat-radiating means
05/02/2002EP1202343A2 Semiconductor device and fabrication process therefor
05/02/2002EP1202342A2 Semiconductor device and manufacturing method thereof
05/02/2002EP1202337A2 Probe pin for a probe card
05/02/2002EP1202327A1 Semiconductor device
05/02/2002EP1202296A1 Out-of-plane microcoil using bonding wires and method for making
05/02/2002EP1201785A1 Method of depositing organosilicate layers
05/02/2002EP1201623A2 Silicon nitride ceramic substrate, silicon nitride ceramic circuit board using the substrate, and method of manufacturing the same
05/02/2002EP1201109A1 Method of installing heat source, and micro heat pipe module
05/02/2002EP1200992A1 Resilient interconnect structure for electronic components and method for making the same
05/02/2002EP1200990A2 Integrated circuit interconnect system
05/02/2002EP1200509A1 Composites of powdered fillers and polymer matrix and process for preparing them
05/02/2002EP1072180A4 Integrated circuit intercoupling component with heat sink
05/02/2002EP1010048B1 Voltage regulating circuit for eliminating "latch-up
05/02/2002EP0968522B1 Method of checking for the presence of connection balls
05/02/2002EP0811248B1 Dram bit line contact and method of forming such a contact
05/02/2002DE10150432A1 Diffraction grating substrate for a liquid crystal display unit incorporating thin film transistors
05/02/2002DE10138958A1 Chip scale package for electronic module, comprises external address and command signal conduction balls arranged at larger intervals compared to data signal conduction balls
05/02/2002DE10109329C1 Circuit has power stage with heat generating components mounted around component(s) that generates less heat mounted in inner region, conducting metal body mounted on cooling body
05/02/2002DE10051467A1 Semiconducting chip housing has wiring plane with at least one resistor and/or capacitor in form of board-on-chip ball grid array with wiring structure of one or more layers
05/02/2002DE10051053A1 Verfahren zum Schutz elektronischer oder mikromechanischer Bauteile A method for protecting electronic or micromechanical components
05/02/2002DE10050126A1 Cooling element for a semiconductor component formed in one piece using flow molding process
05/02/2002DE10049572A1 High temperature component used as heating element in gas sensor comprises non-conducting intermediate layer between conducting pathway and silicon dioxide conducting pathway protection layer
05/02/2002DE10048704A1 Verfahren für eine Vorrichtung mit Leistungshalbleitern und Vorrichtung A method for a device with power semiconductors and apparatus
05/02/2002CA2426124A1 Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production
05/01/2002CN2489471Y Device for preventing electrostatic destroying
05/01/2002CN2489470Y IC radiator fastener
05/01/2002CN2489469Y Fastener for radiator
05/01/2002CN2489468Y Chip radiating fin fixed device
05/01/2002CN2489467Y Structure-improved radiating fin
05/01/2002CN2489466Y Radiating device for electronic assembly
05/01/2002CN1347535A Integrated circuit device which is secured against attacks resulting from controlled destruction of additional layer
05/01/2002CN1347281A Cooling device for cooling heating element, circuit module comprising cooling device, and electronic device provided with circuit module
05/01/2002CN1347174A Ic插座 Ic Socket
05/01/2002CN1347154A Semiconductor device and semiconductor assembly
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