| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/09/2002 | US20020053936 Semiconductor integrated circuit |
| 05/09/2002 | US20020053747 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 05/09/2002 | US20020053746 Recessed bond pad |
| 05/09/2002 | US20020053745 Method of making chip scale package |
| 05/09/2002 | US20020053744 Protection circuit device using MOSFETS and a method of manfacturing the same |
| 05/09/2002 | US20020053743 Multichip semiconductor package |
| 05/09/2002 | US20020053741 Semiconductor device and method for producing the same |
| 05/09/2002 | US20020053740 Recessed bond pad |
| 05/09/2002 | US20020053739 Semiconductor device and method of fabricating the same |
| 05/09/2002 | US20020053738 Semiconductor device with improved metal interconnection and method for forming the metal interconnection |
| 05/09/2002 | US20020053736 Semiconductor package |
| 05/09/2002 | US20020053735 Method for assembling components and antennae in radio frequency identification devices |
| 05/09/2002 | US20020053734 Probe card assembly and kit, and methods of making same |
| 05/09/2002 | US20020053733 Multi-chip module system and method of fabrication |
| 05/09/2002 | US20020053732 Semiconductor device |
| 05/09/2002 | US20020053731 Structure and package of a heat spreader substrate |
| 05/09/2002 | US20020053730 Semiconductor device and production process thereof |
| 05/09/2002 | US20020053729 Semiconductor device |
| 05/09/2002 | US20020053727 Semiconductor device |
| 05/09/2002 | US20020053726 Semiconductor device attaining both high speed processing and sufficient cooling capacity |
| 05/09/2002 | US20020053725 Semiconductor integrated circuit and system |
| 05/09/2002 | US20020053724 Semiconductor package |
| 05/09/2002 | US20020053723 Semiconductor module |
| 05/09/2002 | US20020053722 Semiconductor device, semiconductor module and hard disk |
| 05/09/2002 | US20020053721 Lead frame for semiconductor device, process for producing the same and semiconductor device using the same |
| 05/09/2002 | US20020053720 Substrate for an electronic circuit, and an electronic module using such a substrate |
| 05/09/2002 | US20020053719 Semiconductor device and process for the same |
| 05/09/2002 | US20020053716 Flexible interconnections with dual-metal dual-stud structure |
| 05/09/2002 | US20020053706 Semiconductor device and signal processing system having SOI MOS transistor |
| 05/09/2002 | US20020053688 Semiconductor raised source-drain structure |
| 05/09/2002 | US20020053686 Semiconductor memory device having metal contact structure and method of manufacturing the same |
| 05/09/2002 | US20020053673 Liquid crystal device, projection type display device and driving circuit |
| 05/09/2002 | US20020053667 Semiconductor device and method for producing the same |
| 05/09/2002 | US20020053653 Low dielectric constant film having thermal resistance, process for forming the same, insulation film between semiconductor layer using the same, and semiconductor device |
| 05/09/2002 | US20020053469 Printed wiring board and manufacturing method of the printed wiring board |
| 05/09/2002 | US20020053467 Electronic component with external connection elements |
| 05/09/2002 | US20020053466 Printed-Circuit board and a semiconductor module, and a manufacturing process of the semiconductor module |
| 05/09/2002 | US20020053464 Stress relief bend useful in an integrated circuit redistribution patch |
| 05/09/2002 | US20020053455 Prefabricated semiconductor chip carrier |
| 05/09/2002 | US20020053453 Clip chip carrier |
| 05/09/2002 | US20020053452 Semiconductor package and method therefor |
| 05/09/2002 | US20020053451 Underfill coating for loc package |
| 05/09/2002 | US20020053449 High performance chip packaging and method |
| 05/09/2002 | US20020053420 Cooling apparatus and cooling method for heating elements |
| 05/09/2002 | US20020053302 Epoxy resin composition for encapsulating semiconductor, and resin-encapsulated type semiconductor apparatus |
| 05/09/2002 | US20020053127 Method for manufacturing radio frequency module components with surface acoustic wave element |
| 05/08/2002 | EP1204143A2 Semiconductor circular and radial flow cooler |
| 05/08/2002 | EP1204140A2 Semiconductor device and method for fabricating the same |
| 05/08/2002 | EP1204136A1 Package of semiconductor device and method of manufacture thereof |
| 05/08/2002 | EP1203833A2 Organometallic copper complex and preparation of copper thin film by cvd |
| 05/08/2002 | EP1203792A1 Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device |
| 05/08/2002 | EP1203515A1 Thermosetting polymer systems and electronic laminates |
| 05/08/2002 | EP1203406A1 Method of producing copper features on semiconductor wafers |
| 05/08/2002 | EP1203401A1 Integrated inductive circuits |
| 05/08/2002 | EP1203400A1 A thin film resistor device and a method of manufacture therefor |
| 05/08/2002 | EP1203329A1 A system for providing an integrated circuit with a unique identification |
| 05/08/2002 | DE10110453A1 Verfahren zum Montieren eines Halbleiterchips auf einem Substrat und auf einem Substrat montierbarer Halbleiterbaustein A method of mounting a semiconductor chip on a substrate and on a substrate mountable semiconductor module |
| 05/08/2002 | DE10102619A1 Power module for supplying electric motors has corrugated heat sink attached to underside of thick thermally conductive base |
| 05/08/2002 | DE10102440C1 Interference suppression circuit for integrated circuit |
| 05/08/2002 | DE10054081A1 Verfahren zur Herstellung eines Metallträgerrahmens, Metallrägerrahmen und seine Verwendung A method for producing a metal support frame, and its use Metallrägerrahmen |
| 05/08/2002 | DE10052452A1 Halbleiter-Anordnung und Verfahren zur Herstellung von derartigen Halbleiter-Anordnungen Semiconductor device and process for producing such semiconductor devices |
| 05/08/2002 | DE10051719A1 Producing circuit structures on semiconducting substrate involves combining first dummy structure with second to exceed minimum size if envisaged structure smaller than minimum |
| 05/08/2002 | CN2490793Y Improved fin structure of cooling base |
| 05/08/2002 | CN2490703Y Cooling device assembly |
| 05/08/2002 | CN2490702Y Fastening device |
| 05/08/2002 | CN2490701Y Heat pipe cooling apparatus assembly |
| 05/08/2002 | CN2490700Y Cooling device |
| 05/08/2002 | CN2490699Y Cooling device assembly |
| 05/08/2002 | CN2490698Y Fastening device for heat sink |
| 05/08/2002 | CN2490697Y Heat sink |
| 05/08/2002 | CN1348679A Heatsink for electronic component, and apparatus and method for manufacturing the same |
| 05/08/2002 | CN1348481A Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device |
| 05/08/2002 | CN1348329A Conducting pulp and method for producing laminated ceramic electronic parts |
| 05/08/2002 | CN1348328A 半导体器件和半导体模块 Semiconductor device and semiconductor module |
| 05/08/2002 | CN1348240A Semiconductor laser apparatus for clearing influence of tri-light beam return light and its producing method |
| 05/08/2002 | CN1348216A Stacked semiconductor device |
| 05/08/2002 | CN1348215A Radiating base plate and semiconductor module |
| 05/08/2002 | CN1348214A Semiconductor device and semiconductor module |
| 05/08/2002 | CN1348213A 半导体装置和半导体模块 Semiconductor device and semiconductor module |
| 05/08/2002 | CN1348212A Thin packaged semi-conductor device and its producing method |
| 05/08/2002 | CN1348207A Method for producing semiconductor device |
| 05/08/2002 | CN1348205A Method for producing electric circuit device |
| 05/08/2002 | CN1348204A IC packing substrate structure and its manufacture |
| 05/08/2002 | CN1348202A Method for producing compound semi-conductor device |
| 05/08/2002 | CN1348189A Semiconductor integrated circuit apparatus |
| 05/08/2002 | CN1084586C Circuit board with primary and secondary through holes |
| 05/07/2002 | USRE37690 Lead frame and semiconductor device |
| 05/07/2002 | US6385756 Selection of functions within an integrated circuit |
| 05/07/2002 | US6385049 Multi-board BGA package |
| 05/07/2002 | US6385047 U-shaped heat sink assembly |
| 05/07/2002 | US6385046 Heat sink assembly having inner and outer heatsinks |
| 05/07/2002 | US6385044 Heat pipe heat sink assembly for cooling semiconductor chips |
| 05/07/2002 | US6384734 Method of controlling IC handler and control system using the same |
| 05/07/2002 | US6384733 Temperature monitoring apparatus for microprocessor cooling devices |
| 05/07/2002 | US6384701 Microwave and millimeter wave device mounted on a semiconductive substrate and comprised of different kinds of functional blocks |
| 05/07/2002 | US6384523 Color selection electrode, method of producing color selection electrode and cathode ray tube |
| 05/07/2002 | US6384492 Power semiconductor packaging |
| 05/07/2002 | US6384487 Bow resistant plastic semiconductor package and method of fabrication |
| 05/07/2002 | US6384486 Bonding over integrated circuits |
| 05/07/2002 | US6384485 Semiconductor device |