| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/05/2013 | US20130320509 Moisture barrier coatings |
| 12/05/2013 | US20130320506 Back-side contact formation |
| 12/05/2013 | US20130320504 Semiconductor integrated circuit apparatus having through silicon vias |
| 12/05/2013 | US20130320502 Semiconductor processing method and semiconductor structure |
| 12/05/2013 | US20130320496 Semiconductor device |
| 12/05/2013 | US20130320489 Semiconductor device and method for manufacturing the same |
| 12/05/2013 | US20130320488 System and method for forming aluminum fuse for compatibility with copper beol interconnect scheme |
| 12/05/2013 | US20130320486 Semiconductor device |
| 12/05/2013 | US20130320476 Miniaturized Implantable Sensor Platform Having Multiple Devices and Sub-Chips |
| 12/05/2013 | US20130320475 Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus |
| 12/05/2013 | US20130320391 Light-emitting device |
| 12/05/2013 | US20130320359 Heterogeneous stack structures with optical to electrical timing reference distribution |
| 12/05/2013 | US20130320340 Circuit technique to electrically characterize block mask shifts |
| 12/05/2013 | US20130320288 Semiconductor Constructions and Memory Arrays |
| 12/05/2013 | US20130320071 Apparatus and Method of Substrate to Substrate Bonding for Three Dimensional (3D) IC Interconnects |
| 12/05/2013 | DE112012001150T5 Elektronische Komponente Electronic component |
| 12/05/2013 | DE102013208318A1 Vorrichtungen auf Thyristorbasis, die widerstandsfähig gegen den Latch-Up-Effekt sind Thyristor-based devices that are resistant to the Latchup |
| 12/05/2013 | DE102013207488A1 ESD-Schutzvorrichtung für Schaltungen mit mehreren Versorgungsbereichen ESD protection device for circuits with multiple coverage areas |
| 12/05/2013 | DE102013105714A1 Monolithisch integrierter HEMT und Stromschutzvorrichtung Monolithically integrated HEMT and overcurrent protection device |
| 12/05/2013 | DE102013105635A1 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
| 12/05/2013 | DE102013105572A1 Kühlstruktur mit zwei Luftstromrichtungen Cooling structure with two air flow directions |
| 12/05/2013 | DE102013104824A1 Kontaktpad-Trägerstreifen und Verfahren zum Herstellen desselben The same contact pad carrier strips and methods for preparing |
| 12/05/2013 | DE102013103581A1 Semiconductor device i.e. semiconductor chip, has under bump metallization layer in electrical contact with contact pad, and passivation film arranged between contact pad and under bump metallization layer |
| 12/05/2013 | DE102013000223A1 Servoverstärker mit Wärmesenke, die zwei Sätze von Wärme abgebenden Platten aufweist, die lotrecht aufeinander stehen Servo amplifier heat sink, which has two sets of heat dissipating plates that are perpendicular to each other |
| 12/05/2013 | DE102012221025A1 Halbleitereinrichtung und Herstellungsverfahren derselben A semiconductor device and manufacturing method thereof |
| 12/05/2013 | DE102012209325A1 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls An opto-electronic module and method for producing an optoelectronic module |
| 12/05/2013 | DE102012209034A1 Elektronikmodul sowie Verfahren zur Herstellung eines solchen Elektronikmoduls, sowie elektronisches Steuergerät mit einem solchen Elektronikmodul Electronics module and to methods for producing such electronics module, as well as electronic control device with such a electronics module |
| 12/05/2013 | DE102012209033A1 Elektronikmodul sowie Verfahren zur Herstellung eines solchen Elektronikmoduls, sowie elektronisches Steuergerät mit einem solchen Elektronikmodul Electronics module and to methods for producing such electronics module, as well as electronic control device with such a electronics module |
| 12/05/2013 | DE102012104882A1 Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen, Leiterrahmenverbund und optoelektronisches Halbleiterbauteil A process for the production of optoelectronic semiconductor components, lead frame and optoelectronic composite semiconductor device |
| 12/05/2013 | DE102012104593A1 Semiconductor device has heat distribution plate which is comprised of solder layer comprising material with smaller modulus of elasticity than material of copper layer |
| 12/05/2013 | DE102012103571B4 Halbleiterstruktur mit Silicium-Durchkontaktierung und verringerter Elektromigration sowie Verfahren zur Herstellung einer solchen Semiconductor structure having silicon-via and reduced electromigration as well as methods for producing such |
| 12/05/2013 | DE102012010919A1 Microstructure radiator for e.g. CPU for computer, has cooling channel fin that is located centrally above heat-receiving location of microstructure radiator portion so as to allow inflowing coolant |
| 12/05/2013 | DE102009055882B4 Leistungshalbleitervorrichtung Power semiconductor device |
| 12/05/2013 | DE102008054094B4 Halbleiterbauelement mit einer integrierten Widerstandsstruktur A semiconductor device with an integrated resistor structure |
| 12/05/2013 | DE102007022338B4 Herstellungsverfahren für ein Leistungshalbleiterbauelement mit Metallkontaktschicht Manufacturing method for a power semiconductor component with a metal contact layer |
| 12/05/2013 | DE102006005033B4 Halbleiterbauelementanordnung mit einem Leistungstransistor und einer Temperaturmessanordnung A semiconductor device assembly comprising a power transistor and a temperature measurement arrangement |
| 12/05/2013 | CA2875262A1 Method and system for magnetic semiconductor solid state cooling |
| 12/04/2013 | EP2669945A1 Interposer die for semiconductor packaging |
| 12/04/2013 | EP2669944A2 Semiconductor package and stacked semiconductor package |
| 12/04/2013 | EP2669943A1 Methods and apparatus for providing transfer of a heat load between a heat source and a heat receiver |
| 12/04/2013 | EP2669942A2 Integrated circuit die assembly with heat spreader |
| 12/04/2013 | EP2669941A1 Circuit substrate and semiconductor device using same |
| 12/04/2013 | EP2669940A1 Substrate with though electrode and method for producing same |
| 12/04/2013 | EP2669938A2 Semiconductor device with an oxide solder flow prevention area on a substrate and corresponding manufacturing method |
| 12/04/2013 | EP2669936A1 Discrete semiconductor device package and manufacturing method |
| 12/04/2013 | EP2669935A2 Packaging substrate having interposer |
| 12/04/2013 | EP2669350A1 Composition containing quantum dot fluorescent body, molded body of quantum dot fluorescent body dispersion resin, structure containing quantum dot fluorescent body, light-emitting device, electronic apparatus, mechanical device, and method for producing molded body of quantum dot fluorescent body dispersion resin |
| 12/04/2013 | EP2668682A1 Battery adapter with flex circuit and silicone spring |
| 12/04/2013 | EP2668675A1 Light emitting device chip scale package |
| 12/04/2013 | EP2668664A1 Integrated circuit comprising an electrical through-plating and method for producing an electrical through-plating |
| 12/04/2013 | CN203327456U Heat radiation module |
| 12/04/2013 | CN203327375U Package substrate based on 3D printing |
| 12/04/2013 | CN203325903U Novel single-phase rectifier bridge |
| 12/04/2013 | CN203325902U Rectification module |
| 12/04/2013 | CN203325901U Bi-directional three-terminal solid discharge tube |
| 12/04/2013 | CN203325899U Printing detection tool |
| 12/04/2013 | CN203325898U Improved TO-92 MOD packaging lead wire framework |
| 12/04/2013 | CN203325897U Energy-saving conductive insert of automobile generator rectifier-bridge support |
| 12/04/2013 | CN203325896U Reverse charging-prevention photovoltaic diode |
| 12/04/2013 | CN203325895U Highly reliable rectification module |
| 12/04/2013 | CN203325894U Lens module group and mobile terminal applying the lens module group |
| 12/04/2013 | CN203325893U Lens module group and mobile terminal applying the lens module group |
| 12/04/2013 | CN203325892U Wafer particle |
| 12/04/2013 | CN203325891U Silicon controlled water-cooled heat sink for medium-frequency furnace |
| 12/04/2013 | CN203325890U Large-capacity SVG power unit with heat pipe radiator |
| 12/04/2013 | CN203325889U Heat radiation clip fixing structure and tool used for dismounting heat radiation clip |
| 12/04/2013 | CN203325888U Radiator for LED light source chip |
| 12/04/2013 | CN203325887U 半导体冷却装置 Semiconductor cooling device |
| 12/04/2013 | CN203325886U Diode with heat radiation outer shell |
| 12/04/2013 | CN203325885U Diode with heat radiation filament |
| 12/04/2013 | CN203325884U Diode with heat radiation plates |
| 12/04/2013 | CN203325883U Diode with heat radiation plates |
| 12/04/2013 | CN203325882U Diode with heat radiation bottom surface |
| 12/04/2013 | CN203325881U Chip socket |
| 12/04/2013 | CN203325880U Integrated circuit package system with film assistance |
| 12/04/2013 | CN203325879U Glue guiding slot of surface-mount component |
| 12/04/2013 | CN203325878U Integrated circuit packaging system with substrate |
| 12/04/2013 | CN203325877U Porcelain plate for manufacturing of refrigeration parts |
| 12/04/2013 | CN203325876U IC packaging structure and die for manufacturing same |
| 12/04/2013 | CN203325472U DRAM and semiconductor packaging part |
| 12/04/2013 | CN103430645A Method for manufacturing thermally conductive sheet, and thermally conductive sheet |
| 12/04/2013 | CN103430636A Through wiring substrate, electronic device package, and electronic component |
| 12/04/2013 | CN103430306A Semiconductor module and manufacturing method therefor |
| 12/04/2013 | CN103430305A Resin package |
| 12/04/2013 | CN103430304A An apparatus for monolithic power gating on an integrated circuit |
| 12/04/2013 | CN103430303A Lead frame for optoelectronic components and method for producing optoelectronic components |
| 12/04/2013 | CN103430302A Pressure unit |
| 12/04/2013 | CN103430301A Thermally enhanced stacked package and method |
| 12/04/2013 | CN103430300A Power electronic devices with edge passivation |
| 12/04/2013 | CN103429788A Metal foil provided with electrically resistive film, and method for producing same |
| 12/04/2013 | CN103429686A Moisture-proof insulative coating with visible light-blocking properties |
| 12/04/2013 | CN103429665A 可固化组合物 The curable composition |
| 12/04/2013 | CN103429634A Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for manufacturing same, semiconductor device, and led device |
| 12/04/2013 | CN103429046A Electronic component mounting module and power conversion apparatus |
| 12/04/2013 | CN103429044A Cooling device |
| 12/04/2013 | CN103427409A Surge protector |
| 12/04/2013 | CN103426934A Oxide thin film transistor, method for fabricating tft, array substrate for display device and method for fabricating the same |
| 12/04/2013 | CN103426900A Organic light-emitting display apparatus and method of manufacturing the same |
| 12/04/2013 | CN103426873A Multi-chip package and method of manufacturing same |
| 12/04/2013 | CN103426872A Semiconductor packaging part and manufacturing method thereof |