| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/16/2002 | US20020056916 Semiconductor integrated circuit device and the method of producing the same |
| 05/16/2002 | US20020056915 Base metal-gold wire for wire bonding in semiconductor fabrication |
| 05/16/2002 | US20020056913 Semiconductor device and method of fabricating the same |
| 05/16/2002 | US20020056912 Integrated circuit having a balanced twist for differential signal lines |
| 05/16/2002 | US20020056911 Semiconductor device |
| 05/16/2002 | US20020056910 Copper pad structure |
| 05/16/2002 | US20020056909 Semiconductor chip package and method of fabricating the same |
| 05/16/2002 | US20020056908 Heatpipesink having integrated heat pipe and heat sink |
| 05/16/2002 | US20020056907 Semiconductor integrated circuit device and its manufacturing method |
| 05/16/2002 | US20020056906 Flip chip assembly structure for semiconductor device and method of assembling therefor |
| 05/16/2002 | US20020056905 Semiconductor device and method of fabricating the same |
| 05/16/2002 | US20020056904 Semiconductor device and method of fabricating the same |
| 05/16/2002 | US20020056903 Semiconductor chip package and manufacturing method thereof |
| 05/16/2002 | US20020056901 Semiconductor device |
| 05/16/2002 | US20020056900 Electro-optical package with drop-in aperture |
| 05/16/2002 | US20020056899 Semiconductor chip and semiconductor device having a chip-on-chip structure |
| 05/16/2002 | US20020056898 Package with environmental control material carrier |
| 05/16/2002 | US20020056897 Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same |
| 05/16/2002 | US20020056896 LOC Semiconductor assembled with room temprature adhesive |
| 05/16/2002 | US20020056895 Semiconductor device and method of making same |
| 05/16/2002 | US20020056894 Leadframe having slots in a die pad |
| 05/16/2002 | US20020056893 Disposable mold runner gate for substrate based electronic packages |
| 05/16/2002 | US20020056892 Semiconductor package |
| 05/16/2002 | US20020056890 Formation of a metallic interlocking structure |
| 05/16/2002 | US20020056889 Method and apparatus for adjusting impedance of matching circuit |
| 05/16/2002 | US20020056887 Semiconductor device with reduced line-to-line capacitance and cross talk noise |
| 05/16/2002 | US20020056884 Vertical power devices having deep and shallow trenches and methods of forming same |
| 05/16/2002 | US20020056883 Radio frequency (RF) power devices having faraday shield layers therein |
| 05/16/2002 | US20020056880 Method for fabricating interconnect of capacitor |
| 05/16/2002 | US20020056879 Field effect transistor with an improved gate contact and method of fabricating the same |
| 05/16/2002 | US20020056872 Packaged power devices for radio frequency (RF) applications |
| 05/16/2002 | US20020056861 Semiconductor device and method for fabricating the same |
| 05/16/2002 | US20020056857 I/O cell placement method and semiconductor device |
| 05/16/2002 | US20020056856 Saw singulated leadless plastic chip carrier |
| 05/16/2002 | US20020056849 Submount having transmission line and method for forming |
| 05/16/2002 | US20020056845 Semiconductor photodiode and an optical receiver |
| 05/16/2002 | US20020056742 Methods and systems for attaching substrates to one another using solder structures having portions with different melting points |
| 05/16/2002 | US20020056741 Application of wire bonding technology on wafer bump, wafer level chip scale package structure and the method of manufacturing the same |
| 05/16/2002 | US20020056570 Molded stiffener for flexible circuit molding |
| 05/16/2002 | US20020056562 Bladder insert for encapsulant displacement |
| 05/16/2002 | US20020056561 Semiconductor device |
| 05/16/2002 | US20020056547 Fan motor and heat sink built-in type fan motor |
| 05/16/2002 | US20020056544 Heat sink with radial shape |
| 05/16/2002 | US20020056543 Cooling device with micro cooling fin |
| 05/16/2002 | US20020056542 Flat type heat pipe |
| 05/16/2002 | DE10147094A1 Kühlvorrichtung mit magnetischer Wärmeleitflüssigkeit Cooler with heat-conducting magnetic |
| 05/16/2002 | DE10145311A1 Cooling system for electronic components and switch boxes, at spinning and other textile machines, has a cooling pipe with the electronic component fitted at the cool end and a heat exchanger at the warm end |
| 05/16/2002 | DE10132543A1 Heisserhärtende fluorierte Dielektrika und mehrschichtige Leiterplatten Heisserhärtende fluorinated dielectrics and multilayer printed circuit boards |
| 05/16/2002 | DE10122931A1 Halbleitermodul Semiconductor module |
| 05/16/2002 | DE10055247A1 Vorrichtung und Verfahren zur Umhüllung eines elektronischen Bauelements Apparatus and method for coating an electronic component |
| 05/16/2002 | DE10055001A1 Speicheranordnung mit einem zentralen Anschlussfeld Memory array with a central connector panel |
| 05/16/2002 | DE10054109A1 Verfahren zum Bilden eines Substratkontakts in einem Feldeffekttransistor, der über einer vergrabenen Isolierschicht gebildet ist A method for forming a substrate contact in a field effect transistor which is formed over a buried insulating layer |
| 05/16/2002 | DE10053853A1 Electronic component, for use as ceramic module in mobile radio equipment, comprises covering unit and semiconductor chip and/or passive component arranged between substrate and upper covering plate of covering unit |
| 05/16/2002 | DE10053258A1 Heat sink for electronic device has evaporator and condenser heat exchangers connected in hermetically sealed heat sink circuit |
| 05/16/2002 | DE10052890A1 IC conductor path resistance reduction arrangement with connection between at least 2 conductor paths in different metallization planes |
| 05/16/2002 | DE10030144A1 Halbleitervorrichtung und zugehörige Einbaustruktur Semiconductor device and associated mounting structure |
| 05/15/2002 | EP1205983A1 A semiconductor photodiode and an optical receiver |
| 05/15/2002 | EP1205977A2 Memory device with central connecting area |
| 05/15/2002 | EP1205975A2 Compensating element for semiconductor integrated circuits |
| 05/15/2002 | EP1205974A2 I/O cell placement method and semiconductor device |
| 05/15/2002 | EP1205973A1 Low-profile semiconductor device and method for manufacturing the same |
| 05/15/2002 | EP1205972A1 Copper wiring |
| 05/15/2002 | EP1205971A2 Electronic component and method and structure for mounting semiconductor device |
| 05/15/2002 | EP1205970A2 Flip chip assembly structure for semiconductor device and method of assembling therefor |
| 05/15/2002 | EP1205451A1 Ceramic substrate for manufacture/inspection of semiconductor |
| 05/15/2002 | EP1205013A1 Solid-state laser cooling |
| 05/15/2002 | EP1204948A1 Secure microcontroller against attacks based on current consumption values |
| 05/15/2002 | EP1204946A1 Scratchproof coating for semiconductor components |
| 05/15/2002 | EP1204691A1 Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 05/15/2002 | EP1074173A4 Reverse cantilever spring clip |
| 05/15/2002 | EP0972268B1 Method for making a contactless card with antenna connected with soldered wires |
| 05/15/2002 | EP0798779B1 Ceramic circuit board |
| 05/15/2002 | CN1349660A Security method and device for a chip stack with a multidimensional structure |
| 05/15/2002 | CN1349659A Burless castellation via process and product for plastic chip carrier |
| 05/15/2002 | CN1349657A Controlled collapse chip connection (C4) integrated circuit package that has a filter which seals an underfill material |
| 05/15/2002 | CN1349258A High density design for organic chip carrier |
| 05/15/2002 | CN1349257A Embedded IC module |
| 05/15/2002 | CN1349256A IC chip package assembly |
| 05/15/2002 | CN1349253A Method for mfg. semiconductor device, and said seconductor device |
| 05/15/2002 | CN1348976A Binder and adhesive film |
| 05/15/2002 | CN1348972A Method for prodn. of epoxy resin composite used for optical semiconductor sealing |
| 05/15/2002 | CN1084918C Glass composition for insulation, insulation paste, and thick-film printed circuit |
| 05/15/2002 | CN1084917C Electrically conductive paste materials and applications |
| 05/14/2002 | US6388888 Semiconductor device and process for manufacturing the same, liquid crystal module and process for mounting the same |
| 05/14/2002 | US6388851 Electronic discharge protection of integrated circuits |
| 05/14/2002 | US6388341 Semiconductor device |
| 05/14/2002 | US6388340 Compliant semiconductor chip package with fan-out leads and method of making same |
| 05/14/2002 | US6388339 Sealed-by-resin type semiconductor device and liquid crystal display module including the same |
| 05/14/2002 | US6388336 Multichip semiconductor assembly |
| 05/14/2002 | US6388335 Integrated circuit package formed at a wafer level |
| 05/14/2002 | US6388334 System and method for circuit rebuilding via backside access |
| 05/14/2002 | US6388333 Semiconductor device having protruding electrodes higher than a sealed portion |
| 05/14/2002 | US6388331 Bond pad having reduced capacitance and method for reducing capacitance of a bond pad |
| 05/14/2002 | US6388330 Low dielectric constant etch stop layers in integrated circuit interconnects |
| 05/14/2002 | US6388329 Semiconductor integrated circuit having three wiring layers |
| 05/14/2002 | US6388328 Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system |
| 05/14/2002 | US6388326 Bonding pad on a semiconductor chip |
| 05/14/2002 | US6388325 Multi-layer interconnect |
| 05/14/2002 | US6388324 Self-repairing interconnections for electrical circuits |
| 05/14/2002 | US6388322 Article comprising a mechanically compliant bump |