| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/23/2002 | US20020060358 Package of an image sensor device |
| 05/23/2002 | US20020060357 Quad flat non-leaded package structure for housing CMOS sensor |
| 05/23/2002 | US20020060356 Power semiconductor device |
| 05/23/2002 | US20020060354 Semiconductor device and method for fabricating the same |
| 05/23/2002 | US20020060352 Semiconductor integrated circuit |
| 05/23/2002 | US20020060350 Thinfilm Fuse/ Antifuse Device and Use of Same in Printhead |
| 05/23/2002 | US20020060342 Semiconductor device with chamfered substrate and method of making the same |
| 05/23/2002 | US20020060323 Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof |
| 05/23/2002 | US20020060318 Routable high-density interfaces for integrated circuit devices |
| 05/23/2002 | US20020060160 Method and structure for producing bumps on an IC package substrate |
| 05/23/2002 | US20020060091 Ceramic circuit board and method of manufacturing the same |
| 05/23/2002 | US20020060085 Conductive cap, electronic component, and method of forming insulating film of conductive cap |
| 05/23/2002 | US20020060084 Flip-chip package with underfill dam that controls stress at chip edges |
| 05/23/2002 | US20020060064 Heat sink assembly |
| 05/23/2002 | US20020059723 Electronic package for electronic components and method of making same |
| 05/23/2002 | US20020059722 Method of mounting a semiconductor device to a substrate and a mounted structure |
| 05/23/2002 | US20020059721 Apparatus and method for printed circuit board repair |
| 05/23/2002 | DE10153666A1 High density contact arrangement for integrated circuit chips has diagonal layout to reduce separation |
| 05/23/2002 | DE10152589A1 Radiator plate for power module, has dispersant having smaller thermal expansion coefficient, that is dispersed more on heat receiving surface than that on heat radiating surface |
| 05/23/2002 | DE10115248A1 Wire bonding method for wafer level chip scale package, involves forming metal bump directly on metal pad which is provided on wafer surface, without forming under bump metallurgy layer |
| 05/23/2002 | DE10065895C1 Electronic component used as an integrated circuit comprises a screen for electromagnetic scattering, a semiconductor chip made from a semiconductor substrate and an electrically conducting trenched layer |
| 05/23/2002 | DE10058886C1 Production of an integrated semiconductor product used as ferroelectric random access memories comprises forming semiconductor wafer, molding connections, exposing the connections, applying protective layer and polishing |
| 05/23/2002 | DE10057973A1 Device for a clocked semiconductor chip has both cooling element and ferrite emitted radiation shield bound to the chip |
| 05/23/2002 | DE10057635A1 Method for processing a substrate comprises applying a photolacquer layer to the substrate and structuring so that some regions of the substrate are covered with the photolacquer |
| 05/23/2002 | DE10057435C1 Leakage current regulation circuit for FET's compares sum leakage current through parallel test FET's with required leakage current for bias voltage adjustment |
| 05/23/2002 | DE10056411C1 Abgleichelement für integrierte Halbleiterschaltungen Adjustment element for a semiconductor integrated circuit |
| 05/23/2002 | DE10056387A1 Cooling device for electronic component and production method has cooling fins fixed permanently on one side of the baseplate groove only |
| 05/23/2002 | DE10056297A1 Integrated semiconductor memory has connection pads which can support different functions in different stages of production |
| 05/23/2002 | DE10056281A1 Electronic component comprises a semiconductor chip having an active upper side with integrated circuits and a passive rear side without integrated circuits |
| 05/23/2002 | DE10055454A1 Cooling body for electronic components or devices having a heat emitting region formed by an open pore metal foam body |
| 05/23/2002 | DE10055177A1 Electronic component has separating walls between connecting leads |
| 05/22/2002 | EP1207727A2 Compliant laminate connector |
| 05/22/2002 | EP1207563A2 Direct bonding of flip-chip light-emitting diode and flip-chip ESD protection chip to electrodes in a package |
| 05/22/2002 | EP1207555A1 Flip-chip on film assembly for ball grid array packages |
| 05/22/2002 | EP1207554A1 Electronic part |
| 05/22/2002 | EP1207553A1 Fixing device for pressure contacted high power semiconductor device |
| 05/22/2002 | EP1207426A1 Method for aligning a semiconductor wafer |
| 05/22/2002 | EP1206825A1 Universal energy conditioning interposer with circuit architecture |
| 05/22/2002 | EP1206800A1 Microbeam assembly and associated method for integrated circuit interconnection to substrates |
| 05/22/2002 | EP1206799A1 Method for bottomless deposition of barrier layers in integrated circuit metallization schemes |
| 05/22/2002 | EP1206325A2 Vapor phase connection techniques |
| 05/22/2002 | CN2493000Y Pull fastening radiating fin fixture |
| 05/22/2002 | CN2492944Y Chip molding and packing apparatus |
| 05/22/2002 | CN1350703A Robust interconnect structure |
| 05/22/2002 | CN1350701A Method for handling thinned chips for introducing them into chip cards |
| 05/22/2002 | CN1350700A Process for mapping metal contaminant concentration on a silicon wafer surface |
| 05/22/2002 | CN1350330A Radiator and method for manufacturing the same and extrusion clamp |
| 05/22/2002 | CN1350329A Semiconductor devices and their method of production, and mounting method thereof |
| 05/22/2002 | CN1350325A Contact structure member and production method thereof, and probe contact assembly using said contact structure member |
| 05/22/2002 | CN1350323A Lead wire frame and method for manufacturing lead wire frame |
| 05/22/2002 | CN1350218A Fastener |
| 05/22/2002 | CN1350201A Wiring base plate, display device, semiconductor chip and electronic machine |
| 05/22/2002 | CN1350045A Binder and electric apparatus |
| 05/22/2002 | CN1350032A Epoxy resin composition and method of producing the same |
| 05/22/2002 | CN1350031A Fire-retardant resin composition, preliminary-dip piece, laminated board, metal cladded laminated board, printed circuit-board and multi-layer printed circuit board |
| 05/22/2002 | CN1350026A Phenol curing agent for epoxy resin and epoxy resin composition using said curing agent |
| 05/22/2002 | CN1085413C Semiconductor device and making method |
| 05/22/2002 | CN1085410C Integrated circuit with gate-array interconnections rounted over memory area |
| 05/22/2002 | CN1085409C Bottom-lead semiconductor or package |
| 05/22/2002 | CN1085408C Semiconductor package and cead frame |
| 05/22/2002 | CN1085406C 半导体器件 Semiconductor devices |
| 05/21/2002 | USRE37707 Leadframe with heat dissipator connected to S-shaped fingers |
| 05/21/2002 | US6393603 Circuit design method calculating antenna size of conductive member connected to gate oxide film of transistor with approximate expression |
| 05/21/2002 | US6392898 Package substrate |
| 05/21/2002 | US6392889 Fastener for heat sink |
| 05/21/2002 | US6392888 Heat dissipation assembly and method of assembling the same |
| 05/21/2002 | US6392887 PLGA-BGA socket using elastomer connectors |
| 05/21/2002 | US6392886 Heat sink assembly |
| 05/21/2002 | US6392530 Resistor array board |
| 05/21/2002 | US6392468 Electrically programmable fuse |
| 05/21/2002 | US6392429 Temporary semiconductor package having dense array external contacts |
| 05/21/2002 | US6392428 Wafer level interposer |
| 05/21/2002 | US6392309 Semiconductor device including solid state imaging device |
| 05/21/2002 | US6392308 Semiconductor device having bumper portions integral with a heat sink |
| 05/21/2002 | US6392307 Semiconductor device |
| 05/21/2002 | US6392306 Semiconductor chip assembly with anisotropic conductive adhesive connections |
| 05/21/2002 | US6392305 Chip scale package of semiconductor |
| 05/21/2002 | US6392304 Multi-chip memory apparatus and associated method |
| 05/21/2002 | US6392301 Chip package and method |
| 05/21/2002 | US6392300 Semiconductor device having an alignment mark formed on the uppermost layer of a multilayer wire |
| 05/21/2002 | US6392299 Integrated circuit and associated fabrication process |
| 05/21/2002 | US6392298 Functional lid for RF power package |
| 05/21/2002 | US6392295 Semiconductor device |
| 05/21/2002 | US6392294 Semiconductor device with stable protection coating |
| 05/21/2002 | US6392293 Semiconductor package with sloped outer leads |
| 05/21/2002 | US6392292 Multi-level stacked semiconductor bear chips with the same electrode pad patterns |
| 05/21/2002 | US6392291 Semiconductor component having selected terminal contacts with multiple electrical paths |
| 05/21/2002 | US6392290 Vertical structure for semiconductor wafer-level chip scale packages |
| 05/21/2002 | US6392289 Integrated circuit substrate having through hole markings to indicate defective/non-defective status of same |
| 05/21/2002 | US6392288 Lead frame for assembly for thin small outline plastic encapsulated packages |
| 05/21/2002 | US6392287 Semiconductor package and fabricating method thereof |
| 05/21/2002 | US6392286 Semiconductor chip packaging system and a semiconductor chip packaging method using the same |
| 05/21/2002 | US6392259 Semiconductor chip with surface covering |
| 05/21/2002 | US6392252 Semiconductor device |
| 05/21/2002 | US6392251 Test structures for identifying open contacts and methods of making the same |
| 05/21/2002 | US6392164 Multi-level circuit substrate, method for manufacturing same and method for adjusting a characteristic impedance therefor |
| 05/21/2002 | US6392163 Controlled-shaped solder reservoirs for increasing the volume of solder bumps |
| 05/21/2002 | US6392158 Structure equipped with electric contacts formed through said structure substrate and method for obtaining said structure |
| 05/21/2002 | US6392145 Semiconductor device including and integrated circuit housed in an array package having signal terminals arranged about centrally located power supply terminals |
| 05/21/2002 | US6392144 Micromechanical die attachment surcharge |