| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/28/2002 | US6396078 Semiconductor device with a tapered hole formed using multiple layers with different etching rates |
| 05/28/2002 | US6396076 Test structures for substrate etching |
| 05/28/2002 | US6396075 Transient fuse for change-induced damage detection |
| 05/28/2002 | US6396023 Airtight sealing method and airtight sealing apparatus for semiconductor laser element |
| 05/28/2002 | US6395998 Electronic package having an adhesive retaining cavity |
| 05/28/2002 | US6395996 Multi-layered substrate with a built-in capacitor design |
| 05/28/2002 | US6395994 Etched tri-metal with integrated wire traces for wire bonding |
| 05/28/2002 | US6395991 Column grid array substrate attachment with heat sink stress relief |
| 05/28/2002 | US6395983 Electronic packaging device and method |
| 05/28/2002 | US6395982 Leaded semiconductor device package for use in nonsoldering assembling |
| 05/28/2002 | US6395807 Blend with epoxy and silicone resins; semiconductors, integrated circuits |
| 05/28/2002 | US6395637 Method for fabricating a inductor of low parasitic resistance and capacitance |
| 05/28/2002 | US6395632 Etch stop in damascene interconnect structure and method of making |
| 05/28/2002 | US6395630 Stacked integrated circuits |
| 05/28/2002 | US6395629 Depositing titanium layer over a dielectric layer; depositing an aluminum layer on titanium layer; patterning and etching titanium and aluminum layers to form an interconnect signal line |
| 05/28/2002 | US6395627 Semiconductor device a burried wiring structure and process for fabricating the same |
| 05/28/2002 | US6395626 Method of forming bonding projecting electrodes |
| 05/28/2002 | US6395625 Method for manufacturing solder mask of printed circuit board |
| 05/28/2002 | US6395617 Method of manufacturing semiconductor device |
| 05/28/2002 | US6395616 Process and apparatus for revealing an alignment mark on an integrated circuit wafer |
| 05/28/2002 | US6395612 Semiconductor device and method of manufacturing the same |
| 05/28/2002 | US6395611 Inductor or low loss interconnect and a method of manufacturing an inductor or low loss interconnect in an integrated circuit |
| 05/28/2002 | US6395608 Heterojunction bipolar transistor and its fabrication method |
| 05/28/2002 | US6395607 Integrated circuit fabrication method for self-aligned copper diffusion barrier |
| 05/28/2002 | US6395584 Method for improving the liquid dispensing of IC packages |
| 05/28/2002 | US6395583 Nickel, copper, iron, or alloy thereof |
| 05/28/2002 | US6395582 Methods for forming ground vias in semiconductor packages |
| 05/28/2002 | US6395581 BGA semiconductor package improving solder joint reliability and fabrication method thereof |
| 05/28/2002 | US6395579 Encapsulating integrated circuits (ic's) by defining an encapsulation chamber about an ic die; filling the chamber with encapsulant; and controlling overflow of encapsulant by providing a collection cavity proximate to said chamber |
| 05/28/2002 | US6395578 Semiconductor package and method for fabricating the same |
| 05/28/2002 | US6395568 Method and apparatus for achieving bond pad crater sensing and ESD protection integrated circuit products |
| 05/28/2002 | US6395565 Multi-chip module system and method of fabrication |
| 05/28/2002 | US6395454 Integrated electrical circuit with passivation layer |
| 05/28/2002 | US6395391 Multilayer; metal substrate, adhesive layers |
| 05/28/2002 | US6395374 Method of making microwave, multifunction modules using fluoropolymer composite substrates |
| 05/28/2002 | US6395118 Method for manufacturing ceramic substrate and non-fired ceramic substrate |
| 05/28/2002 | US6394821 Anisotropic conductive film and production method thereof |
| 05/28/2002 | US6394820 Packaged device adapter assembly and mounting apparatus |
| 05/28/2002 | US6394638 Trench isolation for active areas and first level conductors |
| 05/28/2002 | US6394281 Hermetic sealing |
| 05/28/2002 | US6394175 Top mounted cooling device using heat pipes |
| 05/28/2002 | US6393853 Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms |
| 05/28/2002 | US6393714 Resistor arrays for mask-alignment detection |
| 05/28/2002 | US6393696 Method for manufacturing printed circuit board |
| 05/23/2002 | WO2002041679A2 Electromagnetic shielding and cooling device for printed circuit board |
| 05/23/2002 | WO2002041677A2 Cooling device, method for the production thereof, and device for carrying out this method |
| 05/23/2002 | WO2002041405A1 Semiconductor device with reduced line-to-line capacitance and cross talk noise |
| 05/23/2002 | WO2002041402A2 Discrete and packaged power devices for radio frequency (rf) applications and methods of forming same |
| 05/23/2002 | WO2002041397A2 Low profile integrated module interconnects |
| 05/23/2002 | WO2002041396A2 High performance heat sink configurations for use in high density packaging applications |
| 05/23/2002 | WO2002041395A2 A high-performance fin configuration for air-cooled heat dissipation device |
| 05/23/2002 | WO2002041394A2 Lid and heat spreader design for a semiconductor package |
| 05/23/2002 | WO2002041391A2 Amorphized barrier layer for integrated circuit interconnects |
| 05/23/2002 | WO2002041387A1 A method for attaching an integrated circuit on a silicon chip to a smart label |
| 05/23/2002 | WO2002041384A1 Chip mounting device and method of calibrating the device |
| 05/23/2002 | WO2002041379A1 Method of forming metal wiring and semiconductor manufacturing apparatus for forming metal wiring |
| 05/23/2002 | WO2002041335A2 High quality printed inductor on a package |
| 05/23/2002 | WO2002041082A1 Method for aligning a semiconductor wafer |
| 05/23/2002 | WO2002041015A1 Kit and method for cleaning socket connection terminal, and electronic part tester |
| 05/23/2002 | WO2002013284A3 Memory element and method for production of a memory element |
| 05/23/2002 | WO2002009173A3 Method of forming copper interconnect capping layers with improved interface and adhesion |
| 05/23/2002 | WO2001086722A3 Semiconductor component |
| 05/23/2002 | WO2001084629A3 Detector for computer tomographs |
| 05/23/2002 | WO2001045167A3 Integrated circuit package formed at a wafer level |
| 05/23/2002 | US20020062430 Memory configuration with a central connection area |
| 05/23/2002 | US20020061971 One-pack type epoxy resin composition and cured epoxy resin |
| 05/23/2002 | US20020061715 Modified plating solution for plating and planarization and process utilizing same |
| 05/23/2002 | US20020061665 Method and apparatus for vertically stacking and interconnecting ball grid array (BGA) electronic circuit devices |
| 05/23/2002 | US20020061659 Setting pressure of reactive gases containing ammonia and silane or silicon fluorides or trifluorosilane in a reaction chamber; forming a silicon nitride film on the surface of a pattern |
| 05/23/2002 | US20020061657 Method of manufacturing semiconductor device |
| 05/23/2002 | US20020061654 Etching method, semiconductor and fabricating method for the same |
| 05/23/2002 | US20020061653 Method for processing substrates |
| 05/23/2002 | US20020061645 Dual damascene interconnect |
| 05/23/2002 | US20020061644 Method of manufacturing an amorphized barrier layer for integrated circuit interconnects |
| 05/23/2002 | US20020061642 Forming resin layer having a sealing function on face with electrodes of semiconductor wafer which has plurality of semiconductor elements mounted thereon; grinding and thinning back face of semiconductor wafer |
| 05/23/2002 | US20020061640 Method of manufacturing passivation layer |
| 05/23/2002 | US20020061630 Methods for fabricating integrated circuit devices using antiparallel diodes to reduce damage during plasma processing |
| 05/23/2002 | US20020061629 Method of manufacturing multilayered ceramic substrate and green ceramic laminate |
| 05/23/2002 | US20020061620 Semiconductor device and method of manufacturing the same |
| 05/23/2002 | US20020061614 Method for producing circuit structures on a semiconductor substrate and semiconductor configuration with functional circuit structures and dummy circuit structures |
| 05/23/2002 | US20020061609 Semiconductor device, method of fabricating the same, and electronic apparatus |
| 05/23/2002 | US20020061608 Semiconductor device and a method of manufacturing the same and designing the same |
| 05/23/2002 | US20020061607 Methods of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip and packages formed thereby |
| 05/23/2002 | US20020061401 Conductive metal particles, conductive composite metal particles and applied products using the same |
| 05/23/2002 | US20020061392 Web process interconnect in electronic assemblies |
| 05/23/2002 | US20020061173 Platform and optical module, method of manufacture thereof, and optical transmission device |
| 05/23/2002 | US20020061129 Method and apparatus for correcting inclination of IC on semiconductor wafer |
| 05/23/2002 | US20020060902 HIgh performance heat sink configurations for use in high density packaging applications |
| 05/23/2002 | US20020060840 Optical semiconductor hermetic sealing package, optical semiconductor module and optical fiber amplifier |
| 05/23/2002 | US20020060699 Character input device based on a two-dimensional movememt sensor |
| 05/23/2002 | US20020060575 Shallow trench isolation step height detection method |
| 05/23/2002 | US20020060502 Rectifier unit of vehicle AC generator |
| 05/23/2002 | US20020060373 Resin-encapsulated semiconductor apparatus and process for its fabrication |
| 05/23/2002 | US20020060372 IC chip |
| 05/23/2002 | US20020060371 High-power semiconductor module, and use of such a high-power semiconductor module |
| 05/23/2002 | US20020060369 Board-on-chip packages with conductive foil on the chip surface |
| 05/23/2002 | US20020060367 Semiconductor apparatus and method for fabricating the same |
| 05/23/2002 | US20020060366 Multilayer wiring substrate having differential signal wires and a general signal wire in different planes |
| 05/23/2002 | US20020060362 Wiring structure in semiconductor device and method for forming the same |
| 05/23/2002 | US20020060361 Semiconductor package for three-dimensional mounting, fabrication method thereof , and semiconductor device |