| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/29/2002 | EP1209736A2 Semiconductor device and method of fabricating semiconductor device |
| 05/29/2002 | EP1209735A2 Semiconductor device and production process thereof |
| 05/29/2002 | EP1209732A2 Method to form an elevated S/D CMOS device by contacting S/D through a contact hole in the oxide |
| 05/29/2002 | EP1209725A2 High performance system-on-chip using post passivation process |
| 05/29/2002 | EP1209251A2 Temperature control system for wafer |
| 05/29/2002 | EP1209211A1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 05/29/2002 | EP1208607A1 Passivation of gan based fets |
| 05/29/2002 | EP1208605A1 Method for packaging a semiconductor chip containing sensors and resulting package |
| 05/29/2002 | EP1208595A2 Interconnect assemblies and methods |
| 05/29/2002 | EP0748519B1 Electronic package for isolated circuits |
| 05/29/2002 | DE10159685A1 Verdrahtungssubstrat, Verdrahtungsplatte und Montagestruktur für ein Verdrahtungssubstrat Wiring substrate, the wiring board and mounting structure for the wiring substrate |
| 05/29/2002 | DE10155447A1 Gleichrichtereinheit für einen Fahrzeugwechselstromgenerator Rectifier unit for a vehicle AC generator |
| 05/29/2002 | DE10152913A1 Metallized structure used for an optoelectronic integrated circuit having photo diodes comprises a titanium layer on a preexisting layer, and an aluminum layer on the titanium layer |
| 05/29/2002 | DE10136280A1 Integrierte Halbleiterschaltung A semiconductor integrated circuit |
| 05/29/2002 | DE10116510A1 Ultradünnfilm-Kapselung Ultra thin film encapsulation |
| 05/29/2002 | DE10065896A1 Electronic component used in flip-chip technology comprises a screen against electromagnetic scattering fields, and a semiconductor chip made from a semiconductor substrate having an active upper side and a passive rear side |
| 05/29/2002 | DE10058622A1 Gemouldetes elektronisches Bauelement Gemouldetes electronic component |
| 05/29/2002 | DE10058608A1 Leiterstreifenanordnung für ein gemouldetes elektronisches Bauelement und Verfahren zum Moulden Conductor strip assembly for a gemouldetes electronic device and method for Moulden |
| 05/29/2002 | DE10056871A1 Feldeffekttransistor mit verbessertem Gatekontakt und Verfahren zur Herstellung desselben Of the same field effect transistor with an improved gate contact and methods for preparing |
| 05/29/2002 | DE10056869A1 Halbleiterbauteil mit einer strahlungsabsorbierenden leitenden Schutzschicht und Verfahren zur Herstellung derselben A semiconductor device comprising a radiation-conducting protective layer and method of manufacturing the same |
| 05/29/2002 | DE10056868A1 Halbleiterbauteil mit verringerter Leitungskapazität und verringertem Übersprechrauschen Semiconductor device with reduced line capacitance and reduced crosstalk noise |
| 05/29/2002 | DE10055482A1 Film material made from insulating plastic used as a connecting material between electronic components has metal spikes, opposite lying surfaces |
| 05/29/2002 | DE10054873A1 Manufacture of contactless chip card with coil antenna, surrounds chip with cast dam which is subsequently filled to complete chip encapsulation |
| 05/29/2002 | DE10049274A1 Kühleinrichtung und Verfahren zu deren Herstellung Cooling device and process for their preparation |
| 05/29/2002 | CN2494038Y Heat-tube heat sink assembly |
| 05/29/2002 | CN2494037Y Improved heat sink |
| 05/29/2002 | CN2494036Y Heat sink assembly |
| 05/29/2002 | CN2494035Y CPU heat sink used on circuit board |
| 05/29/2002 | CN1351761A Fabrication of integrated circuit by selective deposition of procursor liquid |
| 05/29/2002 | CN1351530A Method and apparatus for deposition on and polishing of a semiconductor surface |
| 05/29/2002 | CN1351417A Electric inverter |
| 05/29/2002 | CN1351378A Semiconductor IC system |
| 05/29/2002 | CN1351376A Semiconductor modules and manufacture thereof |
| 05/29/2002 | CN1351369A Semiconductor device and making method |
| 05/29/2002 | CN1351325A Liquid crystal display device |
| 05/29/2002 | CN1351197A Metal fine machining apparatus and method |
| 05/29/2002 | CN1085892C Microwave integrated circuit passive element structure and method for reducing signal propagation losses |
| 05/29/2002 | CN1085891C Chip carrier and semiconductor device with it |
| 05/29/2002 | CN1085890C Chip-size semiconductor package and fabrication method thereof |
| 05/29/2002 | CN1085888C IC mounting/demounting system and mounting/demounting head therefor |
| 05/28/2002 | US6397375 Method for managing metal resources for over-the-block routing in integrated circuits |
| 05/28/2002 | US6396727 Integrated circuit having conductive paths of different heights formed from the same layer structure and method for forming the same |
| 05/28/2002 | US6396712 Method and apparatus for coupling circuit components |
| 05/28/2002 | US6396710 High density interconnect module |
| 05/28/2002 | US6396708 Circuit board frame and method of use thereof for manufacturing semiconductor device |
| 05/28/2002 | US6396707 Ball grid array package |
| 05/28/2002 | US6396701 Semiconductor unit and cooling device |
| 05/28/2002 | US6396700 Thermal spreader and interface assembly for heat generating component of an electronic device |
| 05/28/2002 | US6396699 Heat sink with chip die EMC ground interconnect |
| 05/28/2002 | US6396698 Retention module adapter |
| 05/28/2002 | US6396697 Heat dissipation assembly |
| 05/28/2002 | US6396696 Clip for heat sink |
| 05/28/2002 | US6396695 Clip for heat sink |
| 05/28/2002 | US6396693 Heat sink |
| 05/28/2002 | US6396557 Tape carrier package and liquid crystal display device |
| 05/28/2002 | US6396342 Microwave amplifier generating distortion-reduced high output microwave power |
| 05/28/2002 | US6396297 Electrical detection of V-groove width |
| 05/28/2002 | US6396294 Socket pin and socket for electrical testing of semiconductor packages |
| 05/28/2002 | US6396160 Fill strategies in the optical kerf |
| 05/28/2002 | US6396159 Semiconductor device |
| 05/28/2002 | US6396158 Semiconductor device and a process for designing a mask |
| 05/28/2002 | US6396157 Semiconductor integrated circuit device and manufacturing method thereof |
| 05/28/2002 | US6396156 Flip-chip bonding structure with stress-buffering property and method for making the same |
| 05/28/2002 | US6396155 Semiconductor device and method of producing the same |
| 05/28/2002 | US6396154 Semiconductor device |
| 05/28/2002 | US6396153 Circuit chip package and fabrication method |
| 05/28/2002 | US6396152 Semiconductor device and production method thereof |
| 05/28/2002 | US6396151 Partially-overlapped interconnect structure and method of making |
| 05/28/2002 | US6396150 Wiring structure of semiconductor device |
| 05/28/2002 | US6396149 Method for double-layer implementation of metal options in an integrated chip for efficient silicon debug |
| 05/28/2002 | US6396148 Electroless metal connection structures and methods |
| 05/28/2002 | US6396147 Semiconductor device with metal-oxide conductors |
| 05/28/2002 | US6396146 Semiconductor device and its manufacturing method |
| 05/28/2002 | US6396145 Semiconductor device and method for manufacturing the same technical field |
| 05/28/2002 | US6396144 Mounting structure of semiconductor device, and communication apparatus using the same |
| 05/28/2002 | US6396143 Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring board |
| 05/28/2002 | US6396142 Semiconductor device |
| 05/28/2002 | US6396141 Tape ball grid array with interconnected ground plane |
| 05/28/2002 | US6396140 Single reference plane plastic ball grid array package |
| 05/28/2002 | US6396139 Semiconductor package structure with exposed die pad |
| 05/28/2002 | US6396138 Chip array with two-sided cooling |
| 05/28/2002 | US6396136 Ball grid package with multiple power/ground planes |
| 05/28/2002 | US6396135 Substrate for use in semiconductor packaging |
| 05/28/2002 | US6396134 Interdigitated capacitor design for integrated circuit lead frames |
| 05/28/2002 | US6396133 Semiconductor device with heat-dissipating lead-frame and process of manufacturing same |
| 05/28/2002 | US6396132 Semiconductor device with improved interconnections between the chip and the terminals, and process for its manufacture |
| 05/28/2002 | US6396131 Stress reduction feature for LOC lead frame |
| 05/28/2002 | US6396130 Semiconductor package having multiple dies with independently biased back surfaces |
| 05/28/2002 | US6396129 Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package |
| 05/28/2002 | US6396127 Semiconductor package |
| 05/28/2002 | US6396125 Semiconductor device |
| 05/28/2002 | US6396123 Semiconductor device provided with on-chip decoupling condenser utilizing CMP dummy patterns |
| 05/28/2002 | US6396121 Structures and methods of anti-fuse formation in SOI |
| 05/28/2002 | US6396120 Silicon anti-fuse structures, bulk and silicon on insulator fabrication methods and application |
| 05/28/2002 | US6396119 Reduced RC delay between adjacent substrate wiring lines |
| 05/28/2002 | US6396116 Integrated circuit packaging for optical sensor devices |
| 05/28/2002 | US6396113 Active trench isolation structure to prevent punch-through and junction leakage |
| 05/28/2002 | US6396111 Semiconductor integrated circuit device having capacitor element |
| 05/28/2002 | US6396110 Semiconductor device with multiple emitter contact plugs |
| 05/28/2002 | US6396091 Chip scale package |