| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/30/2002 | WO2002023115A3 Enhanced surface structures for passive immersion cooling of integrated circuits |
| 05/30/2002 | WO2001073957A3 Battery-operated wireless-communication apparatus and method |
| 05/30/2002 | WO2001063646A3 Multi-layered multi-chip module |
| 05/30/2002 | WO2001043193B1 Dual-die integrated circuit package |
| 05/30/2002 | WO2001035718A9 System and method for product yield prediction |
| 05/30/2002 | US20020066070 Semiconductor structures and manufacturing methods |
| 05/30/2002 | US20020065965 Solderless electronics packaging and methods of manufacture |
| 05/30/2002 | US20020065616 Method for evaluating process chambers used for semiconductor manufacturing |
| 05/30/2002 | US20020065386 Glass transition temperature, low moisture absorption, adhesion |
| 05/30/2002 | US20020064960 Method for fabricating an integrated semiconductor product |
| 05/30/2002 | US20020064952 Staged aluminum deposition process for filling vias |
| 05/30/2002 | US20020064950 Method of making a semiconductor device |
| 05/30/2002 | US20020064942 Low pressure, low temperature, semiconductor gap filling process |
| 05/30/2002 | US20020064938 Method for fabricating semiconductor device |
| 05/30/2002 | US20020064935 Insulating film covering semiconductor chip other than surfaces of conductive sections, film including stress buffering layer in lateral direction of conductive sections to relax stress applied to bumps |
| 05/30/2002 | US20020064934 Method and structure for reducing contact aspect ratios |
| 05/30/2002 | US20020064932 Bond pad structure and its method of fabricating |
| 05/30/2002 | US20020064931 Method and apparatus for applying a protective over-coating to a ball-grid-array (BGA) structure |
| 05/30/2002 | US20020064930 Method for forming a solder bump, and process for fabricating a semiconductor device |
| 05/30/2002 | US20020064929 Novel passivation structure and its method of fabrication |
| 05/30/2002 | US20020064928 Method for manufacturing a high-frequency integrated circuit for reducing cross-talk and facilitating energy storage |
| 05/30/2002 | US20020064926 Method for manufacturing encapsulated electronic components, particularly integrated circuits |
| 05/30/2002 | US20020064922 High performance system-on-chip using post passivation process |
| 05/30/2002 | US20020064908 Semiconductor device and method of manufacturing the same |
| 05/30/2002 | US20020064907 Method of fabricating an encapsulant lock feature in integrated circuit packaging |
| 05/30/2002 | US20020064905 Wire bonding method and semiconductor package manufactured using the same |
| 05/30/2002 | US20020064904 Connecting method of semiconductor element and semiconductor device |
| 05/30/2002 | US20020064903 Semiconductor device, and a method of producing semiconductor device |
| 05/30/2002 | US20020064901 Semiconductor device and manufacturing method thereof |
| 05/30/2002 | US20020064899 Semiconductor device substrate and semiconductor device fabrication method |
| 05/30/2002 | US20020064674 Part |
| 05/30/2002 | US20020064618 Pure carbon fiber core and an outer jacket of substantially pure polymer, especially polyethylene, material. |
| 05/30/2002 | US20020064598 Method of depositing a thick titanium nitride film |
| 05/30/2002 | US20020064080 Semiconductor memory device |
| 05/30/2002 | US20020064064 Semiconductor device, a method of manufacturing the same and storage media |
| 05/30/2002 | US20020064029 Stacked power amplifier module |
| 05/30/2002 | US20020064026 Small gaps cooling technology |
| 05/30/2002 | US20020064024 Thermally conductive electronic device case |
| 05/30/2002 | US20020064007 Low substrate-noise electrostatic discharge protection circuits with bi-directional silicon diodes |
| 05/30/2002 | US20020063974 Alignment mark system for mass transport processes |
| 05/30/2002 | US20020063823 Low power consumption liquid crystal display substrate |
| 05/30/2002 | US20020063585 Integrated circuit including an inductive element having a large quality factor and being highly compact |
| 05/30/2002 | US20020063569 Semiconductor circuit extraction apparatus, autoplacement/routing apparatus, method therefor and library distribution system |
| 05/30/2002 | US20020063499 Radiator plate and process for manufacturing the same |
| 05/30/2002 | US20020063342 Pre-bond encapsulation of area array terminated chip and wafer scale packages |
| 05/30/2002 | US20020063340 Semiconductor device and method for producing the same |
| 05/30/2002 | US20020063338 Semiconductor device |
| 05/30/2002 | US20020063337 Barrier layer for copper metallization in integrated circuit fabrication |
| 05/30/2002 | US20020063336 Semiconductor device and method for manufacturing semiconductor device |
| 05/30/2002 | US20020063335 Semiconductor integrated circuit with dummy patterns |
| 05/30/2002 | US20020063334 Integrated circuit devices having a composite insulation layer and methods of manufacturing same |
| 05/30/2002 | US20020063333 Low capacitance wiring layout and method for making same |
| 05/30/2002 | US20020063332 Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure |
| 05/30/2002 | US20020063331 Film carrier semiconductor device |
| 05/30/2002 | US20020063330 Heat sink/heat spreader structures and methods of manufacture |
| 05/30/2002 | US20020063328 Apparatus for cooling semiconductor package |
| 05/30/2002 | US20020063327 Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication |
| 05/30/2002 | US20020063326 Electronic part unit and circuit board apparatus |
| 05/30/2002 | US20020063324 Semiconductor device, method of fabricating same, semiconductor device package construction, and method of mounting the semiconductor device |
| 05/30/2002 | US20020063323 Hydrogen getter for integrated microelectronic assembly |
| 05/30/2002 | US20020063322 Micromechanical getter anchor |
| 05/30/2002 | US20020063320 Molded electronic component |
| 05/30/2002 | US20020063319 Direct-downset flip-chip package assembly and method of fabricating the same |
| 05/30/2002 | US20020063318 Ball grid array (BGA) mounting device |
| 05/30/2002 | US20020063317 Tape carrier, semiconductor assembly, and semiconductor device, methods of manufacture thereof, and electronic instrument |
| 05/30/2002 | US20020063316 Semiconductor device and a method for manufacturing the same |
| 05/30/2002 | US20020063315 Quad flat non-leaded package and leadframe for the same |
| 05/30/2002 | US20020063314 Tapeless micro-leadframe |
| 05/30/2002 | US20020063312 Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materials |
| 05/30/2002 | US20020063311 Integrated circuits and methods for their fabrication |
| 05/30/2002 | US20020063306 Semiconductor device with a fuse box and method of manufacturing the same |
| 05/30/2002 | US20020063305 Semiconductor device having fuses or anti-fuses |
| 05/30/2002 | US20020063304 Semiconductor device |
| 05/30/2002 | US20020063296 Semiconductor integrated circuit system |
| 05/30/2002 | US20020063272 Semiconductor device having a test element, and method of manufacturing the same |
| 05/30/2002 | US20020063269 Graded-dielectric structures for phase-shifting high speed signals within microstrip structures |
| 05/30/2002 | US20020063264 Semiconductor device having chip scale package |
| 05/30/2002 | US20020063257 Flat package for semiconductor diodes |
| 05/30/2002 | US20020063251 Semiconductor device and testing method therefor |
| 05/30/2002 | US20020063250 Semiconductor device and method of inspecting the same |
| 05/30/2002 | US20020063249 Kerf contact to silicon redesign for defect isolation and analysis |
| 05/30/2002 | US20020063097 For forming an interconnection by embedding copper in fine interconnection groove defined in surface of semiconductor substrate through copper sulfate plating |
| 05/30/2002 | US20020062976 Conductor strip arrangement for a molded electronic component and process for molding |
| 05/30/2002 | US20020062973 Power semiconductor module |
| 05/30/2002 | US20020062971 Ultra-thin-film package |
| 05/30/2002 | US20020062970 I/c chip assembly |
| 05/30/2002 | US20020062950 Overplated thermally conductive part with EMI shielding |
| 05/30/2002 | US20020062949 Overplated thermally conductive part with EMI sheilding |
| 05/30/2002 | US20020062946 Heat radiation fin using a carbon fiber reinforced resin as heat radiation plates standing on a substrate |
| 05/30/2002 | US20020062918 Adhesives and electric devices |
| 05/30/2002 | US20020062904 To protect chip component within ceramic main body, first and second sealing are carried out between a metal case and ceramic main body so as to prevent contamination, toimprove shielding effect against external electromagnetic fields |
| 05/30/2002 | US20020062874 Clamping device, tool and method of mounting tools |
| 05/30/2002 | US20020062855 Used for removing heat from electronic devices |
| 05/30/2002 | US20020062649 Thermoelectric conversion device and method of manufacturing the same |
| 05/30/2002 | US20020062648 Apparatus for dense chip packaging using heat pipes and thermoelectric coolers |
| 05/30/2002 | US20020062549 Optimized metal fuse process |
| 05/29/2002 | EP1209743A2 Leadframe for a molded electronic device and molding process |
| 05/29/2002 | EP1209742A1 Power Semiconductor Module and application of such a Power Semiconductor Module |
| 05/29/2002 | EP1209741A2 Device for a clocked semiconductor chip |
| 05/29/2002 | EP1209739A2 Method for fabricating intermetal dielectric structures including air-gaps between metal leads |