| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/04/2002 | US6400023 Integration of low-k SiOF for damascene structure |
| 06/04/2002 | US6400022 Semiconductor device and fabrication process therefor and capacitor structure |
| 06/04/2002 | US6400021 Wafer level package and method for fabricating the same |
| 06/04/2002 | US6400019 Semiconductor device with wiring substrate |
| 06/04/2002 | US6400018 Via plug adapter |
| 06/04/2002 | US6400017 Semiconductor device and method for manufacturing same |
| 06/04/2002 | US6400016 Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate |
| 06/04/2002 | US6400015 Method of creating shielded structures to protect semiconductor devices |
| 06/04/2002 | US6400014 Semiconductor package with a heat sink |
| 06/04/2002 | US6400012 Heat sink for use in cooling an integrated circuit |
| 06/04/2002 | US6400010 Substrate including a metal portion and a resin portion |
| 06/04/2002 | US6400009 Hermatic firewall for MEMS packaging in flip-chip bonded geometry |
| 06/04/2002 | US6400008 Surface mount ic using silicon vias in an area array format or same size as die array |
| 06/04/2002 | US6400007 Stacked structure of semiconductor means and method for manufacturing the same |
| 06/04/2002 | US6400006 Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated component |
| 06/04/2002 | US6400004 Leadless semiconductor package |
| 06/04/2002 | US6400000 Semiconductor device with a diode, and method of manufacturing such a device |
| 06/04/2002 | US6399995 Solid state image sensing device |
| 06/04/2002 | US6399987 MOS transistor having self-aligned well bias area |
| 06/04/2002 | US6399975 Wide bit memory using post passivation interconnection scheme |
| 06/04/2002 | US6399958 Apparatus for visual inspection during device analysis |
| 06/04/2002 | US6399897 Multi-layer wiring substrate |
| 06/04/2002 | US6399894 Wire bond compensation |
| 06/04/2002 | US6399892 CTE compensated chip interposer |
| 06/04/2002 | US6399891 Alternating polyimide films, with a thermal expansion coefficient of 2-5 ppm/degrees c, and metal films; because thermal expansion coefficient is close to that of semiconductor element no breakage occurs at connecting parts |
| 06/04/2002 | US6399877 Heat sink |
| 06/04/2002 | US6399772 Vapor deposition |
| 06/04/2002 | US6399677 Comprising an epoxy resin, a curing agent, and an inorganic filler in the form of porous silica having a specific surface area of 6 to 200 m2/g, a true specific gravity of 2.0 to 2.2, and a mean particle size of 2-50 micro m |
| 06/04/2002 | US6399666 Insulative matrix material |
| 06/04/2002 | US6399512 Method of making metallization and contact structures in an integrated circuit comprising an etch stop layer |
| 06/04/2002 | US6399497 Semiconductor manufacturing process and semiconductor device |
| 06/04/2002 | US6399496 Depositing copper alloy seed layer on electronic device; bonding |
| 06/04/2002 | US6399494 Method of making a semiconductor device |
| 06/04/2002 | US6399489 Barrier layer deposition using HDP-CVD |
| 06/04/2002 | US6399479 Processes to improve electroplating fill |
| 06/04/2002 | US6399477 Semiconductor devices and methods for manufacturing semiconductor devices |
| 06/04/2002 | US6399475 Forming metal layer on semiconductor; nickel or cobalt alloyed with silver or palladium; stress resistance |
| 06/04/2002 | US6399472 Semiconductor device having a fuse and a fabrication method thereof |
| 06/04/2002 | US6399471 Assorted aluminum wiring design to enhance chip-level performance for deep sub-micron application |
| 06/04/2002 | US6399426 Semiconductor flip-chip package and method for the fabrication thereof |
| 06/04/2002 | US6399425 Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices |
| 06/04/2002 | US6399424 Method of manufacturing contact structure |
| 06/04/2002 | US6399423 Semiconductor device an a method of manufacturing the same |
| 06/04/2002 | US6399422 Radiating plate structure and method for manufacturing semiconductor devices using the same structure |
| 06/04/2002 | US6399421 Dual-dies packaging structure and packaging method |
| 06/04/2002 | US6399420 Ultra high density integrated circuit BLP stack and method for fabricating the same |
| 06/04/2002 | US6399419 Production of semiconductor device |
| 06/04/2002 | US6399418 Method for forming a reduced thickness packaged electronic device |
| 06/04/2002 | US6399416 Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 06/04/2002 | US6399415 Electrical isolation in panels of leadless IC packages |
| 06/04/2002 | US6399414 Method for forming semiconductor device |
| 06/04/2002 | US6399401 Test structures for electrical linewidth measurement and processes for their formation |
| 06/04/2002 | US6399286 Method of fabricating reduced critical dimension for conductive line and space |
| 06/04/2002 | US6399259 Method of forming alignment marks for photolithographic processing |
| 06/04/2002 | US6399230 Multilayer ceramic circuit boards with embedded resistors |
| 06/04/2002 | US6399220 Conformable nickel coating and process for coating an article with a conformable nickel coating |
| 06/04/2002 | US6399209 Integrated release films for phase-change interfaces |
| 06/04/2002 | US6399187 Metal-ceramics composite, heat dissipation device employing it, and processes for producing them |
| 06/04/2002 | US6399182 Die attachment utilizing grooved surfaces |
| 06/04/2002 | US6398929 Plasma reactor and shields generating self-ionized plasma for sputtering |
| 06/04/2002 | US6398892 Method of using pressure sensitive adhesive double coated sheet |
| 06/04/2002 | US6398856 Alkylenediamine or polyamine, hydrazine or hypophosphite reducing agent, and gold cyanide; direct thin film deposition on nickel metal or alloy solder ball; minimized drop of shear strength resulting from heat history |
| 06/04/2002 | US6397941 Net-shape molded heat exchanger |
| 06/04/2002 | US6397935 Flat type heat pipe |
| 06/04/2002 | US6397932 Liquid-cooled heat sink with thermal jacket |
| 06/04/2002 | US6397931 Finned heat exchanger |
| 06/04/2002 | US6397930 Apparatus to enhance cooling of electronic device |
| 06/04/2002 | US6397929 Apparatus to enhance cooling of electronic device |
| 06/04/2002 | US6397928 Apparatus to enhance cooling of electronic device |
| 06/04/2002 | US6397927 Apparatus to enhance cooling of electronic device |
| 06/04/2002 | US6397926 Heat sink, method manufacturing the same and cooling apparatus using the same |
| 06/04/2002 | US6397618 Cooling system with auxiliary thermal buffer unit for cooling an electronics module |
| 06/04/2002 | US6397459 Printed wiring board with mounted circuit elements using a terminal density conversion board |
| 06/04/2002 | US6397450 Method of cooling an electronic power module using a high performance heat exchanger incorporating metal foam therein |
| 06/04/2002 | CA2036241C Thin film electrical component |
| 05/30/2002 | WO2002043456A2 Interference mitigation through conductive thermoplastic composite materials |
| 05/30/2002 | WO2002043455A1 Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body |
| 05/30/2002 | WO2002043308A2 Electromagnetic noise reduction device |
| 05/30/2002 | WO2002043152A2 Poly fuse rom |
| 05/30/2002 | WO2002043150A1 Pad protective circuit |
| 05/30/2002 | WO2002043147A1 Integrated circuit configuration that is protected against analysis, and method for producing the configuration |
| 05/30/2002 | WO2002043146A1 Ferrite film |
| 05/30/2002 | WO2002043145A1 Integrated passive devices with reduced parasitic substrate capacitance |
| 05/30/2002 | WO2002043144A1 Structure for bonding pad and method for its fabrication |
| 05/30/2002 | WO2002043143A2 Method and device for cooling electronic components, for example, of integrated switching circuits |
| 05/30/2002 | WO2002043142A2 Packaged electronic component and method for packaging an electronic component |
| 05/30/2002 | WO2002043141A1 Method for hermetic sealing of electronic parts |
| 05/30/2002 | WO2002043138A1 Method and device for alignment |
| 05/30/2002 | WO2002043137A2 Bump formation method and bump forming apparatus to semiconductor wafer |
| 05/30/2002 | WO2002043136A1 Method for coating electronic parts |
| 05/30/2002 | WO2002043135A1 Semiconductor device and its manufacturing method |
| 05/30/2002 | WO2002043134A1 Method and system for manufacturing electronic packaging units |
| 05/30/2002 | WO2002043133A1 Alignment method for chip mounter |
| 05/30/2002 | WO2002043119A2 An ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device, a method for fabricating the same, and an electronic device containing the same |
| 05/30/2002 | WO2002043081A1 Electrical insulating plate, prepreg laminate and method for producing them |
| 05/30/2002 | WO2002042785A1 Control by excitation and display of a substance with modifiable absorbed wavelength |
| 05/30/2002 | WO2002042703A2 Liquid cooled heat exchanger with enhanced flow |
| 05/30/2002 | WO2002042240A2 A heat conductive material |
| 05/30/2002 | WO2002027792A3 Low inductive wire bond chip packaging |
| 05/30/2002 | WO2002023966A3 Method and apparatus for temperature gradient control in an electronic system |