| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/06/2002 | US20020068383 Chip size package semiconductor device and method of forming the same |
| 06/06/2002 | US20020068382 Method for mounting flip chip on circuit board through reliable electrical connections at low contact resistance |
| 06/06/2002 | US20020068380 Semiconductor device and manufacturing method thereof |
| 06/06/2002 | US20020068378 Metal foil laminated ic package |
| 06/06/2002 | US20020068375 Structure of a semiconductor module and method of manufacturing the same |
| 06/06/2002 | US20020068369 Intermediate structures in porous substrates in which electrical and optical microdevices are fabricated and intermediate structures formed by the same |
| 06/06/2002 | US20020068173 Silicone oligomer, a specified amount of metal hydrate such as aluminum hydroxide, and a resin; heat resistance, free of bromine compounds |
| 06/06/2002 | US20020067600 Circuit protection mechanism for CPU socket |
| 06/06/2002 | US20020067599 Single piece heat sink for computer chip |
| 06/06/2002 | US20020067598 Electronic assembly having a heat pipe that conducts heat from a semiconductor die |
| 06/06/2002 | US20020067596 Conduited heat dissipation device |
| 06/06/2002 | US20020067595 Electronic apparatus with built-in CPU |
| 06/06/2002 | US20020067313 High frequency communication device |
| 06/06/2002 | US20020067181 Probe card assembly and kit, and methods of making same |
| 06/06/2002 | US20020066966 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
| 06/06/2002 | US20020066965 Semiconductor chip having pads with plural junctions for different assembly methods |
| 06/06/2002 | US20020066964 Semiconductor device |
| 06/06/2002 | US20020066963 Ball-less clip bonding |
| 06/06/2002 | US20020066962 Method of manufacturing a semiconductor component and semiconductor component thereof |
| 06/06/2002 | US20020066960 Method of forming vias in silicon carbide and resulting devices and circuits |
| 06/06/2002 | US20020066959 Passivation scheme for bumped wafers |
| 06/06/2002 | US20020066957 Metallization structure on a fluorine-containing dielectric and a method for fabrication thereof |
| 06/06/2002 | US20020066955 Semiconductor device, manufacturing method thereof and mounting board |
| 06/06/2002 | US20020066954 Super low profile package with high efficiency of heat dissipation |
| 06/06/2002 | US20020066953 Insulating substrate including multilevel insulative ceramic layers joined with an intermediate layer |
| 06/06/2002 | US20020066952 Semiconductor device having an interconnecting post formed on an interposer within a sealing resin |
| 06/06/2002 | US20020066951 Electronic assembly providing shunting of electrical current |
| 06/06/2002 | US20020066950 Flip chip in leaded molded package with two dies |
| 06/06/2002 | US20020066949 BGA package and method of manufacturing the same |
| 06/06/2002 | US20020066948 Circuit board having interconnection ball lands and ball grid array (BGA) package using the circuit board |
| 06/06/2002 | US20020066947 Multimedia chip package |
| 06/06/2002 | US20020066946 Tape carrier package |
| 06/06/2002 | US20020066945 Solder clad lead frame for assembly of semiconductor devices and method |
| 06/06/2002 | US20020066944 Packaged semiconductor and process for manufacturing the same |
| 06/06/2002 | US20020066943 Lead frame for assembly for thin small outline plastic encapsulated packages |
| 06/06/2002 | US20020066942 Electronic component and utilization of a guard structure contained therein |
| 06/06/2002 | US20020066941 Semiconductor device and method of manufacturing the same capable of reducing deterioration of low dielectric constant film |
| 06/06/2002 | US20020066937 Structure of a semiconductor module and method of manufacturing the same |
| 06/06/2002 | US20020066927 Semiconductor device and method of manufacturing the same |
| 06/06/2002 | US20020066919 BEOL decoupling capacitor |
| 06/06/2002 | US20020066903 Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates |
| 06/06/2002 | US20020066883 Polyolefin and a thermoconductive filler, has specified softening point, thermoconductivity, viscosity and plasticitiy; use to cool heat-generating electronics, reversible change from solid to a paste or liquid |
| 06/06/2002 | US20020066881 Casting or embedding compound having electromagnetic shielding properties for manufacturing electronic components |
| 06/06/2002 | US20020066776 Method for forming end-face electrode |
| 06/06/2002 | US20020066592 Ball grid array package capable of increasing heat-spreading effect and preventing electromagnetic interference |
| 06/06/2002 | US20020066591 Electronic assembly providing shunting of electrical current |
| 06/06/2002 | US20020066584 Electric terminal for an electronic device |
| 06/06/2002 | US20020066550 High performance fan tail heat exchanger |
| 06/06/2002 | US20020066283 Refrigerated cooling apparatus for semiconductor device |
| 06/06/2002 | US20020066181 Semiconductor device and manufacturing method thereof |
| 06/06/2002 | US20020066175 Method of manufacturing inductor |
| 06/06/2002 | DE10151125A1 Anschlussstruktur und zugehöriges Herstellungsverfahren sowie die Anschlussstruktur verwendende Prüfanschlussanordnung Terminal structure and manufacturing method thereof, and the connection structure Prüfanschlussanordnung use |
| 06/06/2002 | DE10114652A1 Light metal extruded section for use as a cooler for electrical components has a heat-conducting body with teeth on a front side, a flat rear side and a laser welding-joint to join together single sections abutting in a butt joint |
| 06/06/2002 | DE10113497A1 Production of an integrated circuit used in the semiconductor industry comprises preparing a circuit substrate, forming bumps on the substrate, and providing metallized strips |
| 06/06/2002 | DE10059935A1 Dicht gepackte Halbleiterstruktur und Verfahren zum Herstellen einer solchen Densely packed semiconductor structure and method of making such a |
| 06/06/2002 | DE10059765A1 Assembly comprising component mounted on substrate and enclosing intermediate layer, has connecting structure containing aluminum |
| 06/06/2002 | DE10058593A1 Verpacktes elektronisches Bauelement und Verfahren zur Verpackung eines elektronischen Bauelements A packaged electronic device and method of packaging an electronic component |
| 06/06/2002 | DE10057918A1 Ferritfolie Ferrite film |
| 06/06/2002 | CA2714305A1 Spontaneous emission enhanced heat transport method and structures for cooling, sensing, and power generation |
| 06/05/2002 | EP1211921A2 Part for soldering to a printed wiring board |
| 06/05/2002 | EP1211799A1 Lc oscillator |
| 06/05/2002 | EP1211765A2 Hermetic sealing package for optical semiconductor module and optical fiber amplifier |
| 06/05/2002 | EP1211732A1 A parallel plate diode |
| 06/05/2002 | EP1211730A2 Stacked power amplifier module |
| 06/05/2002 | EP1211728A2 Semiconductor device and method of manufacturing the same |
| 06/05/2002 | EP1211723A2 Optimized metal fuse process in semiconductor device |
| 06/05/2002 | EP1211334A2 Electroless Ni-B plating liquid, electronic device and method for manufacturing the same |
| 06/05/2002 | EP1211292A1 Crosslinkable elastomer composition and molded article produced from the composition |
| 06/05/2002 | EP1211241A1 Prostaglandin e analogues |
| 06/05/2002 | EP1211011A1 Solder coating material and production method therefor |
| 06/05/2002 | EP1210852A1 Electronic device with heat generating parts and heat absorbing parts |
| 06/05/2002 | EP1210733A1 Method for producing via-connections in a substrate and substrate equipped with same |
| 06/05/2002 | EP1210732A1 Reduced electromigration and stress induced migration of cu wires by surface coating |
| 06/05/2002 | EP1210690A1 Electronic device comprising a chip fixed on a support and method for making same |
| 06/05/2002 | CN2494561Y Package structure of IC chip |
| 06/05/2002 | CN2494524Y Spherical mesh array heat-sink structure of CPU |
| 06/05/2002 | CN1352806A Improved RF power transistor |
| 06/05/2002 | CN1352805A Substrate with at least two metallized polymer bumps for soldered connection to wiring |
| 06/05/2002 | CN1352804A High-density electronic package and method for making same |
| 06/05/2002 | CN1352585A Method for producing radiator |
| 06/05/2002 | CN1086059C Stacking type semiconductor chip package |
| 06/04/2002 | US6400840 Non-lot based method for assembling integrated circuit devices |
| 06/04/2002 | US6400576 Sub-package bypass capacitor mounting for an array packaged integrated circuit |
| 06/04/2002 | US6400575 Integrated circuits packaging system and method |
| 06/04/2002 | US6400574 Molded ball grid array |
| 06/04/2002 | US6400573 Multi-chip integrated circuit module |
| 06/04/2002 | US6400572 Fastener for a heat sink |
| 06/04/2002 | US6400569 Heat dissipation in lead frames |
| 06/04/2002 | US6400566 Electronic device with heat generating parts and heat absorbing parts |
| 06/04/2002 | US6400565 Thermally conductive interface member |
| 06/04/2002 | US6400172 Semiconductor components having lasered machined conductive vias |
| 06/04/2002 | US6400037 Method of marking on metallic layer, metallic layer with marks thereon and semiconductor device having the metallic layer |
| 06/04/2002 | US6400035 Microwave semiconductor device with improved heat discharge and electrical properties and manufacturing method thereof |
| 06/04/2002 | US6400034 Semiconductor device |
| 06/04/2002 | US6400033 Reinforcing solder connections of electronic devices |
| 06/04/2002 | US6400032 Method and apparatus for packaging flip chip bare die on printed circuit boards |
| 06/04/2002 | US6400031 Semiconductor device having damascene interconnection structure that prevents void formation between interconnections |
| 06/04/2002 | US6400027 Semiconductor device having micro-wires designed for reduced capacitive coupling |
| 06/04/2002 | US6400026 For producing a high output such as a power mos transistor and an insulating gate bipolar transistor. |
| 06/04/2002 | US6400024 Method of providing a vertical interconnect between thin film microelectronic devices |