Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2013
12/10/2013US8604361 Component package for maintaining safe operating temperature of components
12/10/2013US8604360 Sealing body for a cable sleeve
12/10/2013US8604348 Method of making a connection component with posts and pads
12/10/2013US8604347 Board reinforcing structure, board assembly, and electronic device
12/10/2013US8603913 Porous dielectrics K value restoration by thermal treatment and or solvent treatment
12/10/2013US8603911 Semiconductor device and fabrication method thereof
12/10/2013US8603632 Diamond like carbon coating of substrate housings
12/05/2013WO2013181590A1 Metal finger capacitors with hybrid metal finger orientations in stack with unidirectional metal layers
12/05/2013WO2013180726A1 Controlling thermal interface material bleed out
12/05/2013WO2013180696A1 Device including substrate that absorbs stresses
12/05/2013WO2013180288A1 Substrate for mounting electronic element, and electronic device
12/05/2013WO2013180270A1 Heat sink
12/05/2013WO2013180247A1 Wiring board and electronic device
12/05/2013WO2013180064A1 Plating method, plating device, and storage medium
12/05/2013WO2013179943A1 Adhesive sheet for production of semiconductor device having bump electrodes and production method for semiconductor device
12/05/2013WO2013179879A1 Semiconductor module and semiconductor module manufacturing method
12/05/2013WO2013179875A1 Composite module
12/05/2013WO2013179840A1 Thermoelectric converter manufacturing method, manufacturing method of electronic device provided with thermoelectric converter, and thermoelectric converter
12/05/2013WO2013179767A1 Method of manufacturing image pickup device and method of manufacturing semiconductor device
12/05/2013WO2013179766A1 Imaging device, semiconductor device, and imaging unit
12/05/2013WO2013179765A1 Imaging device manufacturing method and semiconductor device manufacturing method
12/05/2013WO2013179764A1 Method for manufacturing imaging device and method for manufacturing semiconductor device
12/05/2013WO2013179638A1 Semiconductor module and production method for same
12/05/2013WO2013179547A1 Power semiconductor device
12/05/2013WO2013179527A1 Electronic component having shield case
12/05/2013WO2013179205A1 Semiconductor die package
12/05/2013WO2013179078A1 A packaged semiconductor device, a semiconductor device and a method of manufacturing a packaged semiconductor device
12/05/2013WO2013178529A2 Network of electronic devices assembled on a flexible support and communication method
12/05/2013WO2013178398A1 Methods and apparatus for providing transfer of a heat load between a heat source and a heat receiver
12/05/2013WO2013178380A1 Electronic module and method for producing such an electronic module and electronic control unit having such an electronic module
12/05/2013WO2013178379A1 Electronic module and method for producing such an electronic module and electronic control unit having such an electronic module
12/05/2013WO2013178011A1 A method of etching silicon recess of contact holes
12/05/2013WO2013177678A1 Method and system for magnetic semiconductor solid state cooling
12/05/2013WO2013154497A3 Cte matched interposer and method of making
12/05/2013WO2013150071A3 Cooling device
12/05/2013US20130324390 Scalable lead zirconium titanate (pzt) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material
12/05/2013US20130324069 Via density and placement in radio frequency shielding applications
12/05/2013US20130323519 Coatings for barrier films and methods of making and using the same
12/05/2013US20130323409 Systems and methods for controlling electromagnetic interference for integrated circuit modules
12/05/2013US20130323408 Systems and methods for providing electromagnetic interference shielding for integrated circuit modules
12/05/2013US20130322025 Semiconductor module and method for manufacturing the same
12/05/2013US20130320572 Isolation Rings for Packages and the Method of Forming the Same
12/05/2013US20130320571 Semiconductor device and manufacturing method thereof
12/05/2013US20130320570 Electronic device for power applications
12/05/2013US20130320569 Stacked semiconductor device
12/05/2013US20130320568 Semiconductor package and stacked semiconductor package
12/05/2013US20130320567 Batch process for three-dimensional integration
12/05/2013US20130320566 Integrated circuit packaging system with substrate and method of manufacture thereof
12/05/2013US20130320565 Interposer Die for Semiconductor Packaging
12/05/2013US20130320564 Avd hardmask for damascene patterning
12/05/2013US20130320563 Three dimensional memory structure
12/05/2013US20130320562 Semiconductor device
12/05/2013US20130320561 Plug via stacked structure, stacked substrate having via stacked structure and manufacturing method thereof
12/05/2013US20130320560 Distributed on-chip decoupling apparatus and method using package interconnect
12/05/2013US20130320558 Semiconductor device and method for manufacturing the same
12/05/2013US20130320557 Semiconductor package having reliable electrical connection and assembling method
12/05/2013US20130320556 Three Dimensional Integrated Circuit Structures and Hybrid Bonding Methods for Semiconductor Wafers
12/05/2013US20130320554 Semiconductor device and method of manufacturing thereof
12/05/2013US20130320553 Novel bead for 2.5d/3d chip packaging application
12/05/2013US20130320552 Integrated circuit fabrication
12/05/2013US20130320551 Discrete semiconductor device package and manufacturing method
12/05/2013US20130320550 Semiconductor device with air gap and method for fabricating the same
12/05/2013US20130320549 Semiconductor device with air gap and method for fabricating the same
12/05/2013US20130320548 Integrated circuit die assembly with heat spreader
12/05/2013US20130320547 Enabling package-on-package (pop) pad surface finishes on bumpless build-up layer (bbul) package
12/05/2013US20130320546 Dual-metal self-aligned wires and vias
12/05/2013US20130320545 Hybrid copper interconnect structure and method of fabricating same
12/05/2013US20130320544 Corrosion/etching protection in integration circuit fabrications
12/05/2013US20130320543 Semiconductor device manufacturing method and semiconductor device
12/05/2013US20130320542 Method of fabricating a self-aligned buried bit line for a vertical channel dram
12/05/2013US20130320541 Semiconductor device contact structures
12/05/2013US20130320540 Semiconductor device and method for manufacturing the same
12/05/2013US20130320539 Method and Apparatus for Back End of Line Semiconductor Device Processing
12/05/2013US20130320538 Integrated Circuit Substrates Comprising Through-Substrate Vias And Methods Of Forming Through-Substrate Vias
12/05/2013US20130320537 Through silicon via (tsv) structure and process thereof
12/05/2013US20130320536 Integrated circuit including wire structure, related method and design structure
12/05/2013US20130320535 Three-dimensional system-level packaging methods and structures
12/05/2013US20130320534 System-level packaging methods and structures
12/05/2013US20130320533 3d system-level packaging methods and structures
12/05/2013US20130320532 Chip package and method for forming the same
12/05/2013US20130320531 Stacked Integrated Chips and Methods of Fabrication Thereof
12/05/2013US20130320530 Semiconductor device with redistributed contacts
12/05/2013US20130320529 Reactive bonding of a flip chip package
12/05/2013US20130320528 Coaxial solder bump support structure
12/05/2013US20130320527 Semiconductor device and semiconductor device manufacturing method
12/05/2013US20130320526 Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
12/05/2013US20130320525 Integrated circuit packaging system with substrate and method of manufacture thereof
12/05/2013US20130320524 Design Scheme for Connector Site Spacing and Resulting Structures
12/05/2013US20130320523 Semiconductor Device and Method of Reflow Soldering for Conductive Column Structure in Flip Chip Package
12/05/2013US20130320522 Re-distribution Layer Via Structure and Method of Making Same
12/05/2013US20130320521 Releasable buried layer for 3-d fabrication and methods of manufacturing
12/05/2013US20130320520 Chemically altered carbosilanes for pore sealing applications
12/05/2013US20130320519 Semiconductor Device and Method of Backgrinding and Singulation of Semiconductor Wafer while Reducing Kerf Shifting and Protecting Wafer Surfaces
12/05/2013US20130320518 Wafer-level package and method of manufacturing the same
12/05/2013US20130320517 Lidded integrated circuit package
12/05/2013US20130320516 Semiconductor package and method of manufacturing the same
12/05/2013US20130320515 System, method and apparatus for leadless surface mounted semiconductor package
12/05/2013US20130320514 Package-in-Package for High Heat Dissipation Having Leadframes and Wire Bonds
12/05/2013US20130320513 Semiconductor package and fabrication method thereof
12/05/2013US20130320510 Durable, heat-resistant multi-layer coatings and coated articles
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