| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/13/2002 | US20020070441 Chip array with two-sided cooling |
| 06/13/2002 | US20020070440 Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal |
| 06/13/2002 | US20020070439 Semiconductor device |
| 06/13/2002 | US20020070438 Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array |
| 06/13/2002 | US20020070437 Intermediate base for a semiconductor module, a semiconductor module using the intermediate base and a method for producing the intermediate base |
| 06/13/2002 | US20020070436 Die pad for integrated circuits |
| 06/13/2002 | US20020070434 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication |
| 06/13/2002 | US20020070433 Lead-frame-based chip-scale package and method of manufacturing the same |
| 06/13/2002 | US20020070432 Electric connection structure for electronic power devices, and method of connection |
| 06/13/2002 | US20020070431 Sealed semiconductor device and lead frame used for the same |
| 06/13/2002 | US20020070429 Scribe line planarization layer |
| 06/13/2002 | US20020070423 Thin-film electronic component and motherboard |
| 06/13/2002 | US20020070421 Embedded gettering layer in shallow trench isolation structure |
| 06/13/2002 | US20020070419 Method of forming buried conductor patterns by surface transformation of empty spaces in solid state materials |
| 06/13/2002 | US20020070403 Structure and method for creating vertical capacitor and anti-fuse in dram process employing vertical array device cell complex |
| 06/13/2002 | US20020070401 Semiconductor storage device and method of fabricating thereof |
| 06/13/2002 | US20020070400 Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing same |
| 06/13/2002 | US20020070393 Preweakened on chip metal fuse using dielectric trenches for barrier layer isolation |
| 06/13/2002 | US20020070392 Electronic device, semiconductor device, and electrode forming method |
| 06/13/2002 | US20020070375 Stress tunable tantalum and tantalum nitride films |
| 06/13/2002 | US20020070262 Mounting film bulk acoustic resonators in microwave packages using flip chip bonding technology |
| 06/13/2002 | US20020070048 Adhesives and adhesive films |
| 06/13/2002 | US20020070047 Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices |
| 06/13/2002 | US20020070045 Interconnect system for electronic packages |
| 06/13/2002 | US20020070007 Liquid-cooled heat sink with thermal jacket |
| 06/13/2002 | US20020070006 Increased efficiency in liquid and gaseous planar device cooling technology |
| 06/13/2002 | US20020070005 Heat sink, method for manufacturing same, and pressing jig |
| 06/13/2002 | US20020069972 Method and apparatus for epoxy loc die attachment |
| 06/13/2002 | US20020069523 Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder and method of mounting the same |
| 06/13/2002 | DE10151151A1 Chip module has chip in contact with at least two opposing inner edges of frame, whereby chip is fixed to frame at only one of opposing inner edges by attachment arrangement |
| 06/13/2002 | DE10111185A1 Ceramic-metal substrate has profiling in metal layer for reducing thermodynamic stresses provided in vicinity of electrical components or contact elements |
| 06/13/2002 | DE10061840A1 Device has connecting pin with essentially straight soldering surface perpendicular to end surface formed by stamping pin with cut surface oriented away from soldering surface |
| 06/13/2002 | DE10059178A1 Verfahren zur Herstellung von Halbleitermodulen sowie nach dem Verfahren hergestelltes Modul A process for the production of semiconductor modules, and produced by the process module |
| 06/13/2002 | DE10059176A1 Intermediate carrier for semiconductor module has its lower surface provided with recesses for defining outer terminals cooperating with printed circuit board |
| 06/13/2002 | DE10059143A1 Oberflächenbehandlungs- und Deckschichtverfahren zur Herstellung einer Kupfergrenzfläche in einem Halbleiterbauteil Surface treatment and overcoat process for preparing a copper interface in a semiconductor device |
| 06/13/2002 | CA2429683A1 Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film, film for tab, and prepreg |
| 06/13/2002 | CA2427427A1 Enhanced interface thermoelectric coolers |
| 06/13/2002 | CA2364933A1 Novel high temperature underfilling material with low exotherm during use |
| 06/12/2002 | EP1213770A2 Moulded electronic component |
| 06/12/2002 | EP1213762A1 Electrical device isolation structure |
| 06/12/2002 | EP1213759A1 Method for forming a porous silicon dioxide film |
| 06/12/2002 | EP1213756A2 Fabrication process of semiconductor package and semiconductor package |
| 06/12/2002 | EP1213755A2 Fabrication process of semiconductor package and semiconductor package |
| 06/12/2002 | EP1213754A2 Fabrication process of semiconductor package and semiconductor package |
| 06/12/2002 | EP1213751A2 Semiconductor module with an interconnection structure |
| 06/12/2002 | EP1213750A2 Semiconductor device and method of manufacturing the same |
| 06/12/2002 | EP1213729A1 Inductor element |
| 06/12/2002 | EP1213641A2 Electronic apparatus with CPU |
| 06/12/2002 | EP1212929A1 Spray cooling system |
| 06/12/2002 | EP1212927A1 A printed circuit board assembly |
| 06/12/2002 | EP1212899A2 AN INTEGRATED RF MxN SWITCH MATRIX |
| 06/12/2002 | EP1212794A2 Method for producing an integrated circuit having at least one metalicized surface |
| 06/12/2002 | EP1212793A1 Method for producing a copper connection |
| 06/12/2002 | EP1212791A1 Method and structure for manufacturing improved yield semiconductor packaged devices |
| 06/12/2002 | EP1212726A1 Chip card module and chip card encompassing said module as well as a method for producing the chip card module |
| 06/12/2002 | EP0972307B1 Multi-chip device and method of fabrication employing leads over and under processes |
| 06/12/2002 | EP0920659B1 Semiconductor circuit secure against outside accesses |
| 06/12/2002 | EP0753101B1 Engine components including ceramic-metal composites |
| 06/12/2002 | CN1353865A Power feed and heat dissipating device for power semiconductor devices |
| 06/12/2002 | CN1353775A Copper alloy with improved resistance to cracking |
| 06/12/2002 | CN1353570A Fine-shaped heat radiator of electronic element |
| 06/12/2002 | CN1353459A Inductor for integrated circuit |
| 06/12/2002 | CN1353458A Semiconductor device without chip carrier and its preparing process |
| 06/12/2002 | CN1353457A Combined part of metal base |
| 06/12/2002 | CN1353456A Input/output element assembling method and semi-conductor equipment |
| 06/12/2002 | CN1353411A Liquid crystal dispaly apparatus |
| 06/11/2002 | US6405357 Method for positioning bond pads in a semiconductor die |
| 06/11/2002 | US6404660 Semiconductor package with a controlled impedance bus and method of forming same |
| 06/11/2002 | US6404649 Printed circuit board assembly with improved bypass decoupling for BGA packages |
| 06/11/2002 | US6404643 Article having an embedded electronic device, and method of making same |
| 06/11/2002 | US6404640 Liquid-cooled electronic apparatus |
| 06/11/2002 | US6404638 Small gaps cooling technology |
| 06/11/2002 | US6404635 Heat sink device fastening structure |
| 06/11/2002 | US6404634 Single piece heat sink for computer chip |
| 06/11/2002 | US6404633 Securing equipment for a heat dissipater of CPU |
| 06/11/2002 | US6404632 Mechanical configuration for retaining inboard mounting hardware on finned heat dissipating devices |
| 06/11/2002 | US6404611 Single-chip integrated circuit module |
| 06/11/2002 | US6404566 Apparatus and method for assembling optical devices |
| 06/11/2002 | US6404216 Test contact |
| 06/11/2002 | US6404070 Semiconductor device |
| 06/11/2002 | US6404069 Use of oxide surface to facilitate gate break on a carrier substrate for a semiconductor device |
| 06/11/2002 | US6404068 (a) a thermoplastic resin, (b) an epoxy resin, (c) a coupling agent, (d) a powdery inorganic filler, (e) a powder having rubber elasticity and (f) an organic solvent; low water vapor permeability |
| 06/11/2002 | US6404067 Plastic ball grid array package with improved moisture resistance |
| 06/11/2002 | US6404066 Semiconductor device and process for manufacturing the same |
| 06/11/2002 | US6404065 Electrically isolated power semiconductor package |
| 06/11/2002 | US6404064 Flip-chip bonding structure on substrate for flip-chip package application |
| 06/11/2002 | US6404063 Die-to-insert permanent connection and method of forming |
| 06/11/2002 | US6404062 Semiconductor device and structure and method for mounting the same |
| 06/11/2002 | US6404060 Semiconductor device having a chip-on-chip structure |
| 06/11/2002 | US6404059 Semiconductor device having a mounting structure and fabrication method thereof |
| 06/11/2002 | US6404058 Semiconductor device having interconnection implemented by refractory metal nitride layer and refractory metal silicide layer and process of fabrication thereof |
| 06/11/2002 | US6404057 Tantalum - aluminum - nitrogen material for semiconductor devices |
| 06/11/2002 | US6404056 Semiconductor integrated circuit |
| 06/11/2002 | US6404055 Semiconductor device with improved metal interconnection and method for forming the metal interconnection |
| 06/11/2002 | US6404054 Tungsten layer formation method for semiconductor device and semiconductor device using the same |
| 06/11/2002 | US6404053 Utilization of energy absorbing layer to improve metal flow and fill in a novel interconnect structure |
| 06/11/2002 | US6404052 Multi-layer flexible printed wiring board |
| 06/11/2002 | US6404051 Semiconductor device having a protruding bump electrode |
| 06/11/2002 | US6404050 Commonly housed diverse semiconductor |
| 06/11/2002 | US6404049 Semiconductor device, manufacturing method thereof and mounting board |