| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/18/2002 | US6407396 Wafer metrology structure |
| 06/18/2002 | US6407381 Wafer scale image sensor package |
| 06/18/2002 | US6407344 Multilayer circuit board |
| 06/18/2002 | US6407343 Multilayer wiring board |
| 06/18/2002 | US6407341 Conductive substructures of a multilayered laminate |
| 06/18/2002 | US6407340 Electric conductor with a surface structure in the form of flanges and etched grooves |
| 06/18/2002 | US6407334 I/C chip assembly |
| 06/18/2002 | US6407333 Wafer level packaging |
| 06/18/2002 | US6407011 Stacked dielectric film |
| 06/18/2002 | US6406997 Chromium films and chromium film overlayers |
| 06/18/2002 | US6406992 Fabrication method for a dual damascene structure |
| 06/18/2002 | US6406990 Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier |
| 06/18/2002 | US6406989 Method of fabricating semiconductor device with bump electrodes |
| 06/18/2002 | US6406948 Method for forming an ESD protection network for SOI technology with the ESD device formed in an underlying silicon substrate |
| 06/18/2002 | US6406944 Method of fabricating a reinforcement of lead bonding in microelectronic packages |
| 06/18/2002 | US6406943 Transverse hybrid LOC package |
| 06/18/2002 | US6406942 Flip chip type semiconductor device and method for manufacturing the same |
| 06/18/2002 | US6406938 Semiconductor and flip chip packages and method having a back-side connection |
| 06/18/2002 | US6406937 Method for producing an electrical connection between the front and rear sides of semiconductor chips |
| 06/18/2002 | US6406936 Method for increasing trace rows of a ball grid array |
| 06/18/2002 | US6406934 Wafer level production of chip size semiconductor packages |
| 06/18/2002 | US6406791 Mixture of titanate and glass |
| 06/18/2002 | US6406790 Metal impregnated with carbon fibers |
| 06/18/2002 | US6406778 Multi-thickness, multi-layer green sheet lamination and method thereof |
| 06/18/2002 | US6406774 Electrically conductive composition for use in through hole of electric component |
| 06/18/2002 | US6406746 Microcapsulating conductive metal particles with polymerized monomers |
| 06/18/2002 | US6405794 Acoustic convection apparatus |
| 06/18/2002 | US6405792 Compact fluid to fluid heat exchanger |
| 06/18/2002 | US6405429 Microbeam assembly and associated method for integrated circuit interconnection to substrates |
| 06/18/2002 | CA2232425C Functionally gradient material and its use in a semiconductor circuit substrate |
| 06/18/2002 | CA2060563C Process for mounting miniature electronic components with weld connection tabs on a flexible substrate |
| 06/13/2002 | WO2002047451A2 Conduited heat dissipation device |
| 06/13/2002 | WO2002047209A1 Contact structure and production method thereof and probe contact assembly using same |
| 06/13/2002 | WO2002047177A2 Enhanced interface thermoelectric coolers |
| 06/13/2002 | WO2002047176A2 Enhanced interface thermoelectric coolers |
| 06/13/2002 | WO2002047167A1 Semiconductor device |
| 06/13/2002 | WO2002047164A2 Integrated circuit with reduced substrate coupling |
| 06/13/2002 | WO2002047163A2 Semiconductor device having a ball grid array and method therefor |
| 06/13/2002 | WO2002047162A2 Microelectronic package having an integrated heat sink and build-up layers |
| 06/13/2002 | WO2002047161A2 Barrier against overflow for fixing adhesive of a semiconductor chip |
| 06/13/2002 | WO2002047158A2 Ionized metal plasma deposition process having enhanced via sidewall coverage |
| 06/13/2002 | WO2002047151A2 Method for making a semiconductor chip using an integrated rigidity layer |
| 06/13/2002 | WO2002047139A2 Methode of forming a copper film on a substrate |
| 06/13/2002 | WO2002046843A1 Method of aligning a photolithographic mask to a crystal plane |
| 06/13/2002 | WO2002046810A1 Semiconductor device and method for manufacture thereof |
| 06/13/2002 | WO2002046677A1 Cooling system and heat absorbing device |
| 06/13/2002 | WO2002046312A1 Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film, film for tab, and prepreg |
| 06/13/2002 | WO2002046264A1 Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them |
| 06/13/2002 | WO2002027788A3 Structure and process for reducing die corner and edge stresses in microelectronic packages |
| 06/13/2002 | WO2002003456A3 Semiconductor device and method of formation |
| 06/13/2002 | US20020073391 Semiconductor device having dummy pattern |
| 06/13/2002 | US20020073388 Methodology to improve the performance of integrated circuits by exploiting systematic process non-uniformity |
| 06/13/2002 | US20020072866 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture |
| 06/13/2002 | US20020072250 Methods of manufacturing integrated circuit devices having an encapsulated insulation layer |
| 06/13/2002 | US20020072233 Semiconductor device and method of manufacturing the same |
| 06/13/2002 | US20020072226 Manufacturing method of a semiconductor device |
| 06/13/2002 | US20020072222 Method for preventing Cu cross contamination |
| 06/13/2002 | US20020072221 Semiconductor device and method for manufacturing the same |
| 06/13/2002 | US20020072218 Surface treatment and capping layer process for producing a copper interface in a semiconductor device |
| 06/13/2002 | US20020072214 Semiconductor device and method of fabrication thereof, circuit board, and electronic equipment |
| 06/13/2002 | US20020072212 Multilayer semiconductor supports comprising silicones, epoxy resins, acrylic polymers, polyurethane, polyesters, polybutadiene and/or blends having fillers particles such as alumina |
| 06/13/2002 | US20020072211 Method of manufacturing semiconductor devices |
| 06/13/2002 | US20020072202 Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card |
| 06/13/2002 | US20020072195 Semiconductor device having a marking recess and method of manufacturing the same |
| 06/13/2002 | US20020072193 Method of aligning a photolithographic mask to a crystal plane |
| 06/13/2002 | US20020072189 Via capacitor |
| 06/13/2002 | US20020072188 Non-volatile resistance variable devices and method of forming same, analog memory devices and method of forming same, programmable memory cell and method of forming same, and method of structurally changing a non-volatile device |
| 06/13/2002 | US20020072154 Antifuse with improved radiation SEDR |
| 06/13/2002 | US20020072152 Semiconductor package and semiconductor package fabrication method |
| 06/13/2002 | US20020072150 Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member |
| 06/13/2002 | US20020072148 Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate |
| 06/13/2002 | US20020072147 High-frequency circuit board unit, high frequency module using the same unit, electronic apparatus using the same module, and manufacturing method for the high-frequency circuit board unit |
| 06/13/2002 | US20020072145 Semiconductor device |
| 06/13/2002 | US20020072143 Method of producing vacuum container |
| 06/13/2002 | US20020072137 Optosemiconductor device and the method for its manufacture |
| 06/13/2002 | US20020072132 Semiconductor integrated circuit |
| 06/13/2002 | US20020071961 Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components |
| 06/13/2002 | US20020071935 Provides contact surface between the solder pad and solder paste to produce wetting effect, for forming strong bonding force and enhancing conductivity |
| 06/13/2002 | US20020071642 Installation structure and method for optical parts and electric parts |
| 06/13/2002 | US20020071293 Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods a of forming power transistor |
| 06/13/2002 | US20020071256 Electronic circuit housing with trench vias and method of fabrication therefor |
| 06/13/2002 | US20020071253 Symmetrical package for semiconductor die |
| 06/13/2002 | US20020071238 Multi-layer capacitor, wiring board, and high-frequency circuit |
| 06/13/2002 | US20020070838 Over-voltage protection for electronic circuits |
| 06/13/2002 | US20020070747 Semiconductor package for chip with testing contact pad |
| 06/13/2002 | US20020070742 Universal wafer carrier for wafer level die burn-in |
| 06/13/2002 | US20020070462 Ball grid array type semiconductor package having a flexible substrate |
| 06/13/2002 | US20020070461 Semiconductor device and manufacturing method thereof |
| 06/13/2002 | US20020070458 Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same |
| 06/13/2002 | US20020070457 Metal contact structure in semiconductor device and method for forming the same |
| 06/13/2002 | US20020070456 Semiconductor device having interconnection implemented by refractory metal nitride layer and refractory metal silicide layer and process of fabrication thereof |
| 06/13/2002 | US20020070455 Semiconductor device and method for manufacturing same |
| 06/13/2002 | US20020070453 Semiconductor device and method of producing thereof |
| 06/13/2002 | US20020070451 Semiconductor device having a ball grid array and method therefor |
| 06/13/2002 | US20020070450 Bond pad structure for integrated circuits |
| 06/13/2002 | US20020070448 I/C package / thermal-solution retention mechanism with spring effect |
| 06/13/2002 | US20020070446 Semiconductor device and method for the production thereof |
| 06/13/2002 | US20020070445 Enveloped thermal interface with metal matrix components |
| 06/13/2002 | US20020070444 Thermal transfer plate |
| 06/13/2002 | US20020070443 Microelectronic package having an integrated heat sink and build-up layers |