| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/20/2002 | US20020074637 Stacked flip chip assemblies |
| 06/20/2002 | US20020074634 Thin, small-sized power semiconductor package |
| 06/20/2002 | US20020074633 Interconnection of active and passive components in substrate |
| 06/20/2002 | US20020074632 Interdigitated capacitor design for integrated circuit lead frames |
| 06/20/2002 | US20020074630 Semiconductor device having protruding electrodes higher than a sealed portion |
| 06/20/2002 | US20020074629 High speed IC package configuration |
| 06/20/2002 | US20020074628 Flexible wiring film, and semiconductor apparatus and system using the same |
| 06/20/2002 | US20020074627 Molded plastic package with heat sink and enhanced electrical performance |
| 06/20/2002 | US20020074625 Process of using siloxane dielectric films in the integration of organic dielectric films in electronic devices |
| 06/20/2002 | US20020074622 Ammonia gas passivation on nitride encapsulated devices |
| 06/20/2002 | US20020074619 Integrated semiconductor circuit, in particular a semiconductor memory circuit, having at least one integrated electrical antifuse structure, and a method of producing the structure |
| 06/20/2002 | US20020074618 Fuse with low fusing current and method |
| 06/20/2002 | US20020074615 Circuit substrate, detector, and method of manufacturing the same |
| 06/20/2002 | US20020074611 Semiconductor integrated circuit device |
| 06/20/2002 | US20020074605 Integrated electromagnetic shielding device |
| 06/20/2002 | US20020074587 Semiconductor device having capacitive element and manufacturing method thereof |
| 06/20/2002 | US20020074575 Integrated circuit arrangement |
| 06/20/2002 | US20020074566 Bonding pad structure to avoid probing damage |
| 06/20/2002 | US20020074564 Gate length control for semiconductor chip design |
| 06/20/2002 | US20020074545 Apparatus for detecting the width of a v-groove formed in a semiconductor wafer |
| 06/20/2002 | US20020074540 Contact structure in semiconductor integrated circuit and method for forming the same |
| 06/20/2002 | US20020074319 Laser-trimmable digital resistor |
| 06/20/2002 | US20020074309 Integrated low k dielectrics and etch stops |
| 06/20/2002 | US20020074163 Mounting structure of a semiconductor device, and a process for mounting a semiconductor device on a mounting substrate |
| 06/20/2002 | US20020074162 Substrate layout method and structure for reducing cross talk of adjacent signals |
| 06/20/2002 | US20020074161 Interconnect |
| 06/20/2002 | US20020074147 Bump chip lead frame and package |
| 06/20/2002 | US20020074146 Semiconductor device, methods of production of the same, and method of mounting a component |
| 06/20/2002 | US20020074145 System and method for converting a DC input voltage to a DC ouput voltage |
| 06/20/2002 | US20020074144 High-frequency current suppression body using magnetic loss material exhibiting outstanding complex permeability characteristics |
| 06/20/2002 | US20020074081 Microelectronic packaging methods and components |
| 06/20/2002 | DE3448573C2 Mfg. semiconductor component with thin film transistor |
| 06/20/2002 | DE10133660A1 Multilayer circuit module for wireless communication system has passive high frequency components and passive base component layer |
| 06/20/2002 | DE10125362A1 Method for mounting an electronic component e.g. microchip on carrier e.g. printed circuit board, involves making simultaneous contact between component's contacts and those of the printed circuit board. |
| 06/20/2002 | DE10062399A1 Multilayer contact system comprises a contact metallization deposited on a semiconductor substrate, a barrier layer deposited on the metallization, a bond metallization, and a protective metallization made from composite material |
| 06/20/2002 | DE10060652C1 Unauthorized modification indication circuit for protecting electronic component or circuit has loading detector adopting detectable permanent condition when loading exceeds given value |
| 06/20/2002 | CA2430888A1 Nanosensors |
| 06/19/2002 | EP1215726A2 Interconnection method and structure |
| 06/19/2002 | EP1215725A2 Assembly apted to support electric devices and contactless transponder |
| 06/19/2002 | EP1215724A1 Wire bonded semiconductor device with low capacitance coupling |
| 06/19/2002 | EP1215723A1 Process for producing epoxy resin composition for photosemiconductor element encapsulation |
| 06/19/2002 | EP1215720A2 Integrated circuit test structure |
| 06/19/2002 | EP1215719A2 Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal |
| 06/19/2002 | EP1215718A2 Novel high temperature underfilling material with low exotherm during use |
| 06/19/2002 | EP1214742A1 Semiconductive chip having a bond pad located on an active device |
| 06/19/2002 | EP1214741A2 Control device, particularly for use in automotive engineering |
| 06/19/2002 | EP1214740A1 Protective layer for a semiconductor device |
| 06/19/2002 | CN1354890A Method for producing portable electronic device with integrated circuit protected by photosensitive resin |
| 06/19/2002 | CN1354524A Package structure for integrated circuit |
| 06/19/2002 | CN1354520A 半导体集成电路 The semiconductor integrated circuit |
| 06/19/2002 | CN1354518A Multiwafer integrated circuit package structure |
| 06/19/2002 | CN1354516A Static discharge protecting element and related circuit |
| 06/19/2002 | CN1354515A Semiconductor package whose conductor possesses concave portion |
| 06/19/2002 | CN1354514A High power semi-conductor module and its use |
| 06/19/2002 | CN1354513A Radiating structure for semiconductor device |
| 06/19/2002 | CN1354512A Semiconductor package with radiating structure |
| 06/19/2002 | CN1354511A Semiconductor package whose package sealant possesses shoulder portion and mould for packaging said semiconductor package |
| 06/19/2002 | CN1354510A Power semiconductor device |
| 06/19/2002 | CN1354509A Film spherical grid array type semiconductor package structure and its making method |
| 06/19/2002 | CN1354508A Semiconductor package with exposed wafer seat |
| 06/19/2002 | CN1354507A Semiconductor package with structure capable of preventing sealant from overflowing and its making method |
| 06/19/2002 | CN1354502A Wafer-covered solder pad on package base board of integrated circuit |
| 06/19/2002 | CN1354501A Double wafer structure without wafer holder |
| 06/19/2002 | CN1354285A Electrochemical corrosion of high-tin solder ridge |
| 06/18/2002 | US6407929 Electronic package having embedded capacitors and method of fabrication therefor |
| 06/18/2002 | US6407927 Method and structure to increase reliability of input/output connections in electrical devices |
| 06/18/2002 | US6407924 Enhanced thermal path mechanical tolerance system |
| 06/18/2002 | US6407922 Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader |
| 06/18/2002 | US6407921 Cooling unit for cooling a heat-generating component in an electronic apparatus |
| 06/18/2002 | US6407920 Heat-dissipating assembly and process for assembling the same |
| 06/18/2002 | US6407919 Structure of computer CPU heat dissipation module |
| 06/18/2002 | US6407917 Fluid flow management system |
| 06/18/2002 | US6407916 Computer assembly for cooling high powered microprocessors |
| 06/18/2002 | US6407907 Multilayer ceramic capacitor |
| 06/18/2002 | US6407904 Multi-layer capacitor |
| 06/18/2002 | US6407796 Tape carrier package and display device using the same |
| 06/18/2002 | US6407780 Thin-film transistor substrate using aluminum to form low-resistance interconnection and liquid crystal display device using the same |
| 06/18/2002 | US6407586 Fusible link configuration in integrated circuits |
| 06/18/2002 | US6407566 Test module for multi-chip module simulation testing of integrated circuit packages |
| 06/18/2002 | US6407559 Laser fault correction of semiconductor devices |
| 06/18/2002 | US6407464 Semiconductor device |
| 06/18/2002 | US6407462 Irregular grid bond pad layout arrangement for a flip chip package |
| 06/18/2002 | US6407460 Multilayer circuit board |
| 06/18/2002 | US6407459 Chip scale package |
| 06/18/2002 | US6407458 Moisture-resistant integrated circuit chip package and method |
| 06/18/2002 | US6407454 Inter-metal dielectric layer |
| 06/18/2002 | US6407453 Semiconductor device and method of manufacturing the same |
| 06/18/2002 | US6407452 Integrated circuitry and method of restricting diffusion from one material to another |
| 06/18/2002 | US6407451 Micromachined chip scale package |
| 06/18/2002 | US6407450 Semiconductor package with universal substrate for electrically interfacing with different sized chips that have different logic functions |
| 06/18/2002 | US6407449 Pin layout of semiconductor integrated circuits including dual band amplifier and receiving mixer |
| 06/18/2002 | US6407448 Stackable ball grid array semiconductor package and fabrication method thereof |
| 06/18/2002 | US6407447 Tape carrier package |
| 06/18/2002 | US6407446 Leadframe and semiconductor chip package having cutout portions and increased lead count |
| 06/18/2002 | US6407445 MOSFET-based electrostatic discharge (ESD) protection structure with a floating heat sink |
| 06/18/2002 | US6407441 Integrated circuit and method of using porous silicon to achieve component isolation in radio frequency applications |
| 06/18/2002 | US6407434 Hexagonal architecture |
| 06/18/2002 | US6407432 Semiconductor device |
| 06/18/2002 | US6407416 Semiconductor device |
| 06/18/2002 | US6407411 Led lead frame assembly |