| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/20/2002 | WO2002001634A3 System support for semiconductor chips and electronic components and method for producing a system support and electronic components |
| 06/20/2002 | WO2001088979A3 Semi-conductor component and method for the production thereof |
| 06/20/2002 | WO2001088975A3 Method for producing a component |
| 06/20/2002 | WO2001080309A3 A method to enhance the adhesion of silicon nitride to low-k fluorinated amorphous carbon using a silicon carbide adhesion promoter layer |
| 06/20/2002 | WO2001065601A3 Device for packing electronic components using injection moulding technology |
| 06/20/2002 | WO2000075986A9 Plastic package for an optical integrated circuit device and method of making |
| 06/20/2002 | US20020078430 Manufacturing method of semiconductor device |
| 06/20/2002 | US20020078426 Cumputer Program Product for Defining Slits in a Bus on a Chip |
| 06/20/2002 | US20020077426 For forming resist layer in the manufacture of semiconductor devices; comprises acrylic resin and triazine compound to serve as crosslinking agent |
| 06/20/2002 | US20020077422 Obtained by reacting 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl and an epihalohydrin in the presence of alkali metal compound; useful in electrical and electronic fields |
| 06/20/2002 | US20020077421 Adherent to the surface of silicon flip chips, especially polyimide resins and nitride films; shock resistance |
| 06/20/2002 | US20020076974 Spring-loaded heat sink assembly for a circuit assembly |
| 06/20/2002 | US20020076952 I-channel surface-mount connector with extended flanges |
| 06/20/2002 | US20020076951 I-channel surface-mount connector |
| 06/20/2002 | US20020076948 Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
| 06/20/2002 | US20020076941 Semiconductor integrated circuit having reduced cross-talk noise |
| 06/20/2002 | US20020076930 Etchant and method for fabricating a substrate for an electronic device using the same |
| 06/20/2002 | US20020076925 Plating a layer of copper over a substrate, forming a dopant layer over the copper layer, driving dopants from the dopant layer into the copper layer and removing the dopant layer |
| 06/20/2002 | US20020076921 Method of manufacturing a semiconductor device |
| 06/20/2002 | US20020076919 Composite interposer and method for producing a composite interposer |
| 06/20/2002 | US20020076918 Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization |
| 06/20/2002 | US20020076917 Dual damascene interconnect structure using low stress flourosilicate insulator with copper conductors |
| 06/20/2002 | US20020076916 Semiconductor device, and method of manufacturing the same |
| 06/20/2002 | US20020076914 Wire bond pad |
| 06/20/2002 | US20020076913 Semiconductor device resistant to soft errors and a method for manufacturing the semiconductor device |
| 06/20/2002 | US20020076911 Semiconductor chip assembly with bumped molded substrate |
| 06/20/2002 | US20020076910 High density electronic interconnection |
| 06/20/2002 | US20020076909 Semiconductor device manufacturing method, electronic parts mounting method and heating/melting process equipment |
| 06/20/2002 | US20020076908 Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating |
| 06/20/2002 | US20020076897 Method and apparatus for marking microelectronic dies and microelectronic devices |
| 06/20/2002 | US20020076896 Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials |
| 06/20/2002 | US20020076894 Semiconductor device with capacitor and method of manufacturing thereof |
| 06/20/2002 | US20020076859 Overmolding encapsulation process and encapsulated article made therefrom |
| 06/20/2002 | US20020076858 Semiconductor device and manufacturing method thereof |
| 06/20/2002 | US20020076857 Multi-part lead frame with dissimilar materials and method of manufacturing |
| 06/20/2002 | US20020076856 Method and apparatus for transfer molding encapsulation of a semiconductor die with attached heat sink |
| 06/20/2002 | US20020076855 Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques |
| 06/20/2002 | US20020076854 System, method and apparatus for constructing a semiconductor wafer-interposer using B-Stage laminates |
| 06/20/2002 | US20020076853 Backside bus vias |
| 06/20/2002 | US20020076852 Method for manufacturing a component which is encapsulated in plastic, and a component which is encapsulated in plastic |
| 06/20/2002 | US20020076851 Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor |
| 06/20/2002 | US20020076840 Test wafer and method for investigating electrostatic discharge induced wafer defects |
| 06/20/2002 | US20020076574 Conductor alloy of between .001% and 2 atomic% of titanium, zirconium, indium, tin and hafnium abbuted by a liner of a tantalum, tugsten, titanium, niobium and vanadium alloy |
| 06/20/2002 | US20020076562 Oxide/organic polymer multilayer thin films deposited by chemical vapor deposition |
| 06/20/2002 | US20020076558 Epoxy resin compositions and premolded semiconductor packages |
| 06/20/2002 | US20020076548 Single-application polyimidosiloxane-based coating material and cured film |
| 06/20/2002 | US20020076543 Layered dielectric nanoporous materials and methods of producing same |
| 06/20/2002 | US20020076536 Electronic component and method of manufacturing the same |
| 06/20/2002 | US20020076535 Thermosetting fluorinated dielectrics and multilayer circuit boards |
| 06/20/2002 | US20020076495 Method of making electronic materials |
| 06/20/2002 | US20020076170 Photonic and electronic components on a shared substrate |
| 06/20/2002 | US20020075663 Module having a lead frame equipped with components on both sides |
| 06/20/2002 | US20020075655 Heat dissipation assembly and method of assembling the same |
| 06/20/2002 | US20020075654 Heat dissipation assembly |
| 06/20/2002 | US20020075653 Heat sink |
| 06/20/2002 | US20020075652 CPU cooling device using thermo-siphon |
| 06/20/2002 | US20020075651 Electronic device using evaporative micro-cooling and associated methods |
| 06/20/2002 | US20020075650 Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump |
| 06/20/2002 | US20020075649 Structure of computer cpu heat dissipation module |
| 06/20/2002 | US20020075648 Method of controlling cooling system for a personal computer and personal computer |
| 06/20/2002 | US20020075646 Liquid cooling system and personal computer using thereof |
| 06/20/2002 | US20020075644 Method of controlling cooling system for a personal computer and personal computer |
| 06/20/2002 | US20020075630 Capacitor with extended surface lands and method of fabrication therefor |
| 06/20/2002 | US20020075107 Interconnection method and structure |
| 06/20/2002 | US20020075106 High frequency module device and method for its preparation |
| 06/20/2002 | US20020075105 Microwave circuit packages having a reduced number of vias in the substrate |
| 06/20/2002 | US20020075104 Coaxial type signal line and manufacturing method thereof |
| 06/20/2002 | US20020075084 High-frequency module |
| 06/20/2002 | US20020075031 Testing integrated circuits |
| 06/20/2002 | US20020075028 Design circuit pattern for test of semiconductor circuit |
| 06/20/2002 | US20020075020 Test cell structure for estimating electrical characteristics of closely-spaced bond pads formed on a substrate |
| 06/20/2002 | US20020074690 Method of encapsulating a substrate-based package assembly without causing mold flash |
| 06/20/2002 | US20020074672 Semiconductor package without substrate and method of manufacturing same |
| 06/20/2002 | US20020074670 Method for manufacturing an interconnect structure for stacked semiconductor device |
| 06/20/2002 | US20020074669 Semiconductor device having capacitors for reducing power source noise |
| 06/20/2002 | US20020074668 Multi-chip integrated circuit module |
| 06/20/2002 | US20020074667 Wiring board, semiconductor device, and process for production of wiring board |
| 06/20/2002 | US20020074666 Semiconductor device having identification number, manufacturing method thereof and electronic device |
| 06/20/2002 | US20020074665 Metal contact structure in semiconductor device and method for forming the same |
| 06/20/2002 | US20020074664 Semiconductor device and manufacturing method thereof |
| 06/20/2002 | US20020074662 Substrate for manufacturing a semiconductor device with three element alloy |
| 06/20/2002 | US20020074660 Semiconductor device having a multiple layer wiring structure, wiring method, wiring device, and recording medium |
| 06/20/2002 | US20020074659 Method for forming a porous dielectric material layer in a semiconductor device and device formed |
| 06/20/2002 | US20020074656 Semiconductor device and a method of manufacturing the same |
| 06/20/2002 | US20020074655 Semiconductor device and method of manufacturing the same |
| 06/20/2002 | US20020074654 Wiring substrate, wiring board, and wiring substrate mounting structure |
| 06/20/2002 | US20020074653 Electronic component overlapping dice of unsingulated semiconductor wafer |
| 06/20/2002 | US20020074651 Semiconductor device for power control |
| 06/20/2002 | US20020074650 Method of manufacturing a semiconductor device and a semiconductor device |
| 06/20/2002 | US20020074649 Electronic assembly with high capacity thermal interface and methods of manufacture |
| 06/20/2002 | US20020074648 Semiconductor die with attached heat sink and transfer mold |
| 06/20/2002 | US20020074647 Device for a clocked semiconductor chip |
| 06/20/2002 | US20020074646 Non-rectangular thermo module wafer cooling device using the same |
| 06/20/2002 | US20020074645 Pre-applied adhesion promoter |
| 06/20/2002 | US20020074644 Parallel plane substrate |
| 06/20/2002 | US20020074643 Semiconductor device and method for packaging same |
| 06/20/2002 | US20020074642 Semiconductor device and package for containing semiconductor element |
| 06/20/2002 | US20020074641 Microelectronic package having a bumpless laminated interconnection layer |
| 06/20/2002 | US20020074639 Semiconductor module with improved solder joint reliability |
| 06/20/2002 | US20020074638 Multi-chip semiconductor package structure |