| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/26/2002 | CN1355858A Low dielectric mano-porous material obtainable from polymer decomposition |
| 06/26/2002 | CN1355670A Electromagnetic interference rejection body of low electromagnetic penetrability and reflectivity and its electronic device |
| 06/26/2002 | CN1355668A Method for manufacturing metal support frame, metal support frame and its application |
| 06/26/2002 | CN1355568A Chip stack package structure |
| 06/26/2002 | CN1355567A Circuit structure for integrating power distributed function of circuit and lead frame to chip surface |
| 06/26/2002 | CN1355566A Non-pin square flat package with enhanced heat radiation |
| 06/26/2002 | CN1355565A Package of image inductor |
| 06/26/2002 | CN1355564A Semiconductor package and its making method |
| 06/26/2002 | CN1355563A Substrate structure for preventing crack generation on weld shielding layer at device position |
| 06/26/2002 | CN1355562A Turbolating plate with downward bent part |
| 06/26/2002 | CN1355442A Packaging adhesive belt for packaging conducting wire unit of LCD and its roll |
| 06/26/2002 | CN1355415A Device and method for cooling heat source in high density chip carrier equipment |
| 06/26/2002 | CN1086811C Photomask for the measurement of resolution of exposure equipment |
| 06/25/2002 | USRE37769 Contact structure provides electrical contact between two polycrystalline silicon interconnect layers; lower layer has a silicide layer on its upper surface. |
| 06/25/2002 | US6412072 Parasitically powered microprocessor capable of transmitting data over a single data line and ground |
| 06/25/2002 | US6411519 Package substrate |
| 06/25/2002 | US6411518 High-density mounted device employing an adhesive sheet |
| 06/25/2002 | US6411516 Copper slug pedestal for a printed circuit board |
| 06/25/2002 | US6411513 Compliant thermal interface devices and method of making the devices |
| 06/25/2002 | US6411510 Heat sink-equipped cooling apparatus |
| 06/25/2002 | US6411507 Removing heat from integrated circuit devices mounted on a support structure |
| 06/25/2002 | US6411494 Distributed capacitor |
| 06/25/2002 | US6411492 Structure and method for fabrication of an improved capacitor |
| 06/25/2002 | US6411484 VLSI circuit with temperature monitoring |
| 06/25/2002 | US6411349 Semiconductor device, display apparatus using such devices and method of manufacturing such an apparatus as well as that of manufacturing such an apparatus |
| 06/25/2002 | US6411160 Semiconductor integrated circuit device |
| 06/25/2002 | US6411114 Universal test coupon for performing prequalification tests on substrates |
| 06/25/2002 | US6410990 Integrated circuit device having C4 and wire bond connections |
| 06/25/2002 | US6410989 Chip-scale package |
| 06/25/2002 | US6410988 Thermally enhanced and mechanically balanced flip chip package and method of forming |
| 06/25/2002 | US6410987 Semiconductor device and a method of manufacturing the same and an electronic device |
| 06/25/2002 | US6410986 For use in the metallization of integrated circuit devices. |
| 06/25/2002 | US6410985 Silver metallization by damascene method |
| 06/25/2002 | US6410984 Conductive structure in an integrated circuit |
| 06/25/2002 | US6410983 Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip |
| 06/25/2002 | US6410982 Heatpipesink having integrated heat pipe and heat sink |
| 06/25/2002 | US6410981 Vented semiconductor device package having separate substrate, strengthening ring and cap structures |
| 06/25/2002 | US6410980 Electronic part with groove in lead |
| 06/25/2002 | US6410979 Ball-grid-array semiconductor device with protruding terminals |
| 06/25/2002 | US6410978 Semiconductor device |
| 06/25/2002 | US6410977 Semiconductor device, circuit board electronic instrument and method of making a semiconductor device |
| 06/25/2002 | US6410976 Integrated circuitry having conductive passageway interconnecting circuitry on front and back surfaces of a wafer fragment |
| 06/25/2002 | US6410974 Simplified high Q inductor substrate |
| 06/25/2002 | US6410962 Structure for SOI wafers to avoid electrostatic discharge |
| 06/25/2002 | US6410955 Comb-shaped capacitor for use in integrated circuits |
| 06/25/2002 | US6410949 Flash memory device with monitor structure for monitoring second gate over-etch |
| 06/25/2002 | US6410937 Integrated circuit chip carrier |
| 06/25/2002 | US6410936 Semiconductor device |
| 06/25/2002 | US6410927 Semiconductor wafer alignment method using an identification scribe |
| 06/25/2002 | US6410861 Low profile interconnect structure |
| 06/25/2002 | US6410860 Electronic circuit package assembly with solder interconnection sheet |
| 06/25/2002 | US6410858 Multilayered wiring board, a production process for, and semiconductor device using, the same |
| 06/25/2002 | US6410854 Wire and solder arrangement of ease of wave soldering |
| 06/25/2002 | US6410847 Packaged electronic system having selectively plated microwave absorbing cover |
| 06/25/2002 | US6410642 Adhesive and semiconductor devices |
| 06/25/2002 | US6410615 Semiconductor sealing epoxy resin composition and semiconductor device using the same |
| 06/25/2002 | US6410463 Method for forming film with low dielectric constant on semiconductor substrate |
| 06/25/2002 | US6410457 Method for improving barrier layer adhesion to HDP-FSG thin films |
| 06/25/2002 | US6410435 Ultra large scale integration (ulsi); copper interconnect system containing chromium oxide |
| 06/25/2002 | US6410431 Through-chip conductors for low inductance chip-to-chip integration and off-chip connections |
| 06/25/2002 | US6410425 Integrated circuit with stop layer and method of manufacturing the same |
| 06/25/2002 | US6410415 Flip chip mounting technique |
| 06/25/2002 | US6410414 Method for fabricating a semiconductor device |
| 06/25/2002 | US6410413 Semiconductor device with transparent link area for silicide applications and fabrication thereof |
| 06/25/2002 | US6410406 Semiconductor device including edge bond pads and methods |
| 06/25/2002 | US6410401 Controlling depth of recess to prevent direct contact between wiring layer and metallic silicon; high temperature sputtering |
| 06/25/2002 | US6410370 Capacitor for a semiconductor device |
| 06/25/2002 | US6410367 Fabricating silicide fuse on a semiconductor substrate that includes two separate wells of a second conductivity type disposed within a lightly doped region, of a first, opposite conductivity type; silicide prevents re-closing of circuit |
| 06/25/2002 | US6410366 Semiconductor device and manufacturing method thereof, circuit board and electronic equipment |
| 06/25/2002 | US6410365 Semiconductor device with two stacked chips in one resin body and method of producing |
| 06/25/2002 | US6410364 Semiconductor device, method of connecting a semiconductor chip, circuit board, and electronic equipment |
| 06/25/2002 | US6410363 Semiconductor device and method of manufacturing same |
| 06/25/2002 | US6410357 Structure of critical dimension bar |
| 06/25/2002 | US6410356 Silicon carbide large area device fabrication apparatus and method |
| 06/25/2002 | US6410355 Semiconductor package using terminals formed on a conductive layer of a circuit board |
| 06/25/2002 | US6410353 Contact chain for testing and its relevantly debugging method |
| 06/25/2002 | US6410352 Apparatus and method for testing fuses |
| 06/25/2002 | US6410210 Gel overcoating substrate; radiaition resistance titanium oxide |
| 06/25/2002 | US6409904 Method and apparatus for depositing and controlling the texture of a thin film |
| 06/25/2002 | US6409859 Method of making a laminated adhesive lid, as for an Electronic device |
| 06/25/2002 | US6408937 Active cold plate/heat sink |
| 06/25/2002 | US6408934 Cooling module |
| 06/25/2002 | US6408630 Computer enclosure cooling unit |
| 06/25/2002 | US6408510 Method for making chip scale packages |
| 06/25/2002 | US6408509 Vertically mountable interposer, assembly and method |
| 06/25/2002 | US6408508 Method for making flexible trace surface circuit board |
| 06/25/2002 | US6408507 Heat sink to semiconductor module assembly equipment and method |
| 06/20/2002 | WO2002049165A1 I-channel surface-mount connector |
| 06/20/2002 | WO2002049110A1 Shielded inductor |
| 06/20/2002 | WO2002049109A1 Stacked die package |
| 06/20/2002 | WO2002049108A1 Semiconductor device package and lead frame with die overhanging lead frame pad |
| 06/20/2002 | WO2002049107A2 Method for stacking semiconductor die within an implanted medical device |
| 06/20/2002 | WO2002049106A1 Electronic device unit |
| 06/20/2002 | WO2002049105A2 Thermoelectric spot coolers for rf and microwave communication integrated circuits |
| 06/20/2002 | WO2002049104A2 Power module having improved transient thermal impedance |
| 06/20/2002 | WO2002049103A2 Microelectronic package having bumpless laminated interconnection layer |
| 06/20/2002 | WO2002049101A2 Intermediate support for a semiconductor module and arrangement of a module which is configured with an intermediate support of this type on a circuit support |
| 06/20/2002 | WO2002048980A1 Process for the manufacture of novel, inexpensive radio frequency identification devices |
| 06/20/2002 | WO2002048701A2 Nanosensors |
| 06/20/2002 | WO2002023634A3 Cmos transceiver having an integrated power amplifier |