Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2002
06/27/2002US20020081775 Dual LOC semiconductor assembly employing floating lead finger structure
06/27/2002US20020081774 Flip-chip on flex for high performance packaging applications
06/27/2002US20020081773 Light-emitting element, semiconductor light-emitting device, and manufacturing methods therefor
06/27/2002US20020081770 Package for accommodating electronic parts, semiconductor device and method for manufacturing package
06/27/2002US20020081769 Method of fabricating semiconductor device
06/27/2002US20020081768 Semiconductor device and method of fabricating semiconductor device
06/27/2002US20020081759 Method and apparatus for reducing fixed charges in a semiconductor device
06/27/2002US20020081532 Methodology to introduce metal and via openings
06/27/2002US20020081531 Methodology to introduce metal and via openings
06/27/2002US20020080588 Probe card assembly and kit, and methods of making same
06/27/2002US20020080587 Heat dissipation for electronic components
06/27/2002US20020080586 Heatsink retainer
06/27/2002US20020080585 Clip for heat sink
06/27/2002US20020080584 Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
06/27/2002US20020080583 Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
06/27/2002US20020080582 Heat pipe heat dissipating device
06/27/2002US20020080579 Cooling unit for cooling a heat-generating component, and electronic apparatus having a cooling unit
06/27/2002US20020080563 Multiscale transport apparatus and methods
06/27/2002US20020079883 Integrated circuit test structure
06/27/2002US20020079837 Chip-type LED and process of manufacturing the same
06/27/2002US20020079746 Cooling device of electronic apparatus
06/27/2002US20020079613 Injection molded heat dissipation device
06/27/2002US20020079596 Semiconductor device and manufacturing method thereof
06/27/2002US20020079595 Apparatus for connecting a semiconductor die to a substrate and method therefor
06/27/2002US20020079594 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
06/27/2002US20020079593 Semiconductor package having heat sink attached to substrate
06/27/2002US20020079592 Flip chip type quad flat non-leaded package
06/27/2002US20020079590 Semiconductor device and method for fabricating the same
06/27/2002US20020079589 Integrated circuit with stop layer and associated fabrication process
06/27/2002US20020079588 Semiconductor device and method for manufacturing the same
06/27/2002US20020079587 Method and apparatus for reducing capacitive coupling between lines in an integrated circuit
06/27/2002US20020079586 Semiconductor device and fabrication method thereof
06/27/2002US20020079585 Structural reinforcement of highly porous low k dielectric films by ILD posts
06/27/2002US20020079584 Semiconductor device with a split pad electrode
06/27/2002US20020079583 Structural reinforcement of highly porous low k dielectric films by ILD posts
06/27/2002US20020079581 Electrical contact for high dielectric constant capacitors and method for fabricating the same
06/27/2002US20020079580 Semiconductor integrated circuit device and fabrication process for the same
06/27/2002US20020079579 Ball grid array type semiconductor package having a flexible substrate
06/27/2002US20020079578 Semiconductor device having exposed adhesive sheet and method for manufacturing the same
06/27/2002US20020079577 Advanced electronic package
06/27/2002US20020079576 Ball limiting metallurgy for input/outputs and methods of fabrication
06/27/2002US20020079575 Semiconductor module
06/27/2002US20020079574 Heat transfer material for an improved die edge contacting socket
06/27/2002US20020079573 Chip package with grease heat sink
06/27/2002US20020079572 Enhanced die-up ball grid array and method for making the same
06/27/2002US20020079571 Microelectronic circuit package
06/27/2002US20020079570 Semiconductor package with heat dissipating element
06/27/2002US20020079569 Semiconductor integrated circuit
06/27/2002US20020079568 Stacked module package
06/27/2002US20020079567 Package structure stacking chips on front surface and back surface of substrate
06/27/2002US20020079566 Multiple semiconductor chip (multi-chip) module for use in high-power applications
06/27/2002US20020079565 BGA semiconductor device using insulating film
06/27/2002US20020079564 Anti-deciphering contacts
06/27/2002US20020079563 Semiconductor device and method of manufacturing the same
06/27/2002US20020079562 Enhanced die-up ball grid array packages and method for making the same
06/27/2002US20020079561 Lead frame for a semiconductor device, a semiconductor device made from the lead frame, and a method of making a semiconductor device
06/27/2002US20020079560 Method of producing an integrated circuit and an integrated circuit
06/27/2002US20020079559 Multichip module for LOC mounting and method for producing the multichip module
06/27/2002US20020079557 Porous silicon oxycarbide integrated circuit insulator
06/27/2002US20020079553 Contact and via structure and method of fabrication
06/27/2002US20020079552 Semiconductor device and manufacturing method thereof
06/27/2002US20020079536 Semiconductor device
06/27/2002US20020079522 Inter-wiring-layer capacitors
06/27/2002US20020079517 Semiconductor device capable of preventing corrosion of metal wires from CMP (chemical mechanical polishing) process
06/27/2002US20020079513 Semiconductor device comprising an arrangement of an electrically programmable non-volatile memory element
06/27/2002US20020079492 Semiconductor device and method of manufacturing the same
06/27/2002US20020079487 Diffusion barriers comprising a self-assembled monolayer
06/27/2002US20020079476 Applications and devices based on nanostructured non-stoichiometric substances
06/27/2002US20020079438 Image sensor package and substrate thereof
06/27/2002US20020079124 Stress relieving tape bonding interconnect
06/27/2002US20020079120 Implementing micro bgatm assembly techniques for small die
06/27/2002US20020079119 Electronic control unit
06/27/2002US20020079117 Capping structure for electronics package undergoing compressive socket actuation
06/27/2002US20020079097 Heat sink
06/27/2002US20020079088 Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof
06/27/2002US20020079087 Two-layered micro channel heat sink, devices and systems incorporating same
06/27/2002US20020079086 Embedded centrifugal cooling device
06/27/2002US20020078793 Highly filled composites of powered fillers and polymer matrix
06/27/2002US20020078543 Tool for mounting a clip to a socket
06/27/2002US20020078542 Tool for mounting clip to cpu socket
06/27/2002DE10152096A1 Halbleiter-Wafer Semiconductor wafer
06/27/2002DE10137892A1 Versiegelte Halbleitervorrichtung und Chipträger -Sealed semiconductor device and chip carrier
06/27/2002DE10121240C1 Production of an integrated circuit comprises forming a first metallizing region, forming insulating regions, producing a conducting region, forming a contact in one insulating region and providing a conducting pathway
06/27/2002DE10062108A1 Leistungsmodul mit verbessertem transienten Wärmewiderstand Power module with improved transient thermal resistance
06/27/2002DE10060828A1 Semiconductor component for MOS transistor or IGBT devices has drain up configuration and edge region contact
06/27/2002DE10056172A1 Elektrisches Bauteil Electrical component
06/27/2002CA2436990A1 Interconnection of active and passive components in substrate
06/27/2002CA2431162A1 Gate length control for semiconductor chip design
06/26/2002EP1217660A2 Cooling device
06/26/2002EP1217659A2 Power Semiconductor Modul with an High Withstanding against Voltage
06/26/2002EP1217648A2 Method of manufacturing an interlayer dielectric layer with low dielectric constant
06/26/2002EP1217102A2 Plating apparatus and method of managing plating liquid composition
06/26/2002EP1216487A1 Semiconductor wafer level package
06/26/2002EP1216266A1 Transparent liquid resin material for smt-enabled led-applications at higher temperatures and higher luminosities
06/26/2002EP1024952B1 A laminate comprising a thin borosilicate glass substrate as a constituting layer
06/26/2002CN2497515Y Circulating radiating fin fastening device
06/26/2002CN2497432Y Radiator and its lock jointing device
06/26/2002CN2497431Y Moulded radiating apparatus
06/26/2002CN1356018A Heat sink clip for electronic assembly
06/26/2002CN1355935A Clad plate for forming interposer for seiconductor device interposer for semiconductor device, and method of manufacturing them
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