| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/02/2002 | US6414367 Interconnect exhibiting reduced parasitic capacitance variation |
| 07/02/2002 | US6414362 Power semiconductor device |
| 07/02/2002 | US6414341 Input/output protective device |
| 07/02/2002 | US6414336 Semiconductor device capable of improving manufacturing |
| 07/02/2002 | US6414334 Semi-conductor device with test element group for evaluation of interlayer dielectric and process for producing the same |
| 07/02/2002 | US6414250 Hermetic multi-layered circuit assemblies and method of manufacture |
| 07/02/2002 | US6413879 Porous silica; applying radio frequency |
| 07/02/2002 | US6413872 Method op optimizing vias between conductive layers in an integrated circuit structure |
| 07/02/2002 | US6413868 Modular high frequency integrated circuit structure |
| 07/02/2002 | US6413866 Method of forming a solute-enriched layer in a substrate surface and article formed thereby |
| 07/02/2002 | US6413864 Forming interlayer insulating film on a semiconductor substrate; forming a damascene pattern by patterning; cleaning, and forming a diffusion barrier layer on the structure, forming chemical enhancer treatment |
| 07/02/2002 | US6413863 Method to resolve the passivation surface roughness during formation of the AlCu pad for the copper process |
| 07/02/2002 | US6413862 Use of palladium in IC manufacturing |
| 07/02/2002 | US6413858 Barrier and electroplating seed layer |
| 07/02/2002 | US6413855 Methods of making interconnections for semiconductor circuits |
| 07/02/2002 | US6413854 Method to build multi level structure |
| 07/02/2002 | US6413853 Method of forming a tungsten plug in a semiconductor device |
| 07/02/2002 | US6413848 Self-aligned fuse structure and method with dual-thickness dielectric |
| 07/02/2002 | US6413847 Method of forming dummy metal pattern |
| 07/02/2002 | US6413840 Method of gettering layer for improving chemical-mechanical polishing process in flash memory production and semiconductor structure thereof |
| 07/02/2002 | US6413838 Manufacturing method of display device |
| 07/02/2002 | US6413815 Method of forming a MIM capacitor |
| 07/02/2002 | US6413801 Method of molding semiconductor device and molding die for use therein |
| 07/02/2002 | US6413800 Hermetic cold weld seal |
| 07/02/2002 | US6413799 Method of forming a ball-grid array package at a wafer level |
| 07/02/2002 | US6413798 Package having very thin semiconductor chip, multichip module assembled by the package, and method for manufacturing the same |
| 07/02/2002 | US6413797 Semiconductor device and method for making the same |
| 07/02/2002 | US6413796 Tape for semiconductor package, method of manufacturing the same, and method of manufacturing the package using the tape |
| 07/02/2002 | US6413623 Method for attenuating thermal sensation when handling objects at non-body temperature |
| 07/02/2002 | US6413619 Method of making ceramic member and marked ceramic member |
| 07/02/2002 | US6413583 Oxidizing methylsilanes with water, oxygen, and ozone and curing; forms uniform deposits of silicon oxides containing hydroxyl groups and having low dielectric constants; gap fillers for semiconductor devices |
| 07/02/2002 | US6413576 Coating uninsulated portion of copper circuit with layer of ceramic having thickness for soldering without fluxing; integrated circuits |
| 07/02/2002 | US6413438 Tetraethoxysilane layer over low-k dielectric modified organic spun on glass (sog) film; dry etching with trifluoromethane, difluoromethane and carbon monoxide; nonbowing; nonpeeling; corrosion resistance; semiconductor integrated circuits |
| 07/02/2002 | US6413383 Flowing a gas into a magnetron, generating a plasma, then depressuring and increasing the power; plasma gas vapor deposition of copper |
| 07/02/2002 | US6413353 Substrate having an upper surface for carrying semiconductor chips and a semiconductor chip mounted on the upper surface of the substrate, a heatsink cap is covering the chip, applying silicone adhesive, securing the cap, curing adhesive adhesive |
| 07/02/2002 | US6413111 Pick up cap used for an electrical socket |
| 07/02/2002 | US6413102 Center bond flip chip semiconductor carrier and a method of making and using it |
| 07/02/2002 | US6412971 Light source including an array of light emitting semiconductor devices and control method |
| 07/02/2002 | US6412786 Die seal ring |
| 07/02/2002 | US6412546 Heat dissipation device for integrated circuits |
| 07/02/2002 | US6412522 Bending die and bending machine using the same |
| 06/27/2002 | WO2002051224A2 Multilayered hybrid electronic module |
| 06/27/2002 | WO2002051222A2 Parallel plane substrate |
| 06/27/2002 | WO2002051217A2 Packaged integrated circuits and methods of producing thereof |
| 06/27/2002 | WO2002050910A1 Semiconductor integrated circuit device identifying method, semiconductor integrated circuit device producing method, and semiconductor integrated circuit device |
| 06/27/2002 | WO2002050908A2 Gate length control for semiconductor chip design |
| 06/27/2002 | WO2002050907A2 Interconnection of active and passive components in substrate |
| 06/27/2002 | WO2002050906A1 Method for programming a peripheral address and peripheral therefor |
| 06/27/2002 | WO2002050905A1 Connection by cut-out insulation and plane-printed weld |
| 06/27/2002 | WO2002050904A1 Connection by printed-weld deformable member |
| 06/27/2002 | WO2002050903A1 Cut-out insulating member and contact-weld connection |
| 06/27/2002 | WO2002050902A1 Micro heat-exchanger |
| 06/27/2002 | WO2002050901A2 Electronic device using evaporative micro-cooling and associated methods |
| 06/27/2002 | WO2002050900A1 Electronic circuit device |
| 06/27/2002 | WO2002050898A1 Semiconductor integrated circuit device |
| 06/27/2002 | WO2002050892A1 Sealing resin for flip-flop mounting |
| 06/27/2002 | WO2002050891A1 Method of manufacturing semiconductor device |
| 06/27/2002 | WO2002050890A2 Electroconductive connection between a chip and a coupling element in addition to a security element containing a connection of said type |
| 06/27/2002 | WO2002050889A2 Contact hump construction for the production of a connector construction for substrate connecting surfaces |
| 06/27/2002 | WO2002050888A2 Method for making electronic devices including silicon and ltcc |
| 06/27/2002 | WO2002050887A1 Electronic device and method of manufacturing the electronic device |
| 06/27/2002 | WO2002050882A2 Copper alloys for interconnections having improved electromigration characteristics and methods of making same |
| 06/27/2002 | WO2002050852A2 Capacitor with extended surface lands and method of fabrication therefor |
| 06/27/2002 | WO2002049773A1 Bond enhancement antitarnish coatings |
| 06/27/2002 | WO2002028160A3 Microfluidic devices for heat transfer |
| 06/27/2002 | WO2002023583A3 Monitor system and method for semiconductor processes |
| 06/27/2002 | WO2002007490A3 Assembly comprising a structured support element and a substrate functionally linked therewith |
| 06/27/2002 | WO2002001639A3 Substrate and module |
| 06/27/2002 | WO2002001635A3 Electronic component |
| 06/27/2002 | WO2001099184A3 Dual damascene process utilizing a low-k dual dielectric |
| 06/27/2002 | WO2001098016A3 Laser system for processing target material |
| 06/27/2002 | WO2001084581A3 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
| 06/27/2002 | WO2001065344B1 Method and apparatus for providing power to a microprocessor with integrated thermal and emi management |
| 06/27/2002 | US20020083407 Semiconductor integrated circuit device, circuit design apparatus, and circuit design method |
| 06/27/2002 | US20020083405 Semiconductor device, semiconductor device design method, semiconductor device design method recording medium, and semiconductor device design support system |
| 06/27/2002 | US20020083404 Semiconductor device, semiconductor device design method, semiconductor device design method recording medium, and semiconductor device design support system |
| 06/27/2002 | US20020082782 Method for determining fluid flow characteristic curves of heat-dissipating system |
| 06/27/2002 | US20020081882 Retention module for securing heat sink |
| 06/27/2002 | US20020081860 Method for manufacturing semiconductor wafer having resist mask with measurement marks for measuring the accuracy of overlay of a photomask |
| 06/27/2002 | US20020081856 Reducing the oxidized interface with a hydrogen containing plasma and introducing second-layer-forming compounds |
| 06/27/2002 | US20020081850 Method of fabricating a semiconductor device |
| 06/27/2002 | US20020081846 Semiconductor device |
| 06/27/2002 | US20020081843 Semicoductor device and method of manufacturing of the same |
| 06/27/2002 | US20020081842 Electroless metal liner formation methods |
| 06/27/2002 | US20020081840 Method of manufacturing a semiconductor device including dual-damascene process |
| 06/27/2002 | US20020081839 Copper-based wiring layer contains sulfur at given atomic percent; preventing film peeling due to the difference in coefficient of thermal expansion |
| 06/27/2002 | US20020081838 Interposer and method of making same |
| 06/27/2002 | US20020081836 Contact structure, semiconductor device and manufacturing method thereof |
| 06/27/2002 | US20020081834 Method for eliminating reaction between photoresist and OSG |
| 06/27/2002 | US20020081833 Patterning three dimensional structures |
| 06/27/2002 | US20020081831 Method of manufacturing semiconductor device |
| 06/27/2002 | US20020081830 Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device |
| 06/27/2002 | US20020081819 Electronic component with shielding and method for its production |
| 06/27/2002 | US20020081815 Fiducial mark bodies for charged-particle-beam (CPB) microlithography, methods for making same, and CPB microlithography apparatus comprising same |
| 06/27/2002 | US20020081799 Contact fabrication method for semiconductor device |
| 06/27/2002 | US20020081782 Contact and via structure and method of fabrication |
| 06/27/2002 | US20020081781 Connection component with peelable leads |
| 06/27/2002 | US20020081780 Methods and apparatus for making integrated circuit package including opening exposing portion of the IC |
| 06/27/2002 | US20020081778 Thin-film heat sink and method of manufacturing same |
| 06/27/2002 | US20020081777 Methods of making microelectronic assemblies having conductive elastomeric posts |