| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/04/2002 | US20020084513 Integrated circuits and methods for their fabrication |
| 07/04/2002 | US20020084512 Semiconductor wafer |
| 07/04/2002 | US20020084511 Semiconductor device |
| 07/04/2002 | US20020084509 Spiral inductor semiconducting device with grounding strips and conducting vias |
| 07/04/2002 | US20020084508 Fuse for a semiconductor configuration and method for its production |
| 07/04/2002 | US20020084507 Self-passivating Cu laser fuse |
| 07/04/2002 | US20020084492 Complementary MOS semiconductor device and method of manufacturing the same |
| 07/04/2002 | US20020084491 Multi-finger type electrostatic discharge protection circuit |
| 07/04/2002 | US20020084487 Semiconductor device |
| 07/04/2002 | US20020084480 Top electrode in a strongly oxidizing environment |
| 07/04/2002 | US20020084470 Semiconductor device and semiconductor device assembly |
| 07/04/2002 | US20020084457 Semiconductor device having embedded array |
| 07/04/2002 | US20020084455 Transparent and conductive zinc oxide film with low growth temperature |
| 07/04/2002 | US20020084331 Mask revision ID code circuit |
| 07/04/2002 | US20020084311 Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys |
| 07/04/2002 | US20020084257 Intergrated low k dielectrics and etch stops |
| 07/04/2002 | US20020084191 Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same |
| 07/04/2002 | US20020084107 High frequency semiconductor chip package and substrate |
| 07/04/2002 | US20020084106 Hermetic multi-layered circuit assemblies and method of manufacture |
| 07/04/2002 | US20020084105 Via -in-pad with off-center geometry and methods of manufacture |
| 07/04/2002 | US20020084104 Multilayer circuit board having a capacitor and process for manufacturing same |
| 07/04/2002 | US20020084103 Silicon nitride ceramic substrate, silicon nitride ceramic circuit board using the substrate, and method of manufacturing the substrate |
| 07/04/2002 | US20020084097 Stress relieving tape bonding interconnect |
| 07/04/2002 | US20020084090 Tamper-responding encapsulated enclosure having flexible protective mesh structure |
| 07/04/2002 | US20020084062 Heat sink assembly |
| 07/04/2002 | US20020084060 Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin |
| 07/04/2002 | US20020083972 Utilizing superlattice and quantum-well materials may be deposited directly onto a die using thin-film deposition techniques. The materials may have a figure-of-merit of greater than one. |
| 07/04/2002 | US20020083582 Method of IC packing/unpacking for preserving and updating data within the IC and the structure thereof |
| 07/04/2002 | DE10164606A1 Flip chip semiconductor device for integrated circuit has signal connection surfaces arranged outside energy lead connection surfaces |
| 07/04/2002 | DE10164585A1 Halbleitereinrichtung mit Anschlussstreifenelektrode einer Mehrlagenstruktur A semiconductor device with a multi-layer strip electrode connection structure |
| 07/04/2002 | DE10162966A1 Power semiconductor modules for transformers has multilayer ceramic between heat sink and chip |
| 07/04/2002 | DE10161936A1 Elektroniksteuereinheit Electronic control unit |
| 07/04/2002 | DE10152533A1 Hochfrequenz-Schaltungsplatineneinheit, Hochfrequenz-Modul, bei dem die Einheit verwendet ist, elektronische Vorrichtung, bei der das Modul verwendet ist, und Verfahren zur Herstellung der Hochfrequenz-Schaltungsplatineneinheit High-frequency circuit board unit, high-frequency module in which the unit is used, electronic device in which the module is used, and processes for making the high-frequency circuit board unit |
| 07/04/2002 | DE10136246A1 Halbleitervorrichtung mit kapazitivem Element und Verfahren zu ihrer Herstellung A semiconductor device having a capacitive element and process for its preparation |
| 07/04/2002 | DE10113771A1 Semiconductor component and process for connection with a conductor plate |
| 07/04/2002 | DE10112861A1 Laminiertes keramisches Elektronikbauelement A laminated ceramic electronic component |
| 07/04/2002 | DE10064691A1 Electronic component comprises a semiconductor chip with copper conducting pathways for connecting semiconductor electrode surfaces of elements of the chip to copper contact surfaces |
| 07/04/2002 | DE10063714A1 Power semiconductor module comprises a housing, contacting elements, a semiconductor component and a ceramic substrate with a metal coating partially covering the first and the second surface of the ceramic substrate |
| 07/04/2002 | DE10063306A1 Kühlvorrichtung Cooler |
| 07/04/2002 | DE10063041A1 Verfahren zum Herstellen einer integrierten Schaltung A method of fabricating an integrated circuit |
| 07/04/2002 | DE10062386A1 Zwischenträger für ein Halbleitermodul sowie Anordnung eines mit einem solchen Zwischenträger gebildeten Moduls auf einem Schaltungsträger Intermediate carriers for a semiconductor module and a module assembly formed with such an intermediate carrier on a circuit carrier |
| 07/04/2002 | CA2433153A1 Method for eliminating reaction between photoresist and organosilicate glass |
| 07/03/2002 | EP1220391A1 Package with thermoelectric cooler |
| 07/03/2002 | EP1220328A1 Photo-interrupter and semiconductor device using it |
| 07/03/2002 | EP1220316A2 High-frequency switching module and high-frequency apparatus equipped with the same |
| 07/03/2002 | EP1220315A2 Semiconductor integrated circuit device, circuit design apparatus, and circuit design method |
| 07/03/2002 | EP1220314A2 Power Semiconductor Modul |
| 07/03/2002 | EP1220313A1 Circuit board support |
| 07/03/2002 | EP1220310A1 Semiconductor wafer with anisotropic conductor film, and method of manufacture thereof |
| 07/03/2002 | EP1220309A1 Manufacturing method of an electronic device package |
| 07/03/2002 | EP1218965A1 Method and apparatus for cooling with a phase change material and heat pipes |
| 07/03/2002 | EP1218940A1 On-chip electric power supply having optimized electromagnetic compatibility |
| 07/03/2002 | EP1218939A2 Lead frame laminate and method for manufacturing semiconductor parts |
| 07/03/2002 | EP1218688A2 Method and apparatus for three dimensional inspection of electronic components |
| 07/03/2002 | EP1151457A4 Method and apparatus for utilizing heat dissipated from an electrical device |
| 07/03/2002 | EP0902976B1 High frequency microelectronics package |
| 07/03/2002 | EP0851994B1 Absorbent pair refrigeration system |
| 07/03/2002 | CN2498815Y 改良散热器 Improved radiator |
| 07/03/2002 | CN2498744Y Assembly for radiating ribs of computer |
| 07/03/2002 | CN2498743Y Cooling structure for power thyristor converter |
| 07/03/2002 | CN2498742Y High heat-conductivity radiating holder |
| 07/03/2002 | CN2498741Y 镜片组件 Lens assembly |
| 07/03/2002 | CN1357157A Copper wiring |
| 07/03/2002 | CN1356861A Multi-layer circuit module with multi-layer ceramic substrate and embedded passive element |
| 07/03/2002 | CN1356725A Low-noise high-frequency integrated circuit device and its making method |
| 07/03/2002 | CN1356724A Refrigerating cooler of semiconductor element or device |
| 07/03/2002 | CN1356723A Semiconductor chip installed substrate, electro-optical evice, liquid crystal device, electroluminescent device and electronic machine |
| 07/03/2002 | CN1356368A Adhesive |
| 07/03/2002 | CN1356292A Silicon nitride powder, its sintered body, substrate and circuit board and thermoelectric element module thereof |
| 07/03/2002 | CN1356288A Glass-ceramic composition for ceramic-type electromic element, ceramic-type electronic element and process for preparing malti-layer ceramic-type electronic element |
| 07/03/2002 | CN1087134C Method and device for cooling integrated circuit of PC board |
| 07/03/2002 | CN1087102C Semiconductor appts. |
| 07/02/2002 | US6414904 Two channel memory system having shared control and address bus and memory modules used therefor |
| 07/02/2002 | US6414884 Method and apparatus for securing electronic circuits |
| 07/02/2002 | US6414849 Low stress and low profile cavity down flip chip and wire bond BGA package |
| 07/02/2002 | US6414848 CPU radiator assembly |
| 07/02/2002 | US6414847 Integral dielectric heatspreader |
| 07/02/2002 | US6414846 Heat sink assembly |
| 07/02/2002 | US6414585 Integrated passive components and package with posts |
| 07/02/2002 | US6414542 Integrated circuit with relative sense inversion of signals along adjacent parallel signal paths |
| 07/02/2002 | US6414397 Anisotropic conductive film, method of mounting semiconductor chip, and semiconductor device |
| 07/02/2002 | US6414396 Package for stacked integrated circuits |
| 07/02/2002 | US6414394 Semiconductor device |
| 07/02/2002 | US6414393 Semiconductor device |
| 07/02/2002 | US6414391 Module assembly for stacked BGA packages with a common bus bar in the assembly |
| 07/02/2002 | US6414390 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument |
| 07/02/2002 | US6414389 Alignment pedestals in an LDMOS power package |
| 07/02/2002 | US6414387 Semiconductor device including a chip having high-frequency circuit blocks |
| 07/02/2002 | US6414386 Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings |
| 07/02/2002 | US6414385 Quad flat non-lead package of semiconductor |
| 07/02/2002 | US6414384 Package structure stacking chips on front surface and back surface of substrate |
| 07/02/2002 | US6414383 Very low magnetic field integrated circuit |
| 07/02/2002 | US6414382 Film carrier tape, semiconductor assembly, semiconductor device and method of manufacturing the same, mounted board, and electronic instrument |
| 07/02/2002 | US6414381 Interposer for separating stacked semiconductor chips mounted on a multi-layer printed circuit board |
| 07/02/2002 | US6414380 Semiconductor device and method of making same |
| 07/02/2002 | US6414379 Structure of disturbing plate having down set |
| 07/02/2002 | US6414378 High speed IC package configuration |
| 07/02/2002 | US6414377 Low k dielectric materials with inherent copper ion migration barrier |
| 07/02/2002 | US6414374 Semiconductor device including edge bond pads and methods |
| 07/02/2002 | US6414369 Thin film capacitor element |