| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/09/2002 | US6417533 Semiconductor device having capacitor which assures sufficient capacity without requiring large space and method of producing the same |
| 07/09/2002 | US6417463 Depopulation of a ball grid array to allow via placement |
| 07/09/2002 | US6417116 Semiconductor device having a multilayer interconnection structure |
| 07/09/2002 | US6417097 Methods of forming a contact structure in a semiconductor device |
| 07/09/2002 | US6417089 Method of forming solder bumps with reduced undercutting of under bump metallurgy (UBM) |
| 07/09/2002 | US6417088 Method of application of displacement reaction to form a conductive cap layer for flip-chip, COB, and micro metal bonding |
| 07/09/2002 | US6417087 Forming a bond pad opening having a barrier layer film on the bottom surface of the upper portion of the opening, and forming vias which extend downwardly through the bottom surface |
| 07/09/2002 | US6417076 Automated combi deposition apparatus and method |
| 07/09/2002 | US6417068 Semiconductor device navigation using laser scribing |
| 07/09/2002 | US6417039 Method of manufacturing a semiconductor device comprising a semiconductor body having a surface provided with a coil having a magnetic core |
| 07/09/2002 | US6417029 Compliant package with conductive elastomeric posts |
| 07/09/2002 | US6417027 High density stackable and flexible substrate-based devices and systems and methods of fabricating |
| 07/09/2002 | US6417026 Bump electrodes are connected to the electrode pattern while in contact with the edge portions of the electrically insulating layer and the protection layer; high density mounting; surface acoustic wave device |
| 07/09/2002 | US6417025 Integrated circuit packages assembled utilizing fluidic self-assembly |
| 07/09/2002 | US6417018 Asymmetrical molding method for multiple part matrixes |
| 07/09/2002 | US6417017 Optosemiconductor device and the method for its manufacture |
| 07/09/2002 | US6416851 Bearing for refrigerating machine compressor and compressor |
| 07/09/2002 | US6416849 Method and structure to reduce low force pin pull failures in ceramic substrates |
| 07/09/2002 | US6416831 Evacuated package and a method of producing the same |
| 07/09/2002 | US6416812 Electroless plating bath using source of cupric ions, reducing agent and complexing agent in basic solution |
| 07/09/2002 | US6415977 Method and apparatus for marking and identifying a defective die site |
| 07/09/2002 | US6415853 Wind cover locking element structure of heat radiator |
| 07/09/2002 | US6415852 Heat sink assembly |
| 07/09/2002 | US6415627 Sorber having a cooling mechanism |
| 07/09/2002 | US6415626 Sorber having flexible housing |
| 07/09/2002 | US6415619 Multi-load refrigeration system with multiple parallel evaporators |
| 07/09/2002 | US6415612 Method and apparatus for external cooling an electronic component of a mobile hardware product, particularly a notebook computer, at a docking station having a thermoelectric cooler |
| 07/04/2002 | WO2002052912A1 Heat sink |
| 07/04/2002 | WO2002052647A2 Semiconductor device comprising an arrangement of an electrically programmable non-volatile memory element |
| 07/04/2002 | WO2002052646A1 Integrated circuit device |
| 07/04/2002 | WO2002052645A2 Enhanced die-up ball grid array packages and method for making the same |
| 07/04/2002 | WO2002052644A2 Thermally enhanced microcircuit package and method of forming same |
| 07/04/2002 | WO2002052643A2 Semiconductor wafer manufacturing process |
| 07/04/2002 | WO2002052642A2 Method for eliminating reaction between photoresist and organosilicate glass |
| 07/04/2002 | WO2002052641A2 Contact and via structure and method of fabrication |
| 07/04/2002 | WO2002052640A1 Method of reducing the specific resistance of an electrically conducting molybdenum layer |
| 07/04/2002 | WO2002052633A2 Assembly for mounting an integrated circuit on a support |
| 07/04/2002 | WO2002052630A2 Structural reinforcement of highly porous low k dielectric films by ild posts |
| 07/04/2002 | WO2002052589A1 Semiconductor device, and method and apparatus for manufacturing semiconductor device |
| 07/04/2002 | WO2002052588A1 Semiconductor device, and method and apparatus for manufacturing semiconductor device |
| 07/04/2002 | WO2002035289A3 Method and materials for printing particle-enhanced electrical contacts |
| 07/04/2002 | WO2002032636A3 Method for making micromolds |
| 07/04/2002 | WO2002023592A3 Method and apparatus for reducing ic die mass and thickness while improving strength characteristics |
| 07/04/2002 | WO2002015245A3 Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
| 07/04/2002 | WO2002013258A3 Backside contact for integrated circuit and method of forming same |
| 07/04/2002 | WO2001073864A3 Thin-film battery having ultra-thin electrolyte and associated method |
| 07/04/2002 | WO2000070676A9 High-density electronic package, and method for making same |
| 07/04/2002 | US20020087941 Semiconductor device having embedded array |
| 07/04/2002 | US20020086801 Dry thermal interface material |
| 07/04/2002 | US20020086585 Insulation device of an electric element |
| 07/04/2002 | US20020086561 Wiring board |
| 07/04/2002 | US20020086549 Resist mask having measurement marks for measuring the accuracy of overlay of a photomask disposed on semiconductor wafer |
| 07/04/2002 | US20020086542 Fabrication of semiconductor devices |
| 07/04/2002 | US20020086533 Forming copper bonding pad on top level of metallization; chemical mechanical polishing of bonding pad; etching pad; depositing a barrier layer over bonding pad; depositing aluminum or aluminum-copper alloy over barreier layer |
| 07/04/2002 | US20020086520 Semiconductor device having bump electrode |
| 07/04/2002 | US20020086519 Stacked vias and method |
| 07/04/2002 | US20020086518 Methods for producing electrode and semiconductor device |
| 07/04/2002 | US20020086516 Sub-minimum wiring structure |
| 07/04/2002 | US20020086513 Mask repattern process |
| 07/04/2002 | US20020086500 Semiconductor package and fabricating method thereof |
| 07/04/2002 | US20020086487 Integrated circuit fabrication method for self-aligned copper diffusion barrier |
| 07/04/2002 | US20020086486 Method of manufacturing semiconductor device and the semiconductor device |
| 07/04/2002 | US20020086475 Zero overlap contact/via with metal plug |
| 07/04/2002 | US20020086466 Integrated circuit with conductive lines disposed within isolation regions |
| 07/04/2002 | US20020086462 Method and structure to reduce the damage associated with programming electrical fuses |
| 07/04/2002 | US20020086453 Method of fabricating a liquid crystal display with reduced contact resistance |
| 07/04/2002 | US20020086451 Manufacture method for semiconductor inspection apparatus |
| 07/04/2002 | US20020086429 Method for determination of cure and oxidation of spin-on dielectric polymers |
| 07/04/2002 | US20020086111 Chemisorbing monolayers of a hydrazine-based compound and one or more refractory metal compounds on a substrate to form refractory metal nitride layer |
| 07/04/2002 | US20020086109 Chemical vapor deposition wherein at least one kind of organic substance including benzene nucleuses is used as a benzene nucleus source so that insulator includes benzene nucleuses |
| 07/04/2002 | US20020085761 Enhanced uniqueness for pattern recognition |
| 07/04/2002 | US20020085746 Semiconductor wafer on which recognition marks are formed and method for sawing the wafer using the recognition marks |
| 07/04/2002 | US20020085364 Electronic package with high density interconnect layer |
| 07/04/2002 | US20020085362 Low cost feature to indicate package orientation |
| 07/04/2002 | US20020085357 Heat sink assembly retainer device |
| 07/04/2002 | US20020085356 Electronic device |
| 07/04/2002 | US20020085336 High performance via capacitor and method for manufacturing same |
| 07/04/2002 | US20020084868 High-frequency switching module and high-frequency apparatus equipped with the same |
| 07/04/2002 | US20020084824 Stacked voltage rails for low-voltage DC distribution |
| 07/04/2002 | US20020084538 Apparatus and method for reducing interposer compression during molding process |
| 07/04/2002 | US20020084537 System and method for packaging a semiconductor die |
| 07/04/2002 | US20020084535 Chip scale package |
| 07/04/2002 | US20020084534 Semiconductor package including flip chip |
| 07/04/2002 | US20020084533 Efficient multiple power and ground distribution of SMT IC packages |
| 07/04/2002 | US20020084532 IC package pressure release apparatus and method |
| 07/04/2002 | US20020084530 Conductive lines with reduced pitch |
| 07/04/2002 | US20020084529 Interconnect structures and a method of electroless introduction of interconnect structures |
| 07/04/2002 | US20020084528 Wafer level package and method for manufacturing the same |
| 07/04/2002 | US20020084527 Hardening of copper to improve copper CMP performance |
| 07/04/2002 | US20020084526 Semiconductor device and manufacturing method thereof |
| 07/04/2002 | US20020084524 Ball grid array package comprising a heat sink |
| 07/04/2002 | US20020084523 Resin sealed semiconductor device |
| 07/04/2002 | US20020084522 Semiconductor device using interposer substrate and manufacturing method therefor |
| 07/04/2002 | US20020084521 Flip-chip on film assembly for ball grid array packages |
| 07/04/2002 | US20020084519 Semiconductor chip stack package and fabrication method thereof |
| 07/04/2002 | US20020084518 Semiconductor device |
| 07/04/2002 | US20020084517 Assembly with connecting structure |
| 07/04/2002 | US20020084516 Individualized low parasitic power distribution lines deposited over active integrated circuits |
| 07/04/2002 | US20020084515 Known good die using existing process infrastructure |
| 07/04/2002 | US20020084514 Wiring substrate for high frequency applications |