| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/16/2002 | US6419007 Heat sink-equipped cooling apparatus |
| 07/16/2002 | US6418615 Method of making multilayered substrate for semiconductor device |
| 07/11/2002 | WO2002054842A1 Method for producing bond pads on a printed circuit |
| 07/11/2002 | WO2002054838A1 Via-in-pad with off-center geometry and methods of manufacture |
| 07/11/2002 | WO2002054493A1 Conductive lines with reduced pitch |
| 07/11/2002 | WO2002054492A2 Circuit |
| 07/11/2002 | WO2002054491A2 Cu-pad/bonded/cu-wire with self-passivating cu-alloys |
| 07/11/2002 | WO2002054490A1 Heat sink and electronic device with heat sink |
| 07/11/2002 | WO2002054489A2 Temperature measurement system and method |
| 07/11/2002 | WO2002054488A2 Ic package pressure release apparatus and method |
| 07/11/2002 | WO2002054487A2 Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher ic power delivery |
| 07/11/2002 | WO2002054486A2 Self-passivating cu laser fuse |
| 07/11/2002 | WO2002054484A2 Metal ion diffusion barrier layers |
| 07/11/2002 | WO2002054476A1 Method of mounting chip |
| 07/11/2002 | WO2002054467A2 Semiconductor structure including a monocrystalline conducting layer |
| 07/11/2002 | WO2002054451A2 Method for stacking integrated circuits |
| 07/11/2002 | WO2002054447A2 System and method for prototyping and fabricating complex microwave circuits |
| 07/11/2002 | WO2002054414A2 Fat conductor |
| 07/11/2002 | WO2002053999A1 Semiconductor package with internal heat spreader |
| 07/11/2002 | WO2002045150A8 Spontaneous emission enhanced heat transport method and structures for cooling, sensing, and power generation |
| 07/11/2002 | WO2002032665A9 A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
| 07/11/2002 | WO2002027779A3 Singulation of semiconductor packages by tie bar cutting |
| 07/11/2002 | WO2002023616A8 Integrating metal with ultra low-k dielectrics |
| 07/11/2002 | WO2002021592A3 Method for producing an electroconductive layer on the wall of through holes in a substrate |
| 07/11/2002 | WO2001098398A9 Flame-retarded polyamides |
| 07/11/2002 | WO2001050525A3 Integrated circuit die having bond pads near adjacent sides to allow stacking of dice without regard to dice size |
| 07/11/2002 | WO2001039252A3 Active package for integrated circuit |
| 07/11/2002 | US20020090843 Socket structure for grid array (GA) packages |
| 07/11/2002 | US20020090837 Method of manufacturing a semiconductor device having contact pads |
| 07/11/2002 | US20020090833 Recess formed selectively in a main surface of insulating film including an alkylsilane bond; and a surface protective layer including Si-H bond, being formed in a surface of said insulating film in an inner wall of said recess. |
| 07/11/2002 | US20020090831 Thin-film circuit substrate and method of producing same |
| 07/11/2002 | US20020090821 Hardening of copper to improve copper CMP performance |
| 07/11/2002 | US20020090806 Copper dual damascene interconnect technology |
| 07/11/2002 | US20020090805 Electroplating method of fabrication of the solder bumps which method does not damage air bridges, micro-electromechanical structures, or optical surfaces that can be otherwise damaged |
| 07/11/2002 | US20020090804 Copper interconnect for an integrated circuit and methods for its fabrication |
| 07/11/2002 | US20020090803 Electrical or electronic component encapsulated in a sealed manner and process for producing it |
| 07/11/2002 | US20020090800 Electronic apparatus and manufacturing method for an electronic apparatus |
| 07/11/2002 | US20020090799 Substrate grinding systems and methods to reduce dot depth variation |
| 07/11/2002 | US20020090793 Method for fabricating a semiconductor device |
| 07/11/2002 | US20020090791 Method for reduced capacitance interconnect system using gaseous implants into the ild |
| 07/11/2002 | US20020090761 Package with low stress hermetic seal |
| 07/11/2002 | US20020090760 Method of forming heat sink and semiconductor chip assemblies |
| 07/11/2002 | US20020090759 Semiconductor device, method of connecting a semiconductor chip, circuit board, and electronic equipment |
| 07/11/2002 | US20020090755 Magnetic thin film, a magnetic component that uses this magnetic thin film, manufacturing methods for the same, and a power conversion device |
| 07/11/2002 | US20020090751 LOC semiconductor assembled with room temperature adhesive |
| 07/11/2002 | US20020090750 Underfill system for semiconductor package |
| 07/11/2002 | US20020090747 Method for examining structures on a wafer |
| 07/11/2002 | US20020090531 Organic luminescence device |
| 07/11/2002 | US20020090501 Graphitized carbon fibers obtained by spinning, infusibilizing, carbonizing, pulverizing, then graphitizing mesophase pitch; for use in development of semiconductors, electronics, power/light sources |
| 07/11/2002 | US20020090413 Molds for wafer scale molding of protective caps |
| 07/11/2002 | US20020090180 Wafer scale fiber optic termination |
| 07/11/2002 | US20020089836 Injection molded underfill package and method of assembly |
| 07/11/2002 | US20020089832 Semiconductor package with flash-proof device |
| 07/11/2002 | US20020089828 Semiconductor power element heat dissipation board, and conductor plate therefor and heat sink material and solder material |
| 07/11/2002 | US20020089827 Enhanced thermal path mechanical tolerance system |
| 07/11/2002 | US20020089826 Heat sink device fastening structure |
| 07/11/2002 | US20020089810 Integrated thin film capacitor/inductor/interconnect system and method |
| 07/11/2002 | US20020089808 Chip type solid electrolytic capacitor |
| 07/11/2002 | US20020089634 Wiring substrate, display device, semiconductor chip, and electronic equipment |
| 07/11/2002 | US20020089569 Inkjet device encapsulated at the wafer scale |
| 07/11/2002 | US20020089385 Planar dielectric integrated circuit |
| 07/11/2002 | US20020089345 Method and device for semiconductor wafer testing |
| 07/11/2002 | US20020089344 Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof |
| 07/11/2002 | US20020089097 Molding of protective caps |
| 07/11/2002 | US20020089096 Use of infrared radiation in molding of protective caps |
| 07/11/2002 | US20020089095 Molding assembly for wafer scale molding of protective caps |
| 07/11/2002 | US20020089071 Liquid epoxy resin composition and semiconductor device |
| 07/11/2002 | US20020089070 Apparatus and methods for coupling conductive leads of semiconductor assemblies |
| 07/11/2002 | US20020089069 Low capacitance coupling wire bonded semiconductor device |
| 07/11/2002 | US20020089068 Microwave semiconductor device and the manufacturing method thereof for improve heat discharge and electric property |
| 07/11/2002 | US20020089067 Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith |
| 07/11/2002 | US20020089064 Flexible lead surface-mount semiconductor package |
| 07/11/2002 | US20020089063 Copper dual damascene interconnect technology |
| 07/11/2002 | US20020089062 Fine pitch system and method for reinforcing bond pads in semiconductor devices |
| 07/11/2002 | US20020089061 Semiconductor device for suppressing detachment of conductive layer and method for manufacturing the semiconductor device |
| 07/11/2002 | US20020089060 Semiconductor device with porous interlayer insulating film |
| 07/11/2002 | US20020089059 Semiconductor device and method for manufacturing the same |
| 07/11/2002 | US20020089058 Electronic component with flexible bonding pads and method of producing such a component |
| 07/11/2002 | US20020089057 Semiconductor device including a semiconductor pellet having bump electrodes to pad electrodes of an interconnect board and method for manufacturing same |
| 07/11/2002 | US20020089055 Chip packaging system and method using deposited diamond film |
| 07/11/2002 | US20020089054 Semiconductor device having a ball grid array and a fabrication process thereof |
| 07/11/2002 | US20020089053 Package having array of metal pegs linked by printed circuit lines |
| 07/11/2002 | US20020089052 Semiconductor device and a method of manufacturing the same |
| 07/11/2002 | US20020089051 Semiconductor device |
| 07/11/2002 | US20020089050 Semiconductor device |
| 07/11/2002 | US20020089048 Multi-chip semiconductor package structure |
| 07/11/2002 | US20020089046 Low-inductance semiconductor components |
| 07/11/2002 | US20020089045 Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery |
| 07/11/2002 | US20020089044 Hermetic mems package with interlocking layers |
| 07/11/2002 | US20020089043 Semiconductor package with shortened electric signal paths |
| 07/11/2002 | US20020089042 Semiconductor leadframe for staggered board attach |
| 07/11/2002 | US20020089041 Lead-frame design modification to facilitate removal of resist tape from the lead-frame |
| 07/11/2002 | US20020089040 Semiconductor device having a ball grid array and a fabrication process thereof |
| 07/11/2002 | US20020089039 IC chip package |
| 07/11/2002 | US20020089036 Semiconductor device, method of manufacturing the same and method of designing the same |
| 07/11/2002 | US20020089033 Semiconductor device and semiconductor assembly apparatus for semiconductor device |
| 07/11/2002 | US20020089027 Apparatus for filling apertures in a film layer on a semiconductor structure |
| 07/11/2002 | US20020089020 N-channel metal oxide semiconductor (nmos) driver circuit and method of making same |
| 07/11/2002 | US20020089016 Thin layer semi-conductor structure comprising a heat distribution layer |
| 07/11/2002 | US20020088999 Transient fuse for charge-induced damage detection |