| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/11/2002 | US20020088987 Optical device and method for manufacturing the same, and electronic apparatus |
| 07/11/2002 | US20020088984 Semiconductor chip mounting substrate, electrooptical device, liquid-crystal device, electroluminescent device, and electronic equipment |
| 07/11/2002 | US20020088981 Optical unit incorporating light-emitting or light-receiving element coated by resin |
| 07/11/2002 | US20020088977 Stacked capacitor and method of forming the same as well as semiconductor device using the same and circuit board using the same |
| 07/11/2002 | US20020088974 Method for evaulating of molding material with dams formed on a semiconductor substrate to define slits for capturing the fillers contained in the molding material |
| 07/11/2002 | US20020088973 Semiconductor chip including a reference element having reference coordinates |
| 07/11/2002 | US20020088845 Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for elecronic parts having the film |
| 07/11/2002 | US20020088743 Method for sorting integrated circuit devices |
| 07/11/2002 | US20020088716 Depositing a copper alloy seed layer over a surface of a substrate, copper alloy seed layer comprising an alloying material selected from the group of aluminum, magnesium |
| 07/11/2002 | US20020088646 Structure equipped with electrical contacts formed through the substrate of this structure and process for obtaining such a structure |
| 07/11/2002 | US20020088634 QFN package and a fabrication method thereof |
| 07/11/2002 | US20020088633 Multi-chip memory devices, modules and control methods including independent control of memory chips |
| 07/11/2002 | US20020088632 Integrated circuit package including opening exposing portion of an IC |
| 07/11/2002 | US20020088609 Scalable and modular heat sink-heat pipe cooling system |
| 07/11/2002 | US20020088607 Heat sink assembly |
| 07/11/2002 | US20020088606 Computer heat dissipater structure |
| 07/11/2002 | US20020088605 Device for cooling of electronic components |
| 07/11/2002 | US20020088537 Wafer scale molding of protective caps |
| 07/11/2002 | US20020088117 Chromium adhesion layer for copper vias in low-k technology |
| 07/11/2002 | US20020088116 Method of making a CTE compensated chip interposer |
| 07/11/2002 | DE10150507A1 Verbindungsverfahren und Verbindungsstruktur von Anschlussflächenelektroden und Prüfverfahren für den Verbindungszustand derselben Connection method and connection structure of pad electrodes and test methods for the connection state of the same |
| 07/11/2002 | DE10100679A1 Träger für Bauelemente der Mikrosystemtechnik Support for components of microsystem technology |
| 07/11/2002 | DE10065747A1 Schaltungsanordnung Circuitry |
| 07/11/2002 | DE10065663A1 Semiconductor switching arrangement used in storage devices comprises a semiconductor substrate, a contact element formed in one region on the substrate, and a contact region |
| 07/11/2002 | DE10065470A1 Heat sink for electrical or electronic components has casting skin removed from edge of cooling ribs formed integrally with base part |
| 07/11/2002 | DE10065339A1 Semiconductor chip security protection device has capacitance of matrix of capacitors defined by presence of electrically insulating cover |
| 07/11/2002 | DE10064194A1 Leistungshalbleiter-Modul und Kühlkörper zur Aufnahme des Leistungshalbleiter-Moduls Power semiconductor module and the cooling body for receiving the power semiconductor module |
| 07/11/2002 | DE10062661A1 Testzellenstruktur zum Abschätzen elektrischer Eigenschaften von auf einem Substrat gebildeten eng beabstandeten Verbindungsflächen Test cell structure for estimating the electrical properties of formed on a substrate closely spaced joining surfaces |
| 07/10/2002 | EP1221739A2 Sheet for electronic parts and method of producing the same |
| 07/10/2002 | EP1221726A2 Carrier for components of microsystems |
| 07/10/2002 | EP1221724A2 Sealing material with wavelength converting effect, application and production process |
| 07/10/2002 | EP1221717A2 Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same |
| 07/10/2002 | EP1221716A2 IC chip package |
| 07/10/2002 | EP1221177A1 Conformal lining layers for damascene metallization |
| 07/10/2002 | EP0948813B1 Chip module and method for producing the same |
| 07/10/2002 | CN2500072Y Radiator device |
| 07/10/2002 | CN2500071Y Radiator holding device |
| 07/10/2002 | CN2500070Y Radiator device |
| 07/10/2002 | CN2500014Y Self cooling type thyrister cut-in and cut-off capacitor device |
| 07/10/2002 | CN2499980Y Air radiator |
| 07/10/2002 | CN2499979Y Electronic radiator |
| 07/10/2002 | CN2499978Y Three dimension stacking package radiator module |
| 07/10/2002 | CN2499977Y Radiator fin fixer |
| 07/10/2002 | CN2499976Y Cpu水冷散热器 Cpu water cooler |
| 07/10/2002 | CN2499975Y Forming device for radiator fin |
| 07/10/2002 | CN2499974Y Chip radiation assembly |
| 07/10/2002 | CN2499891Y Holding structure of central processor radiator |
| 07/10/2002 | CN2499889Y Heat radiation seat clamp |
| 07/10/2002 | CN1358411A Gel structure for combined EMI shielding and thermal control of microelectronic assemblies |
| 07/10/2002 | CN1358331A Interposer and method of making same |
| 07/10/2002 | CN1358330A Semiconductor devices with improved lead frame structures |
| 07/10/2002 | CN1358329A Damascene structure and method for forming damascene structure |
| 07/10/2002 | CN1358131A Method for producing of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 07/10/2002 | CN1358118A Production method of multi gauge strips |
| 07/10/2002 | CN1358059A Structure of reducing mutual inductance between adjacent wires on substrate |
| 07/10/2002 | CN1357929A Optical semiconductor device and its making process |
| 07/10/2002 | CN1357921A Coating soldered pad configuration for reducing chip impedance |
| 07/10/2002 | CN1357920A Chip conducting lug and re-distributed wire layer configuration |
| 07/10/2002 | CN1357919A Package structure and method for power type semiconductor chip |
| 07/10/2002 | CN1357918A Chip type passive element structure and its packing making process |
| 07/10/2002 | CN1357917A Chip coating module with integral packing and radiating structure |
| 07/10/2002 | CN1357916A IC package structure and its manufacture |
| 07/10/2002 | CN1357911A Flip chip for film packed spherical grid array assembly |
| 07/10/2002 | CN1357910A Substrate-type semiconductor device packing method without glue overflow |
| 07/10/2002 | CN1357740A Composite high-density heat radiator and its making process |
| 07/10/2002 | CN1087511C Apparatus for providing controlled impedance in electrical contact |
| 07/10/2002 | CN1087502C Ballast monitoring for radio frequency power transistors |
| 07/10/2002 | CN1087496C 半导体装置 Semiconductor device |
| 07/10/2002 | CN1087495C Automatic binding adhesive tape |
| 07/10/2002 | CN1087494C Contact mask for manufacturing semiconductor device |
| 07/10/2002 | CN1087492C Semiconductor device and process of fabrication thereof |
| 07/09/2002 | US6418030 Multi-chip module |
| 07/09/2002 | US6418025 Clip for heat sink |
| 07/09/2002 | US6418024 Heat sink apparatus and method of attaching the heat sink apparatus to a device |
| 07/09/2002 | US6418023 Vertical surface mount apparatus with thermal carrier |
| 07/09/2002 | US6418022 Heat sink clip with operating bar |
| 07/09/2002 | US6418020 Heat dissipation device with ribbed fin plates |
| 07/09/2002 | US6418019 Electronic module including a cooling substrate with fluid dissociation electrodes and related methods |
| 07/09/2002 | US6418017 Heat dissipating chassis member |
| 07/09/2002 | US6417754 Three-dimensional coil inductor |
| 07/09/2002 | US6417747 Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards |
| 07/09/2002 | US6417744 Transition between asymmetric stripline and microstrip in cavity |
| 07/09/2002 | US6417721 Device and method for limiting the extent to which circuits in integrated circuit dice electrically load bond pads and other circuit nodes in the dice |
| 07/09/2002 | US6417718 Semiconductor device without limitation on insert orientation on board |
| 07/09/2002 | US6417695 Antifuse reroute of dies |
| 07/09/2002 | US6417576 Method and apparatus for attaching multiple metal components to integrated circuit modules |
| 07/09/2002 | US6417575 Semiconductor device and fabrication process therefor |
| 07/09/2002 | US6417574 Surface-acoustic-wave device for flip-chip mounting |
| 07/09/2002 | US6417572 Process for producing metal interconnections and product produced thereby |
| 07/09/2002 | US6417568 Semiconductor device |
| 07/09/2002 | US6417567 Multilayer, silicon, metal silicide, titanium oxynitride |
| 07/09/2002 | US6417566 Void eliminating seed layer and conductor core integrated circuit interconnects |
| 07/09/2002 | US6417564 Semiconductor element with metal layer |
| 07/09/2002 | US6417563 Spring frame for protecting packaged electronic devices |
| 07/09/2002 | US6417562 Silicon verification with embedded testbenches |
| 07/09/2002 | US6417558 Semiconductor device having a reduced parasitic capacitance bonding pad structure |
| 07/09/2002 | US6417557 Semiconductor device having a capacitance adjustment section |
| 07/09/2002 | US6417556 High K dielectric de-coupling capacitor embedded in backend interconnect |
| 07/09/2002 | US6417541 ESD protection network with field oxide device and bonding pad |
| 07/09/2002 | US6417535 Vertical interdigitated metal-insulator-metal capacitor for an integrated circuit |