| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/11/2013 | CN103444270A Wiring substrate, multi-piece wiring substrate, and method for manufacturing same |
| 12/11/2013 | CN103444080A Semiconductor device, method for manufacturing same, and portable telephone |
| 12/11/2013 | CN103443919A Three-dimensional integrated circuit laminate and interlayer filler material for three-dimensional integrated circuit laminate |
| 12/11/2013 | CN103443917A 冷却器 Cooler |
| 12/11/2013 | CN103443916A Method for producing package substrate for mounting semiconductor element, package substrate for mounting semiconductor element, and semiconductor package |
| 12/11/2013 | CN103443915A 半导体器件 Semiconductor devices |
| 12/11/2013 | CN103443315A Composite member provided with substrate formed from composite material |
| 12/11/2013 | CN103443314A Sintered Mo part for heat sink plate for semiconductor device and semiconductor device including same |
| 12/11/2013 | CN103443310A Cu-co-si-based copper alloy strip for electron material, and method for manufacturing same |
| 12/11/2013 | CN103442541A Micro cooling device of silicon-substrate capillary pump loop |
| 12/11/2013 | CN103441129A Array substrate, manufacturing method of array substrate and display device |
| 12/11/2013 | CN103441124A Stacking packaging method of voltage regulator and corresponding stacking packaging device |
| 12/11/2013 | CN103441119A Method for manufacturing ESD, ESD and display panel |
| 12/11/2013 | CN103441118A Conductive barrier layer material for copper interconnection and preparation method of conductive barrier layer material |
| 12/11/2013 | CN103441117A Semiconductor device, three-dimensional structure with wiring on the surface, memory card and magnetic head module |
| 12/11/2013 | CN103441116A Semiconductor package piece and manufacturing method thereof |
| 12/11/2013 | CN103441115A Lead-wire framework and chip inversion packaging device applying the lead-wire framework |
| 12/11/2013 | CN103441114A Semiconductor sealing structure |
| 12/11/2013 | CN103441113A Novel semiconductor IC frame |
| 12/11/2013 | CN103441112A Constant-current tube with low saturation voltage drop |
| 12/11/2013 | CN103441111A Three-dimensional packaging interconnection structure and manufacturing method thereof |
| 12/11/2013 | CN103441110A Heat radiation device with pulsating flow and leaf vein type micro channel |
| 12/11/2013 | CN103441109A Semiconductor element, semiconductor package structure and manufacturing method thereof |
| 12/11/2013 | CN103441108A Chip front-mounting BGA encapsulating structure |
| 12/11/2013 | CN103441107A Semiconductor packaging piece and manufacturing method thereof |
| 12/11/2013 | CN103441106A Chip flip-mounting BGA encapsulating structure |
| 12/11/2013 | CN103441105A Display panel and its manufacturing method |
| 12/11/2013 | CN103441082A Brand-novel integrated circuit packaging technology |
| 12/11/2013 | CN103441081A Semiconductor composite structure and semiconductor process |
| 12/11/2013 | CN103441078A Three-dimensional system-level chip normal installation stacking packaging structure formed by sealing first and then corroding and technique method |
| 12/11/2013 | CN103441061A 电容器结构及其制作方法 Capacitor structure and manufacturing method thereof |
| 12/11/2013 | CN103439844A Array substrate, display device and method for manufacturing array substrate |
| 12/11/2013 | CN103438409A Aluminum heat radiating module of LED (Light Emitting Diode) |
| 12/11/2013 | CN102762659B One-pack epoxy resin composition, and use thereof |
| 12/11/2013 | CN102460688B Power semiconductor radiator |
| 12/11/2013 | CN102446977B Axial commutation diode |
| 12/11/2013 | CN102403246B Method for detecting pollution of mask plate |
| 12/11/2013 | CN102299127B Bidirectional radiator used for packaged component and assembly method thereof |
| 12/11/2013 | CN102254856B Semiconductor device used in interconnection technology and manufacturing method thereof |
| 12/11/2013 | CN102224586B Structure and manufacture method for multi-row lead frame and semiconductor package |
| 12/11/2013 | CN102201420B Photoelectric conversion apparatus, image pickup system, and manufacturing method therefor |
| 12/11/2013 | CN102169873B Semiconductor packing structure applied to power switcher circuit |
| 12/11/2013 | CN102097336B 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing |
| 12/11/2013 | CN102083930B Adhesive encapsulating composition and electronic devices made therewith |
| 12/11/2013 | CN102046548B Semiconductor encapsulation material and method for encapsulating semiconductor using the same |
| 12/11/2013 | CN102044540B Semiconductor element and operating method thereof |
| 12/11/2013 | CN101976659B Outer package-free crystal device and manufacturing method thereof |
| 12/11/2013 | CN101894770B Pre-oxidation method of semiconductor packaging and routing surface and pre-oxidation layer structure thereof |
| 12/11/2013 | CN101877348B System and method for embedded chip package with chips stacked in an interconnecting laminate |
| 12/11/2013 | CN101783370B 太阳能电池模块 The solar cell module |
| 12/11/2013 | CN101740580B Semiconductor device and layout method for the semiconductor device |
| 12/11/2013 | CN101740554B Power semiconductor module with control function and integrated converter |
| 12/11/2013 | CN101690440B Fan and storage device mounting assembly for electronic device |
| 12/11/2013 | CN101656253B 半导体器件 Semiconductor devices |
| 12/11/2013 | CN101510555B 有机el装置 Means an organic el |
| 12/11/2013 | CN101459127B Sensor module and method for manufacturing a sensor module |
| 12/10/2013 | US8605427 Heat dissipation device utilizing fan duct |
| 12/10/2013 | US8604627 Semiconductor device |
| 12/10/2013 | US8604626 Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assembly |
| 12/10/2013 | US8604625 Semiconductor device having conductive pads to prevent solder reflow |
| 12/10/2013 | US8604624 Flip chip interconnection system having solder position control mechanism |
| 12/10/2013 | US8604623 Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive |
| 12/10/2013 | US8604622 Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device |
| 12/10/2013 | US8604621 Semiconductor device and information processing system including the same |
| 12/10/2013 | US8604619 Through silicon via keep out zone formation along different crystal orientations |
| 12/10/2013 | US8604618 Structure and method for reducing vertical crack propagation |
| 12/10/2013 | US8604617 Semiconductor device |
| 12/10/2013 | US8604616 Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip |
| 12/10/2013 | US8604615 Semiconductor device including a stack of semiconductor chips, underfill material and molding material |
| 12/10/2013 | US8604614 Semiconductor packages having warpage compensation |
| 12/10/2013 | US8604613 Electronic assembly having a multilayer adhesive structure |
| 12/10/2013 | US8604612 Chip attach adhesive to facilitate embedded chip build up and related systems and methods |
| 12/10/2013 | US8604611 Semiconductor device assembly utilizing a DBC substrate |
| 12/10/2013 | US8604610 Flexible power module semiconductor packages |
| 12/10/2013 | US8604609 Flange for semiconductor die |
| 12/10/2013 | US8604608 Semiconductor module |
| 12/10/2013 | US8604607 Semiconductor module and semiconductor device |
| 12/10/2013 | US8604606 Heat sink package |
| 12/10/2013 | US8604605 Microelectronic assembly with multi-layer support structure |
| 12/10/2013 | US8604604 Conductive interconnects |
| 12/10/2013 | US8604602 Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereof |
| 12/10/2013 | US8604601 Semiconductor device having wiring layers with power-supply plane and ground plane |
| 12/10/2013 | US8604600 Fully molded fan-out |
| 12/10/2013 | US8604599 Semiconductor housing and method for the production of a semiconductor housing |
| 12/10/2013 | US8604598 Microelectronic devices and methods for manufacturing microelectronic devices |
| 12/10/2013 | US8604597 Multi-die packages incorporating flip chip dies and associated packaging methods |
| 12/10/2013 | US8604596 Integrated circuit packaging system with locking interconnects and method of manufacture thereof |
| 12/10/2013 | US8604595 Multi-chip electronic package with reduced stress |
| 12/10/2013 | US8604594 Structures for preventing cross-talk between through-silicon vias and integrated circuits |
| 12/10/2013 | US8604593 Reconfiguring through silicon vias in stacked multi-die packages |
| 12/10/2013 | US8604592 Semiconductor device |
| 12/10/2013 | US8604587 Capacitor integration at top-metal level with a protective cladding for copper surface protection |
| 12/10/2013 | US8604585 Fuse of semiconductor device and method for fabricating the same |
| 12/10/2013 | US8604568 Multi-chip package |
| 12/10/2013 | US8604558 Semiconductor device having improved reliability |
| 12/10/2013 | US8604552 Semiconductor device and method for fabricating semiconductor device |
| 12/10/2013 | US8604521 Optically controlled read only memory |
| 12/10/2013 | US8604505 Semiconductor device and a method of manufacturing the same and designing the same |
| 12/10/2013 | US8604475 IC dies with serarate connections to expected and mask data |
| 12/10/2013 | US8604474 Semiconductor device integrated with monitoring device in center thereof |