| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/18/2002 | WO2002056371A1 Method for mounting a semiconductor component in a housing |
| 07/18/2002 | WO2002056367A1 Wafer scale molding of protective caps |
| 07/18/2002 | WO2002056366A1 Use of protective caps as masks at a wafer scale |
| 07/18/2002 | WO2002056364A2 Conductor reservoir volume for integrated circuit interconnects |
| 07/18/2002 | WO2002056362A1 Wafer scale fiber optic termination |
| 07/18/2002 | WO2002056360A1 Inkjet device encapsulated at the wafer scale |
| 07/18/2002 | WO2002056348A2 Method for incorporating silicon into cvd metal films |
| 07/18/2002 | WO2002056345A2 Flip chip package semiconductor device having double stud bumps and method of forming same |
| 07/18/2002 | WO2002056342A2 Copper vias in low-k technology |
| 07/18/2002 | WO2002056340A2 Semiconductor device with fuse, resistor, diffusion barrier or capacitor of a refractory metal-silicon-nitrogen compound |
| 07/18/2002 | WO2002056337A1 Chromium adhesion layer for copper vias in low-k technology |
| 07/18/2002 | WO2002056031A1 Accelerometer protected by caps applied at the wafer scale |
| 07/18/2002 | WO2002055942A2 Normal-flow heat exchanger |
| 07/18/2002 | WO2002055908A1 Plastic control plate for the gearbox control device of a hydraulic motor vehicle |
| 07/18/2002 | WO2002055907A1 Hydraulic motor-vehicle gearbox control device with a plastic hydraulic distribution plate and conductors integrated therein |
| 07/18/2002 | WO2002055431A2 Wafer level interconnection |
| 07/18/2002 | WO2002055430A1 Hermetic mems package with interlocking layers |
| 07/18/2002 | WO2002042703A3 Liquid cooled heat exchanger with enhanced flow |
| 07/18/2002 | WO2002041335A9 High quality printed inductor on a package |
| 07/18/2002 | WO2002003460A3 Semiconductor chip module with a protective film |
| 07/18/2002 | WO2001093331A3 Fuse link |
| 07/18/2002 | WO2001088976A3 Wireless radio frequency testing methode of integrated circuits and wafers |
| 07/18/2002 | WO2001081856A3 Technique for determining curvatures of embedded line features on substrates |
| 07/18/2002 | WO2001075973A3 Combined transistor-capacitor structure in deep sub-micron cmos for power amplifiers |
| 07/18/2002 | US20020094710 Electronic component with isolation barriers between the terminal pins |
| 07/18/2002 | US20020094707 Electronic configuration with flexible bonding pads |
| 07/18/2002 | US20020094701 Stretchable interconnects using stress gradient films |
| 07/18/2002 | US20020094698 Inserting a layer of silicon nitride under substantial compressive stress between low k dielectric black diamond and a substrate |
| 07/18/2002 | US20020094695 Mixed gases containing perfluorobutane and oxygen or tetrafluorocarbon, trifluoromethane and nitrogen are used to carry out via hole etching |
| 07/18/2002 | US20020094683 Method for manufacturing chip size package and its structure |
| 07/18/2002 | US20020094679 Alignment mark and exposure alignment system and method using the same |
| 07/18/2002 | US20020094675 Methods of contacting lines and methods of forming an electrical contact in a semiconductor device |
| 07/18/2002 | US20020094674 Methods for inhibiting microelectronic damascene processing induced low dielectric constant dielectric layer physical degradation |
| 07/18/2002 | US20020094673 Method for making interconnects and diffusion barriers in integrated circuits |
| 07/18/2002 | US20020094671 Methods for providing void-free layers for semiconductor assemblies |
| 07/18/2002 | US20020094670 Semiconductor device having bonding pad electrode of multi-layer structure |
| 07/18/2002 | US20020094656 Metal-insulator-metal capacitor in copper |
| 07/18/2002 | US20020094615 Semiconductor device and method for manufacturing the same |
| 07/18/2002 | US20020094611 Low programming voltage anti-fuse structure |
| 07/18/2002 | US20020094609 Semiconductor assembly without adhesive fillets |
| 07/18/2002 | US20020094608 Semiconductor assembly without adhesive fillets |
| 07/18/2002 | US20020094607 Electronic component with stacked semiconductor chips and method of producing the component |
| 07/18/2002 | US20020094606 Fabrication process of semiconductor package and semiconductor package |
| 07/18/2002 | US20020094605 Method for fabricating a stacked chip package |
| 07/18/2002 | US20020094604 Method for fabricating a multilayer ceramic substrate |
| 07/18/2002 | US20020094601 Method for manufacturing wafer level chip size package |
| 07/18/2002 | US20020094595 Method for making flash memory with UV opaque passivation layer |
| 07/18/2002 | US20020094423 Multilayer ceramic wiring board and process for producing same |
| 07/18/2002 | US20020093812 Method and apparatus for illuminating projecting features on the surface of a semiconductor wafer |
| 07/18/2002 | US20020093805 Support for components used in microsystems technology |
| 07/18/2002 | US20020093804 Multilayer reference plane in package devices |
| 07/18/2002 | US20020093803 Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers |
| 07/18/2002 | US20020093789 Apparatus and method for cooling a heat generating component |
| 07/18/2002 | US20020093414 Patterned ground shield for mirror current elimination |
| 07/18/2002 | US20020093412 Electronic packaging device with insertable leads and method of manufacturing |
| 07/18/2002 | US20020093120 Manufacturing method of an electronic device package |
| 07/18/2002 | US20020093109 Composition and method for containing metal ions in electronic devices |
| 07/18/2002 | US20020093108 Flip chip packaged semiconductor device having double stud bumps and method of forming same |
| 07/18/2002 | US20020093107 Wafer level package incorporating dual stress buffer layers for i/o redistribution |
| 07/18/2002 | US20020093106 Bonding pad for flip-chip fabrication |
| 07/18/2002 | US20020093105 Semiconductor device having a contact window and fabrication method thereof |
| 07/18/2002 | US20020093104 Conductive adhesive interconnection with insulating polymer carrier |
| 07/18/2002 | US20020093103 Interconnection alloy for integrated circuits |
| 07/18/2002 | US20020093101 Method of metallization using a nickel-vanadium layer |
| 07/18/2002 | US20020093099 Contact plug |
| 07/18/2002 | US20020093098 Semiconductor device and method of formation |
| 07/18/2002 | US20020093097 Semiconductor device |
| 07/18/2002 | US20020093096 Semiconductor device, manufacturing method and apparatus for the same |
| 07/18/2002 | US20020093095 Heat spreader hole pin 1 identifier |
| 07/18/2002 | US20020093094 Semiconductor device |
| 07/18/2002 | US20020093093 Semiconductor package with stacked dies |
| 07/18/2002 | US20020093092 Power semiconductor module and cooling element for holding the power semiconductor module |
| 07/18/2002 | US20020093091 Method of fabricating a ground-ball bonding structure without trapped air for tape ball grid array application |
| 07/18/2002 | US20020093089 Compliant mounting interface for electronic devices |
| 07/18/2002 | US20020093088 High density integrated circuits and the method of packaging the same |
| 07/18/2002 | US20020093087 Semiconductor package with stacked dies |
| 07/18/2002 | US20020093085 Semiconductor device and fabrication process therefor |
| 07/18/2002 | US20020093083 Integrated circuit with identification circuit and method for checking a connection situation of a bonding pad |
| 07/18/2002 | US20020093082 Semiconductor device and manufacturing method of that |
| 07/18/2002 | US20020093081 Semiconductor device and method of making the same |
| 07/18/2002 | US20020093079 Grid array package with increased electrical grounding routes and method of fabrication |
| 07/18/2002 | US20020093078 Optical device packages having improved conductor efficiency, optical coupling and thermal transfer |
| 07/18/2002 | US20020093077 Positive-type photosensitive polyimide precursor and composition comprising the same |
| 07/18/2002 | US20020093074 Antifuses and methods for forming the same |
| 07/18/2002 | US20020093072 Method and article for filling apertures in a high performance electronic substrate |
| 07/18/2002 | US20020093062 Power semiconductor switching devices, power converters, integrated circuit assemblies, Integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor |
| 07/18/2002 | US20020093057 Conductor reservoir volume for integrated circuit interconnects |
| 07/18/2002 | US20020093056 Esd protection network with field oxide device and bonding pad |
| 07/18/2002 | US20020093042 Integrated circuit devices that utilize doped Poly-Si1-xGex conductive plugs as interconnects and methods of fabricating the same |
| 07/18/2002 | US20020093037 Structure and method of repair of integrated circuits |
| 07/18/2002 | US20020093035 Semiconductor memory device having multilayered storage node contact plug and method for fabricating the same |
| 07/18/2002 | US20020093029 Apparatus and method for forming a battery in an intergrated circuit |
| 07/18/2002 | US20020093028 Semiconductor device and a process for manufacturing the same |
| 07/18/2002 | US20020093026 Image sensor of a quad flat package |
| 07/18/2002 | US20020093014 Semiconductor chip, semiconductor device, and process for producing a semiconductor device |
| 07/18/2002 | US20020092971 Optoelectronic component with a conductor strip element |
| 07/18/2002 | US20020092772 Barrier layer for electroplating processes |
| 07/18/2002 | US20020092676 Compliant layer for encapsulated cloumns |
| 07/18/2002 | US20020092674 Surface-mounting substrate and structure comprising substrate and part mounted on the substrate |
| 07/18/2002 | US20020092307 Thermoelectric spot coolers for RF and microwave communication integrated circuits |