| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/24/2002 | CN1360463A Method for making printed circuit board with corrosion-resistant dry film |
| 07/24/2002 | CN1360461A Heat radiator assembly and its assembling method |
| 07/24/2002 | CN1360346A 电子结构及其形成方法 Electronic structure and method of forming |
| 07/24/2002 | CN1360344A Method of mfg. semiconductor device, and semiconductor device |
| 07/24/2002 | CN1360341A Titanium silicide method using amorphous pre-injection of Ge or Sb and washing |
| 07/24/2002 | CN1360320A Synthetic multi-layer ceramic electronic component and mfg. method thereof |
| 07/24/2002 | CN1360243A Current guider of heat radiation module |
| 07/24/2002 | CN1359975A Method for preparing epoxy resin composition for sealing optoelectronic semiconductor elements |
| 07/24/2002 | CN1088248C Polar electronic component and mounting structure therefor |
| 07/23/2002 | US6424541 Electronic device attachment methods and apparatus for forming an assembly |
| 07/23/2002 | US6424533 Thermoelectric-enhanced heat spreader for heat generating component of an electronic device |
| 07/23/2002 | US6424532 Heat sink and memory module with heat sink |
| 07/23/2002 | US6424531 High performance heat sink for electronics cooling |
| 07/23/2002 | US6424530 Clip for heat sink |
| 07/23/2002 | US6424529 High performance heat exchange assembly |
| 07/23/2002 | US6424528 Heatsink with embedded heat pipe for thermal management of CPU |
| 07/23/2002 | US6424509 Semiconductor including a protective circuit |
| 07/23/2002 | US6424227 Monolithic balanced RF power amplifier |
| 07/23/2002 | US6424223 MMIC power amplifier with wirebond output matching circuit |
| 07/23/2002 | US6424168 Reduced terminal testing system |
| 07/23/2002 | US6424161 Apparatus and method for testing fuses |
| 07/23/2002 | US6424052 Alignment mark for electron beam lithography |
| 07/23/2002 | US6424051 Semiconductor device |
| 07/23/2002 | US6424050 Semiconductor device |
| 07/23/2002 | US6424049 Semiconductor device having chip-on-chip structure and semiconductor chip used therefor |
| 07/23/2002 | US6424048 Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for them |
| 07/23/2002 | US6424047 Plastic ball grid array package for passing JEDEC Level 1 Moisture Sensitivity Test |
| 07/23/2002 | US6424046 Substrate for manufacturing a semiconductor device with three element alloy |
| 07/23/2002 | US6424044 Plasma enhanced vapor deposition |
| 07/23/2002 | US6424041 Semiconductor device |
| 07/23/2002 | US6424040 Integration of fluorinated dielectrics in multi-level metallizations |
| 07/23/2002 | US6424038 Low dielectric constant microelectronic conductor structure with enhanced adhesion and attenuated electrical leakage |
| 07/23/2002 | US6424037 Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball |
| 07/23/2002 | US6424036 Semiconductor device and method for manufacturing the same |
| 07/23/2002 | US6424033 Chip package with grease heat sink and method of making |
| 07/23/2002 | US6424032 Semiconductor device having a power supply ring and a ground ring |
| 07/23/2002 | US6424030 Semiconductor memory module having double-sided stacked memory chip layout |
| 07/23/2002 | US6424028 Semiconductor devices configured to tolerate connection misalignment |
| 07/23/2002 | US6424027 Low pass filter integral with semiconductor package |
| 07/23/2002 | US6424026 Power module with closely spaced printed circuit board and substrate |
| 07/23/2002 | US6424025 Cross grid array package structure and method of manufacture |
| 07/23/2002 | US6424024 Leadframe of quad flat non-leaded package |
| 07/23/2002 | US6424023 Leadframe for molded semiconductor package and semiconductor package made using the leadframe |
| 07/23/2002 | US6424022 Guard mesh for noise isolation in highly integrated circuits |
| 07/23/2002 | US6424021 Passivation method for copper process |
| 07/23/2002 | US6424014 Semiconductor element with electric field reducing device mounted therein for increasing dielectric strength |
| 07/23/2002 | US6424006 Semiconductor component |
| 07/23/2002 | US6423999 Semiconductor device and capacitor with means to prevent deterioration due to hydrogen |
| 07/23/2002 | US6423995 Scratch protection for direct contact sensors |
| 07/23/2002 | US6423992 Semiconductor integrated circuit device |
| 07/23/2002 | US6423988 Pressure-contact semiconductor device |
| 07/23/2002 | US6423982 Diamond interconnection substrate and a manufacturing method therefor |
| 07/23/2002 | US6423939 Micro soldering method and apparatus |
| 07/23/2002 | US6423938 Method for the electrical and/or mechanical interconnection of components of a microelectronic system |
| 07/23/2002 | US6423908 Substrate for use in forming electronic package |
| 07/23/2002 | US6423907 Components with releasable leads |
| 07/23/2002 | US6423815 Fluorinated polyimide |
| 07/23/2002 | US6423644 Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures |
| 07/23/2002 | US6423643 Process of making carrier substrate and semiconductor device |
| 07/23/2002 | US6423633 Implanting plurality of atoms into surface of patterned copper layer using implantation gas which comprises one selected from group consisting of nitrogen, oxygen, nitrogen dioxide and nitrous oxide, heat treating |
| 07/23/2002 | US6423629 Multilevel copper interconnects with low-k dielectrics and air gaps |
| 07/23/2002 | US6423628 Method of forming integrated circuit structure having low dielectric constant material and having silicon oxynitride caps over closely spaced apart metal lines |
| 07/23/2002 | US6423626 Removal of metal cusp for improved contact fill |
| 07/23/2002 | US6423625 Method of improving the bondability between Au wires and Cu bonding pads |
| 07/23/2002 | US6423624 Ball array layout |
| 07/23/2002 | US6423623 Low Resistance package for semiconductor devices |
| 07/23/2002 | US6423622 Lead-bond type chip package and manufacturing method thereof |
| 07/23/2002 | US6423616 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 07/23/2002 | US6423582 Use of DAR coating to modulate the efficiency of laser fuse blows |
| 07/23/2002 | US6423581 Method of fabricating an encapsulant lock feature in integrated circuit packaging |
| 07/23/2002 | US6423580 Method for manufacturing a dual chip package |
| 07/23/2002 | US6423579 Apparatus and methods for providing substrate structures having metallic layers for microelectronics devices |
| 07/23/2002 | US6423577 Method for reducing an electrical noise inside a ball grid array package |
| 07/23/2002 | US6423576 Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package |
| 07/23/2002 | US6423575 Hydrogen gettering structure including silver-doped palladium layer to increase hydrogen gettering of module component and semiconductor device module having such structure, and methods of fabrication |
| 07/23/2002 | US6423574 Method of manufacturing diodes with ceramic base |
| 07/23/2002 | US6423573 Integrated electronic circuit comprising at least an electronic power component |
| 07/23/2002 | US6423572 Compatible IC packages and methods for ensuring migration path |
| 07/23/2002 | US6423571 Method of making a semiconductor device having a stress relieving mechanism |
| 07/23/2002 | US6423570 Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby |
| 07/23/2002 | US6423568 Method of fabricating a silicon solar cell |
| 07/23/2002 | US6423566 Moisture and ion barrier for protection of devices and interconnect structures |
| 07/23/2002 | US6423559 Integrated circuit and fabricating method and evaluating method of integrated circuit |
| 07/23/2002 | US6423433 Method of forming Cu-Ca-O thin films on Cu surfaces in a chemical solution and semiconductor device thereby |
| 07/23/2002 | US6423367 Adhesives; coatings; encapsulation |
| 07/23/2002 | US6423201 Method of improving the adhesion of copper |
| 07/23/2002 | US6422879 IC socket for surface-mounting semiconductor device |
| 07/23/2002 | US6422307 Ultra high fin density heat sink for electronics cooling |
| 07/23/2002 | US6422304 System and method for cooling a central processing unit |
| 07/19/2002 | CA2331970A1 Silicon platform for optical modules |
| 07/18/2002 | WO2002056659A1 An electronic device |
| 07/18/2002 | WO2002056395A1 System for the conversion of water into non-oxidizing gases and electronic devices containing said systems |
| 07/18/2002 | WO2002056381A1 Semiconductor device and production method therefor |
| 07/18/2002 | WO2002056378A1 Circuit board and production method therefor |
| 07/18/2002 | WO2002056377A2 Electrical connection method, display module and chip card using said method |
| 07/18/2002 | WO2002056376A2 Method of integrating a heat spreader and a semiconductor, and package formed thereby |
| 07/18/2002 | WO2002056375A1 Molding of protective caps |
| 07/18/2002 | WO2002056374A1 Molds for wafer scale molding of protective caps |
| 07/18/2002 | WO2002056373A1 Molding assembly for wafer scale molding of protective caps |
| 07/18/2002 | WO2002056372A1 Use of infrared radiation in molding of protective caps |