| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/25/2002 | US20020098604 Wafer-level antenna effect detection pattern for VLSI |
| 07/25/2002 | US20020098500 Genetically engineered biopolymers for use in the generation of microarrays and semiconductor chips |
| 07/25/2002 | US20020098330 A glass-ceramic for a ceramic electronic part made from a borosilicate glass powder containing boron oxide, silica, atleast one oxide selected from calcium, barium and magnesium; a ceramic powder; and an additive powder |
| 07/25/2002 | US20020098319 Connection material |
| 07/25/2002 | US20020098281 Copper damascene back-end-of-line structures are embedded with magnetic metal stacks |
| 07/25/2002 | US20020097962 Single and multilayer waveguides and fabrication process |
| 07/25/2002 | US20020097763 Optical devices |
| 07/25/2002 | US20020097562 Electronic device and manufacturing same |
| 07/25/2002 | US20020097094 Mmic power amplifier with wirebond output matching circuit |
| 07/25/2002 | US20020097063 Wafer level interposer |
| 07/25/2002 | US20020096806 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
| 07/25/2002 | US20020096805 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
| 07/25/2002 | US20020096791 Semiconductor device and method of producing the same |
| 07/25/2002 | US20020096790 Semiconductor device and method of making the same |
| 07/25/2002 | US20020096789 Semiconductor assembly encapsulation mold |
| 07/25/2002 | US20020096788 Integrated-circuit package with a quick-to-count finger layout design on substrate |
| 07/25/2002 | US20020096787 Connection components with posts |
| 07/25/2002 | US20020096786 Intermediate support for supporting a semiconductor module on a circuit carrier |
| 07/25/2002 | US20020096785 Semiconductor device having stacked multi chip module structure |
| 07/25/2002 | US20020096781 Semiconductor device and liquid crystal module using the same |
| 07/25/2002 | US20020096779 Half-bridge circuit |
| 07/25/2002 | US20020096778 Method for making integrated circuits |
| 07/25/2002 | US20020096777 Integrated circuits protected against reverse engineering and method for fabricating the same using vias without metal terminations |
| 07/25/2002 | US20020096776 Integrated circuits protected against reverse engineering and method for fabricating the same using an apparent metal contact line terminating on field oxide |
| 07/25/2002 | US20020096775 A method of manufacturing a metal cap layer for preventing damascene conductive lines from oxidation |
| 07/25/2002 | US20020096774 Method for double-layer implementation of metal options in an integrated chip for efficient silicon debug |
| 07/25/2002 | US20020096770 Viscous protective overlayers for planarization of integrated circuits |
| 07/25/2002 | US20020096768 Soft metal conductor and method of making |
| 07/25/2002 | US20020096767 Cavity down ball grid array package with EMI shielding and reduced thermal resistance |
| 07/25/2002 | US20020096766 Package structure of integrated circuits and method for packaging the same |
| 07/25/2002 | US20020096765 Electroless ni/pd/au metallization structure for copper interconnect substrate and method therefor |
| 07/25/2002 | US20020096764 Semiconductor device having bump electrode |
| 07/25/2002 | US20020096763 Packaging structure of image sensors and method for packaging the same |
| 07/25/2002 | US20020096762 Structure of stacked integrated circuits and method for manufacturing the same |
| 07/25/2002 | US20020096759 Thermal conductive substrate and semiconductor module using the same |
| 07/25/2002 | US20020096758 Packaging structure of image sensor and method for packaging the same |
| 07/25/2002 | US20020096757 Semiconductor device and method of manufacturing the same |
| 07/25/2002 | US20020096756 Semiconductor device and method of making the same |
| 07/25/2002 | US20020096755 Semiconductor device |
| 07/25/2002 | US20020096753 Stacked package structure of image sensor |
| 07/25/2002 | US20020096752 Intercrossedly-stacked dual-chip semiconductor package and method of fabricating the same |
| 07/25/2002 | US20020096750 Package for semiconductor chip having thin recess portion and thick plane portion |
| 07/25/2002 | US20020096749 Clip-type lead frame for source mounted die |
| 07/25/2002 | US20020096748 Back-to -back connected power semiconductor device package |
| 07/25/2002 | US20020096747 Package structure of an integrated circuit |
| 07/25/2002 | US20020096744 Integrated circuits protected against reverse engineering and method for fabricating the same using etched passivation openings in integrated circuits |
| 07/25/2002 | US20020096736 Versatile system for integrated circuit containing shielded inductor |
| 07/25/2002 | US20020096735 Re-settable tristate programmable device |
| 07/25/2002 | US20020096732 Semiconductor device |
| 07/25/2002 | US20020096726 Semiconductor device and manufacturing method thereof |
| 07/25/2002 | US20020096711 Integrated circuit devices providing improved short prevention and methods of fabricating the same |
| 07/25/2002 | US20020096694 Semiconductor device |
| 07/25/2002 | US20020096677 Semiconductor integrated circuit having noise detect circuits detecting noise on power supply nets |
| 07/25/2002 | US20020096676 Thin film transistor made with photoconductive material |
| 07/25/2002 | US20020096491 Method and apparatus for marking a bare semiconductor die |
| 07/25/2002 | US20020096428 Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications |
| 07/25/2002 | US20020096361 Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin |
| 07/25/2002 | US20020096360 Substrate structure for an integrated circuit package and method for manufacturing the same |
| 07/25/2002 | US20020096359 Method and apparatus for globally aligning the front and back sides of a substrate |
| 07/25/2002 | US20020096357 Circuit board |
| 07/25/2002 | US20020096349 Electronic component with a semiconductor chip and method of producing the electronic component |
| 07/25/2002 | US20020096313 Heat sink and process and molding tool for production of same |
| 07/25/2002 | US20020096254 Optical device module and method of fabrication |
| 07/25/2002 | US20020096253 Methods Of Attaching A Sheet Of An Adhesive Film To A Substrate In The Course Of Making Integrated Circuit Packages |
| 07/25/2002 | US20020096115 Method for manufacturing semiconductor device |
| 07/25/2002 | US20020096016 Forming uniform copper formulation comprising gel forming polysaccharide binder, copper particles; molding; sintering to form heat sink |
| 07/25/2002 | US20020095786 Vertically mountable interposer, assembly and method |
| 07/25/2002 | US20020095784 Bumping process for chip scale packaging |
| 07/25/2002 | DE10163799A1 Semiconductor chip substrate, used as an IC chip, has semiconductor chip arranged on substrate in such way that first hump is in contact with second hump |
| 07/25/2002 | DE10153739A1 Halbleiterbauelement Semiconductor device |
| 07/25/2002 | DE10117239A1 Verfahren zum Anordnen eines Halbleiterchips auf einem Substrat, und zum Anordnen auf einem Substrat angepaßte Halbleitervorrichtung A method for disposing a semiconductor chip on a substrate, and for arranging on a substrate adapted semiconductor device |
| 07/25/2002 | DE10101995A1 Electrical or electronic switching arrangement comprises a detector unit and a comparator unit connected to the detector unit to compare the starting voltage with a reference voltage |
| 07/25/2002 | DE10101091A1 Hydraulisches Kraftfahrzeug-Getriebesteuergerät mit Kunststoff-Hydraulikverteilerplatte und darin integrierten Leitern und Verfahren zu dessen Herstellung Hydraulic motor vehicle transmission control unit with plastic hydraulic distributor plate and is integrated ladders and method for its manufacture |
| 07/25/2002 | DE10063914A1 Kontakthöckeraufbau zur Herstellung eines Verbindungsaufbaus zwischen Substratanschlussflächen Bump structure for making a connection setup between substrate pads |
| 07/25/2002 | CA2434875A1 Apparatus and method for forming a battery in an integrated circuit |
| 07/25/2002 | CA2434791A1 Diamondoid-containing materials in microelectronics |
| 07/25/2002 | CA2431993A1 Layered dielectric nanoporous materials and methods of producing same |
| 07/24/2002 | EP1225790A1 Ceramic heater |
| 07/24/2002 | EP1225640A2 Optoelectronic element with a structure of conductive striplines |
| 07/24/2002 | EP1225635A2 Stacked multichip integrated semiconductor device including feed-through connections |
| 07/24/2002 | EP1225634A2 Press-contact type semiconductor device |
| 07/24/2002 | EP1225633A1 Kühler zur Kühlung eines Leistungshalbleiterbauelements bzw.-Moduls sowie Verfahren zum Herstellen eines solchen Kühlers |
| 07/24/2002 | EP1225632A1 Computer heat dissipater structure |
| 07/24/2002 | EP1225631A2 Heat dissipation arrangement for electronic components |
| 07/24/2002 | EP1225630A1 Method for making hybrid electronic circuits for active implantable medical devices |
| 07/24/2002 | EP1225629A2 Component built-in module and method of manufacturing the same |
| 07/24/2002 | EP1225539A1 Replacement of at least one chip on a carrier by intrusion and overlay |
| 07/24/2002 | EP1225194A2 Method of forming a dielectric interlayer film with organosilicon precursors |
| 07/24/2002 | EP1224849A1 Electric module structure formed with a polymer shrunk material |
| 07/24/2002 | EP1224848A1 Flexible electronic circuitry and method of making same |
| 07/24/2002 | EP1224697A1 Method of manufacturing a semiconductor device having a porous dielectric layer and air gaps |
| 07/24/2002 | EP0991797B1 Method and device for producing electrically conductive continuity in semiconductor components |
| 07/24/2002 | EP0892987B1 Method for manufacturing multi-chip modules utilizing direct lead attach |
| 07/24/2002 | EP0808336B1 Amorphous copolymers of tetrafluoroethylene and hexafluoropropylene |
| 07/24/2002 | EP0707742B1 Process for forming a metallic interconnect structure for integrated circuits |
| 07/24/2002 | CN2502405Y Refrigeration device for semiconductor projector |
| 07/24/2002 | CN2502319Y Improved IC radiating and fastening device assembly structure |
| 07/24/2002 | CN2502317Y Fastening device for radiator |
| 07/24/2002 | CN1360814A Surface mount package for power semiconductor devices |
| 07/24/2002 | CN1360736A Chip holder for chip module and method for producing said chip module |