| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/30/2002 | US6426642 Insert for seating a microelectronic device having a protrusion and a plurality of raised-contacts |
| 07/30/2002 | US6426566 Anisotropic conductor film, semiconductor chip, and method of packaging |
| 07/30/2002 | US6426565 Electronic package and method of making same |
| 07/30/2002 | US6426562 Mask repattern process |
| 07/30/2002 | US6426561 Short-circuit-resistant IGBT module |
| 07/30/2002 | US6426560 Semiconductor device and memory module |
| 07/30/2002 | US6426559 Miniature 3D multi-chip module |
| 07/30/2002 | US6426558 Metallurgy for semiconductor devices |
| 07/30/2002 | US6426557 Self-aligned last-metal C4 interconnection layer for Cu technologies |
| 07/30/2002 | US6426556 Reliable metal bumps on top of I/O pads with test probe marks |
| 07/30/2002 | US6426555 Bonding pad and method for manufacturing it |
| 07/30/2002 | US6426554 Semiconductor device |
| 07/30/2002 | US6426552 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials |
| 07/30/2002 | US6426551 Composite monolithic electronic component |
| 07/30/2002 | US6426550 Interleaved signal trace routing |
| 07/30/2002 | US6426549 Stackable flex circuit IC package and method of making same |
| 07/30/2002 | US6426548 Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same |
| 07/30/2002 | US6426546 Reducing relative stress between HDP layer and passivation layer |
| 07/30/2002 | US6426545 Integrated circuit structures and methods employing a low modulus high elongation photodielectric |
| 07/30/2002 | US6426544 Flexible interconnections with dual-metal dual-stud structure |
| 07/30/2002 | US6426543 Semiconductor device including high-frequency circuit with inductor |
| 07/30/2002 | US6426537 Ultra-thin piezoelectric resonator |
| 07/30/2002 | US6426534 Methods and circuits employing threshold voltages for mask-alignment detection |
| 07/30/2002 | US6426531 Semiconductor integrated circuit device and a method of assembly thereof |
| 07/30/2002 | US6426516 Kerf contact to silicon redesign for defect isolation and analysis |
| 07/30/2002 | US6426484 Circuit and method for heating an adhesive to package or rework a semiconductor die |
| 07/30/2002 | US6426468 Circuit board |
| 07/30/2002 | US6426467 Film carrier with adjacent electrical sorting pads |
| 07/30/2002 | US6426461 Enclosure for electronic components |
| 07/30/2002 | US6426380 Forming addition-crosslinked silicone rubber absorber material via curing mixture of polysiloxane and hardener; dehydrogenation; preventing hydrogen accumulation in semiconductor array/wafer within hermetically sealed housing |
| 07/30/2002 | US6426371 Hydrolysis; condensation |
| 07/30/2002 | US6426310 Fabric comprising para-aramid fiber chops bonded with each other by binder, including chops of poly-para-phenylene-diphenylether terephthalamide fibers and poly-para-phenylene terephthalamide fibers |
| 07/30/2002 | US6426294 Polishing conductive material film comprising copper or copper alloy using aqueous composition comprising pyridine-based carboxylic acid and acid having one carboxyl and one hydroxyl group or oxalic acid, abrasive grains and oxidizing agent |
| 07/30/2002 | US6426287 Method for forming a semiconductor connection with a top surface having an enlarged recess |
| 07/30/2002 | US6426284 Method of manufacturing wire bond pad |
| 07/30/2002 | US6426282 Method of forming solder bumps on a semiconductor wafer |
| 07/30/2002 | US6426249 Buried metal dual damascene plate capacitor |
| 07/30/2002 | US6426247 Low bitline capacitance structure and method of making same |
| 07/30/2002 | US6426244 Process of forming a thick oxide field effect transistor |
| 07/30/2002 | US6426242 Semiconductor chip packaging method |
| 07/30/2002 | US6426241 Method for forming three-dimensional circuitization and circuits formed |
| 07/30/2002 | US6426240 Stackable flex circuit chip package and method of making same |
| 07/30/2002 | US6426176 Forming metal bump of first material on substrate so that bump electrically contacts metal part on substrate, forming protective layer on metal bump which has higher conductivity than first material |
| 07/30/2002 | US6426154 Ceramic circuit board |
| 07/30/2002 | US6426127 Dielectric coating on surface |
| 07/30/2002 | US6425771 IC socket |
| 07/30/2002 | US6425516 Semiconductor device and method of production of the same |
| 07/30/2002 | US6425439 Cooling device with micro cooling fin |
| 07/30/2002 | US6425179 Method for assembling tape ball grid arrays |
| 07/30/2002 | CA2187477C Self align leadframe |
| 07/25/2002 | WO2002058155A1 Semiconductor chip with internal esd matching |
| 07/25/2002 | WO2002058154A2 Semiconductor component comprising esd protection |
| 07/25/2002 | WO2002058152A2 Electronic circuit device and method for manufacturing the same |
| 07/25/2002 | WO2002058149A1 Power transistor with internally combined low-pass and band-pass matching stages |
| 07/25/2002 | WO2002058148A1 Apparatus and method for forming a battery in an integrated circuit |
| 07/25/2002 | WO2002058147A2 Method and structure to reduce the damage associated with programming electrical fuses |
| 07/25/2002 | WO2002058146A1 Semiconductor device with an improved transmission line |
| 07/25/2002 | WO2002058145A2 Layered dielectric nanoporous materials and methods of producing same |
| 07/25/2002 | WO2002058144A1 Electroless ni/pd/au metallization structure for copper interconnect substrate and method therefor |
| 07/25/2002 | WO2002058143A2 Cvd diamond enhanced microprocessor cooling system |
| 07/25/2002 | WO2002058142A2 Power module |
| 07/25/2002 | WO2002058140A2 Integrated inductor |
| 07/25/2002 | WO2002058139A2 Diamondoid-containing materials in microelectronics |
| 07/25/2002 | WO2002058138A2 An electronic assembly having a heat pipe that conducts heat from a semiconductor die |
| 07/25/2002 | WO2002058137A2 Composite microelectronic spring structure and method for making same |
| 07/25/2002 | WO2002058135A2 Interconnect structures and a method of electroless introduction of interconnect structures |
| 07/25/2002 | WO2002058131A1 Method for making a semiconductor package and semiconductor package with integrated circuit chips |
| 07/25/2002 | WO2002058117A2 Metal-insulator-metal capacitor in copper |
| 07/25/2002 | WO2002058112A2 Copper diffusion barriers |
| 07/25/2002 | WO2002058108A2 Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith |
| 07/25/2002 | WO2002057361A2 Curing agent for epoxy resins and epoxy resin composition |
| 07/25/2002 | WO2002057333A2 Epoxy resin composition for semiconductor encapsulation |
| 07/25/2002 | WO2002056912A2 Pharmaceutical combination for the treatment of cancer containing a 4-quinazolineamine and another anti-neoplastic agent |
| 07/25/2002 | WO2002027789B1 Connecting device |
| 07/25/2002 | WO2001098793A3 Systems for testing integraged circuits during burn-in |
| 07/25/2002 | WO2001075938A3 Leadless semiconductor product packaging apparatus having a window lid and method for packaging |
| 07/25/2002 | WO2001073865A3 Continuous processing of thin-film batteries and like devices |
| 07/25/2002 | WO2001002468A9 Composites of powdered fillers and polymer matrix and process for preparing them |
| 07/25/2002 | US20020100010 Field programmable printed circuit board |
| 07/25/2002 | US20020099158 Polyarylene compositions with enhanced modulus profiles |
| 07/25/2002 | US20020098965 Containing a diopside crystal phase and a cordierite phase, the remainder being a glass phase and/or other ceramic crystal phases, and having an open porosity of not larger than 1%. |
| 07/25/2002 | US20020098714 Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device |
| 07/25/2002 | US20020098711 Electroless deposition of doped noble metals and noble metal alloys |
| 07/25/2002 | US20020098707 Design of lithography alignment and overlay measurement marks on CMP finished damascene surface |
| 07/25/2002 | US20020098691 Method of manufacturing a semiconductor device and the semiconductor device manufactured by the method |
| 07/25/2002 | US20020098683 Semiconductor device manufacturing method using metal silicide reaction after ion implantation in silicon wiring |
| 07/25/2002 | US20020098681 Reduced electromigration and stressed induced migration of Cu wires by surface coating |
| 07/25/2002 | US20020098680 Integrated circuit trenched features and method of producing same |
| 07/25/2002 | US20020098679 Method for producing an integrated circuit having at least one metalicized surface |
| 07/25/2002 | US20020098677 Multilevel copper interconnects with low-k dielectrics and air gaps |
| 07/25/2002 | US20020098672 Semiconductor device with fully self-aligned local interconnects, and method for fabricating the device |
| 07/25/2002 | US20020098670 Semiconductor integrated circuit device and fabrication method for semiconductor integrated circuit device |
| 07/25/2002 | US20020098626 UV cured polymeric semiconductor die coating |
| 07/25/2002 | US20020098625 Conductive hardening resin for a semiconductor device and semiconductor device using the same |
| 07/25/2002 | US20020098624 Tape under frame for conventional-type IC package assembly |
| 07/25/2002 | US20020098623 Semiconductor device including leads in communication with contact pads thereof and a stereolithographically fabricated package substantially encapsulating the leads and methods for fabricating the same |
| 07/25/2002 | US20020098622 Heat-dissipating device of a semiconductor device and fabrication method for same |
| 07/25/2002 | US20020098619 Wafer on wafer packaging and method of fabrication for full-wafer burn-in and testing |
| 07/25/2002 | US20020098617 CD BGA package and a fabrication method thereof |
| 07/25/2002 | US20020098608 Method and apparatus for marking a bare semiconductor die |