| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/01/2002 | US20020100985 Insitu radiation protection of integrated circuits |
| 08/01/2002 | US20020100984 Semiconductor device and its fabrication method |
| 08/01/2002 | US20020100983 Method for producing dual damascene interconnections and structure produced thereby |
| 08/01/2002 | US20020100982 Wafer level package and method for manufacturing the same |
| 08/01/2002 | US20020100981 Tantalum - aluminum - nitrogen material for semiconductor devices |
| 08/01/2002 | US20020100979 Semiconductor structure for measuring dielectric constant and clarifying polarization effect of interlevel dielectric layer |
| 08/01/2002 | US20020100978 Semiconductor device with an improvement in alignment, and method of manufacturing the same |
| 08/01/2002 | US20020100977 Semiconductor device having reliable coupling with mounting substrate |
| 08/01/2002 | US20020100976 BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die |
| 08/01/2002 | US20020100975 Semiconductor integrated circuit and fabrication process therefor |
| 08/01/2002 | US20020100974 Semiconductor device, semiconductor device mounting structure, liquid crystal device, and electronic apparatus |
| 08/01/2002 | US20020100972 Semiconductor device with gold bumps, and method and apparatus of producing the same |
| 08/01/2002 | US20020100971 Integrated circuit packages |
| 08/01/2002 | US20020100969 Flip chip package with improved cap design and process for making thereof |
| 08/01/2002 | US20020100968 Semiconductor package with lid heat spreader |
| 08/01/2002 | US20020100967 Semiconductor plastic package and process for the production thereof |
| 08/01/2002 | US20020100966 Method for fabricating a multilayer ceramic substrate |
| 08/01/2002 | US20020100965 Semiconductor module and electronic component |
| 08/01/2002 | US20020100964 Electronic component, method of manufacturing the electronic component, and method of manufacturing electronic circuit device |
| 08/01/2002 | US20020100963 Semiconductor package and semiconductor device |
| 08/01/2002 | US20020100962 Unmolded package for a semiconductor device |
| 08/01/2002 | US20020100961 Microelectronic package having a compliant layer with bumped protrusions |
| 08/01/2002 | US20020100960 Wafer level package including ground metal layer |
| 08/01/2002 | US20020100958 Vertical fuse structure for integrated circuits and a method of disconnecting the same |
| 08/01/2002 | US20020100957 Configuration of fuses in semiconductor structures with Cu metallization |
| 08/01/2002 | US20020100956 Multi-level fuse structure |
| 08/01/2002 | US20020100955 Method and apparatus for extending fatigue life of solder joints semiconductor device |
| 08/01/2002 | US20020100949 Bonding pad structure of semiconductor device and method for fabricating the same |
| 08/01/2002 | US20020100943 Method of manufacturing semiconductor device, and semiconductor device manufactured thereby |
| 08/01/2002 | US20020100941 Thin-film semiconductor device and method of manufacturing the same |
| 08/01/2002 | US20020100940 Semiconductor device |
| 08/01/2002 | US20020100924 Method of forming dram circuitry |
| 08/01/2002 | US20020100919 Semiconductor device and microrelay |
| 08/01/2002 | US20020100914 Semiconductor emission apparatus |
| 08/01/2002 | US20020100907 Metal-to-metal antifuse structure and fabrication method |
| 08/01/2002 | US20020100904 Dual work function semiconductor structure with borderless contact and method of fabricating the same |
| 08/01/2002 | US20020100903 Methodology to mitigate electron beam induced charge dissipation on polysilicon fine patterning |
| 08/01/2002 | US20020100871 Focused ion beam apparatus |
| 08/01/2002 | US20020100794 Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding |
| 08/01/2002 | US20020100693 Forming a copper seed layer over a semiconductor body, wherein copper oxide forms at a surface of copper seed layer electrochemically reducing copper oxide; electrochemically depositing copper layer on copper seed layer |
| 08/01/2002 | US20020100613 Conductive substructures of a multilayered laminate |
| 08/01/2002 | US20020100610 Electronic component and method and structure for mounting semiconductor device |
| 08/01/2002 | US20020100608 Multilayer printed wiring board and a process of producing same |
| 08/01/2002 | US20020100600 Stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same |
| 08/01/2002 | US20020100581 Thermal interface |
| 08/01/2002 | US20020100577 Ductwork improves efficiency of counterflow two pass active heat sink |
| 08/01/2002 | US20020100545 Multilayer; silicon substrate overcoated with silicon oxide or nitride dielectric, then passivation layer; noncracking |
| 08/01/2002 | US20020100391 Electroless Ni-B plating liquid, electronic device and method for manufacturing the same |
| 08/01/2002 | US20020100288 Metal hydride storage apparatus |
| 08/01/2002 | US20020100286 Semiconductor equipment and refrigerator |
| 08/01/2002 | US20020100165 Method of forming an integrated circuit device package using a temporary substrate |
| 08/01/2002 | US20020100164 Wiring substrate manufacturing method |
| 08/01/2002 | DE10160638A1 Halbleiterbauelement Semiconductor device |
| 08/01/2002 | DE10156272A1 Multi-chip memory device for notebook computer, has several IC chips in common package whose control signal pads are connected to external terminals individually |
| 08/01/2002 | DE10125815C1 Metall-Keramik-Verbundwerkstoff und seine Verwendung A metal-ceramic composite material and its use |
| 08/01/2002 | DE10111708A1 Halbleitervorrichtung und Herstellungsverfharen für dieselbe Semiconductor device and for the same Herstellungsverfharen |
| 08/01/2002 | DE10103193A1 Verfahren zur Herstellung von Leiterbahnstrukturen A process for the production of conductor track structures |
| 08/01/2002 | DE10103186A1 Elektronisches Bauteil mit einem Halbleiter-Chip und Verfahren zur Herstellung desselben The same electronic component having a semiconductor chip and method for producing |
| 08/01/2002 | DE10103144A1 Halbbrückenschaltung Half-bridge circuit |
| 08/01/2002 | DE10102621A1 Leistungsmodul Power module |
| 08/01/2002 | DE10102434A1 Kühlkörper mit innenliegendem Lüfter Heatsink with internal fan |
| 08/01/2002 | DE10102000A1 Integrierte Schaltung mit Erkennungsschaltung und Verfahren zum Überprüfen einer Anschlusssituation eines Bondpads Integrated circuit detection circuit and method for checking a connection situation of a bond pad |
| 08/01/2002 | DE10101875A1 Elektronisches Bauteil mit aufeinander gestapelten Halbleiterchips An electronic part having successive stacked semiconductor chips |
| 08/01/2002 | DE10100882A1 Verfahren zur Montage eines Halbleiterbauelementes und Halbleiterbauelement A method for mounting a semiconductor device and semiconductor device |
| 08/01/2002 | CA2435623A1 Viscous protective overlayers for planarization of integrated circuits |
| 08/01/2002 | CA2432012A1 Planarizers for spin etch planarization of electronic components and methods of use thereof |
| 08/01/2002 | CA2403052A1 High-q micromechanical device and method of tuning same |
| 07/31/2002 | EP1227709A2 Process for manufacturing conductive track structures |
| 07/31/2002 | EP1227578A2 RF amplifier |
| 07/31/2002 | EP1227520A2 Solid-state relay |
| 07/31/2002 | EP1227517A2 Semiconductor device |
| 07/31/2002 | EP1227516A2 Thin film semiconductor device, production process and production apparatus |
| 07/31/2002 | EP1227469A2 Liquid crystal device |
| 07/31/2002 | EP1227352A1 Optical device module using integral heat transfer module |
| 07/31/2002 | EP1227115A2 Crosslinkable polymer material of low relative permittivity, and films, substrates and electronic units formed of it |
| 07/31/2002 | EP1226743A1 Method of fabricating a laminated printed circuit board |
| 07/31/2002 | EP1226604A1 Fabrication process of a semiconductor device |
| 07/31/2002 | EP1226589A1 Infiltrated nanoporous materials and methods of producing same |
| 07/31/2002 | EP1226201A1 Highly stable packaging substrates and brominated indane derivatives |
| 07/31/2002 | EP0809292B1 Power transistor module |
| 07/31/2002 | CN2503607Y Cooling fin with heat conduction pipe |
| 07/31/2002 | CN2503606Y Heat sink base |
| 07/31/2002 | CN2503605Y Heat sink fastener |
| 07/31/2002 | CN2503604Y Semi-conductor plastic capsulation mould |
| 07/31/2002 | CN2503523Y Tower-type desk computer CPU chip phase transformation heat sink |
| 07/31/2002 | CN2503522Y Desk computer CPU chip phase transformation heat sink with the halp of powery-supply fan |
| 07/31/2002 | CN2503521Y Fastening device for sink of central controller |
| 07/31/2002 | CN2502950Y Fixed sealing screw for machine readable vehicle number plate |
| 07/31/2002 | CN1361998A Mobile station supervision of the forward dedicated control channel when in the discontinuous transmission mode |
| 07/31/2002 | CN1361800A Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 07/31/2002 | CN1361553A Optical device and its producing method and electronic device |
| 07/31/2002 | CN1361548A Base board lay-out method and structure to reduce cross-talk of adjacent signals |
| 07/31/2002 | CN1361461A Heat radiator |
| 07/30/2002 | US6427222 Inter-dice wafer level signal transfer methods for integrated circuits |
| 07/30/2002 | US6426878 Bare chip carrier utilizing a pressing member |
| 07/30/2002 | US6426877 Semiconductor device incorporating module structure |
| 07/30/2002 | US6426875 Heat sink chip package |
| 07/30/2002 | US6426874 Semiconductor device mounting structure and feeding-side charger with heat radiating unit |
| 07/30/2002 | US6426686 Microwave circuit packages having a reduced number of vias in the substrate |
| 07/30/2002 | US6426680 System and method for narrow band PLL tuning |