| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/08/2002 | US20020105031 Semiconductor device and method of manufacturing the same |
| 08/08/2002 | US20020105030 Thin film transistor array substrate for liquid crystal display and method for fabricating same |
| 08/08/2002 | US20020105017 Integrated circuit ferroelectric memory devices including plate lines directly on ferroelectric capacitors and methods of fabricating the same |
| 08/08/2002 | US20020105009 Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor |
| 08/08/2002 | US20020105008 Gate commutated turn-off semiconductor device |
| 08/08/2002 | US20020105002 Electronic part and its manufacturing method |
| 08/08/2002 | US20020104991 Integrated circuit feature layout for improved chemical Mechanical polishing |
| 08/08/2002 | US20020104874 Semiconductor chip package comprising enhanced pads |
| 08/08/2002 | US20020104873 Multilayer interconnection and method |
| 08/08/2002 | US20020104872 Method and apparatus for securing electronic circuits |
| 08/08/2002 | US20020104684 Tape circuit board and semiconductor chip package including the same |
| 08/08/2002 | US20020104682 Ag-pre-plated lead frame for semiconductor package |
| 08/08/2002 | US20020104671 Cross substrate, method of mounting semiconductor element, and semiconductor device |
| 08/08/2002 | US20020104641 Apparatus and method for passive phase change thermal management |
| 08/08/2002 | US20020104519 Resin sealed electronic device |
| 08/08/2002 | DE10129359A1 Epoxidharzzusammensetzung, Halbleitervorrichtung und Verfahren zur Beurteilung der Sichtbarkeit einer Lasermarkierung Epoxy resin, semiconductor device and method for assessing the visibility of a laser marking |
| 08/08/2002 | DE10124772C1 Verfahren zur Ausbildung einer an einem Halbleiterchip angebrachten Antenne A method of forming a mounted on a semiconductor chip antenna |
| 08/08/2002 | DE10104574A1 Substrat für ein elektrisches Bauelement und Verfahren zur Herstellung Substrate for an electrical component and method for preparing |
| 08/08/2002 | DE10102354C1 Halbleiter-Bauelement mit ESD-Schutz A semiconductor device having ESD protection |
| 08/08/2002 | DE10048489C1 Polymer Stud Grid Array und Verfahren zur Herstellung eines derartigen Polymer Stud Grid Arrays Polymer stud grid array and methods for producing such a polymer stud grid array |
| 08/08/2002 | CA2433567A1 Compliant and crosslinkable thermal interface materials |
| 08/07/2002 | EP1229772A1 Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| 08/07/2002 | EP1229586A2 Interface device and system |
| 08/07/2002 | EP1229583A1 Semiconductor device and its manufacturing method |
| 08/07/2002 | EP1229582A2 Thin-film semiconductor device and method of manufacturing the same |
| 08/07/2002 | EP1229580A2 Electrochemical reduction of copper seed for reducing voids in electrochemical deposition |
| 08/07/2002 | EP1229577A2 Flip chip semiconductor device in a moulded chip scale package (csp) and method of assembly |
| 08/07/2002 | EP1229367A2 Optical connector and a structure with a mounted connector |
| 08/07/2002 | EP1229315A1 Semiconductor device carrier |
| 08/07/2002 | EP1228535A1 Face-to-face chips |
| 08/07/2002 | EP1228530A1 Metal redistribution layer having solderable pads and wire bondable pads |
| 08/07/2002 | EP1054446B1 Method of packaging semiconductor chip |
| 08/07/2002 | EP0931343B1 Chip module especially for implantation in chip card body |
| 08/07/2002 | EP0829097B1 Method of transfer molding electronic packages and packages produced thereby |
| 08/07/2002 | CN2504762Y Clamping device of CPU radiator mechanism |
| 08/07/2002 | CN2504682Y Radiator fixer |
| 08/07/2002 | CN1363205A Heat sink with an integrated component clamping device |
| 08/07/2002 | CN1363106A Semiconductor power component comprising a safety fuse |
| 08/07/2002 | CN1363057A Micro cooling device |
| 08/07/2002 | CN1362855A Cooling unit for cooling heating device and electronic equipment having said cooling unit |
| 08/07/2002 | CN1362851A Lead frame and manufacture method thereof, and manufacture method of heat-conducting substrate |
| 08/07/2002 | CN1362785A High-frequency switch assembly and high-frequency instrument mounting said high-frequency switch assembly |
| 08/07/2002 | CN1362742A Electrostatic discharge preventing method and device and integrated circuit |
| 08/07/2002 | CN1362740A Semiconductor device and manufacture method thereof |
| 08/07/2002 | CN1362739A Semiconductor baseplate and its fabrication process |
| 08/07/2002 | CN1362738A Power semiconductor module |
| 08/07/2002 | CN1362737A Semiconductor packaging part with glue overflow preventer |
| 08/07/2002 | CN1362733A Semiconductor device and manufacture method thereof, circuit board and electronic apparatus |
| 08/07/2002 | CN1362712A Conducting metal particles, conducting composite metal particles and applied products using same |
| 08/07/2002 | CN1088912C Semiconductor device and method of manufacturing the same |
| 08/06/2002 | US6430735 Semiconductor integrated circuit having thereon on-chip capacitors |
| 08/06/2002 | US6430350 Optical device having an optical component isolated from housing |
| 08/06/2002 | US6430076 Multi-level signal lines with vertical twists |
| 08/06/2002 | US6430059 Integrated circuit package substrate integrating with decoupling capacitor |
| 08/06/2002 | US6430058 Integrated circuit package |
| 08/06/2002 | US6430051 Heat sink clip with pivotally connected arms |
| 08/06/2002 | US6430050 Mechanical loading of a land grid array component using a wave spring |
| 08/06/2002 | US6430049 Clip for heat sink |
| 08/06/2002 | US6430043 Heat sink grounding unit |
| 08/06/2002 | US6430042 Electronic apparatus having means for cooling a semiconductor element mounted therein |
| 08/06/2002 | US6430034 Chip capacitor having external resin packaging |
| 08/06/2002 | US6430030 High k dielectric material with low k dielectric sheathed signal vias |
| 08/06/2002 | US6429890 Laser marking techniques |
| 08/06/2002 | US6429537 Semiconductor component with method for manufacturing |
| 08/06/2002 | US6429536 Semiconductor device |
| 08/06/2002 | US6429535 Integrated circuit chip and method for fabricating the same |
| 08/06/2002 | US6429534 Interposer tape for semiconductor package |
| 08/06/2002 | US6429532 Pad design |
| 08/06/2002 | US6429530 Miniaturized chip scale ball grid array semiconductor package |
| 08/06/2002 | US6429529 Bi-level digit line architecture for high density drams |
| 08/06/2002 | US6429528 Multichip semiconductor package |
| 08/06/2002 | US6429527 Method and article for filling apertures in a high performance electronic substrate |
| 08/06/2002 | US6429526 Method for forming a semiconductor connection with a top surface having an enlarged recess |
| 08/06/2002 | US6429524 Ultra-thin tantalum nitride copper interconnect barrier |
| 08/06/2002 | US6429523 Method for forming interconnects on semiconductor substrates and structures formed |
| 08/06/2002 | US6429521 Semiconductor integrated circuit device and its manufacturing method |
| 08/06/2002 | US6429520 Semiconductor component with silicon wiring and method of fabricating the component |
| 08/06/2002 | US6429519 Wiring structures containing interconnected metal and wiring levels including a continuous, single crystalline or polycrystalline conductive material having one or more twin boundaries |
| 08/06/2002 | US6429518 Semiconductor device having a fluorine-added carbon film as an inter-layer insulating film |
| 08/06/2002 | US6429517 Semiconductor device and fabrication method thereof |
| 08/06/2002 | US6429516 Structure for mounting a bare chip using an interposer |
| 08/06/2002 | US6429515 Long wire IC package |
| 08/06/2002 | US6429514 Integrated circuit chip and method for fabricating the same |
| 08/06/2002 | US6429513 Active heat sink for cooling a semiconductor chip |
| 08/06/2002 | US6429512 Heat conductivity |
| 08/06/2002 | US6429511 Microcap wafer-level package |
| 08/06/2002 | US6429510 Liquid damping of high frequency bond wire vibration |
| 08/06/2002 | US6429509 Integrated circuit with improved interconnect structure and process for making same |
| 08/06/2002 | US6429508 Semiconductor package having implantable conductive lands and method for manufacturing the same |
| 08/06/2002 | US6429507 Electrical device including a leaded cell assembly |
| 08/06/2002 | US6429504 Multilayer spiral inductor and integrated circuits incorporating the same |
| 08/06/2002 | US6429503 Connection element in an integrated circuit having a layer structure disposed between two conductive structures |
| 08/06/2002 | US6429495 Semiconductor device with address programming circuit |
| 08/06/2002 | US6429493 Semiconductor device and method for manufacturing semiconductor device |
| 08/06/2002 | US6429486 Semiconductor support substrate potential fixing structure for SOI semiconductor device |
| 08/06/2002 | US6429474 Storage-capacitor electrode and interconnect |
| 08/06/2002 | US6429453 Substrate assembly for burn in test of integrated circuit chip |
| 08/06/2002 | US6429452 Test structure and methodology for characterizing ion implantation in an integrated circuit fabrication process |
| 08/06/2002 | US6429389 Via-in-pad apparatus and methods |
| 08/06/2002 | US6429388 High density column grid array connections and method thereof |