| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/14/2002 | DE10103314A1 Halbleiterspeichereinrichtung A semiconductor memory device |
| 08/14/2002 | CN2505984Y Vulcano type central processor radiator |
| 08/14/2002 | CN2505983Y Clamping device of radiating mechanism of central processor |
| 08/14/2002 | CN2505982Y IC chip operating temperature range controlling and protecting equipment |
| 08/14/2002 | CN2505981Y 散热器 Heat sink |
| 08/14/2002 | CN2505908Y Central microprocessor radiating structure |
| 08/14/2002 | CN1364334A IC oscillator |
| 08/14/2002 | CN1364316A Lateral DMOS improved brookdown structure and method |
| 08/14/2002 | CN1364311A Reduced electromigration and stress induced migration of Cu wires by surface coating |
| 08/14/2002 | CN1364251A Cooling device for electronic components |
| 08/14/2002 | CN1363954A Semiconductor device, manufacturing method and design method |
| 08/14/2002 | CN1363952A Wafer-class packaging technology and its chip structure |
| 08/14/2002 | CN1363720A Chemical gas phase depositation of copper film for organic metal copper complex |
| 08/13/2002 | US6434730 Pattern forming method |
| 08/13/2002 | US6434726 System and method of transmission using coplanar bond wires |
| 08/13/2002 | US6434063 Method of repairing semiconductor memory, electron-beam memory repairing apparatus and redundancy memory circuit to which the method of repairing semiconductor memory is applicable |
| 08/13/2002 | US6434017 Semiconductor device and electronic apparatus |
| 08/13/2002 | US6434008 Semiconductor device |
| 08/13/2002 | US6434007 Heat sink attachment clip |
| 08/13/2002 | US6434006 Semiconductor device having heat radiating member |
| 08/13/2002 | US6434004 Heat sink assembly |
| 08/13/2002 | US6434003 Liquid-cooled power semiconductor device heatsink |
| 08/13/2002 | US6434002 Structure computer heat dissipater |
| 08/13/2002 | US6433648 Method and structure for reducing the mutual inductance between two adjacent transmission lines on a substrate |
| 08/13/2002 | US6433561 Methods and apparatus for optimizing semiconductor inspection tools |
| 08/13/2002 | US6433441 Area array type semiconductor device |
| 08/13/2002 | US6433440 Semiconductor device having a porous buffer layer for semiconductor device |
| 08/13/2002 | US6433439 Device with security integrated circuit |
| 08/13/2002 | US6433438 Semiconductor integrated circuit device |
| 08/13/2002 | US6433436 Dual-RIE structure for via/line interconnections |
| 08/13/2002 | US6433435 Multilayer; dielectric layer with aperture overcoating with barrier layer |
| 08/13/2002 | US6433432 Semiconductor device having fluorined insulating film and reduced fluorine at interconnection interfaces and method of manufacturing the same |
| 08/13/2002 | US6433431 Coating of copper and silver air bridge structures |
| 08/13/2002 | US6433430 Titanium silicide undercoating |
| 08/13/2002 | US6433429 Reduced electromigration |
| 08/13/2002 | US6433428 Semiconductor device with a dual damascene type via contact structure and method for the manufacture of same |
| 08/13/2002 | US6433427 Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication |
| 08/13/2002 | US6433426 Semiconductor device having a semiconductor with bump electrodes |
| 08/13/2002 | US6433425 Electronic package interconnect structure comprising lead-free solders |
| 08/13/2002 | US6433424 Semiconductor device package and lead frame with die overhanging lead frame pad |
| 08/13/2002 | US6433423 Method and an arrangement relating to chip carriers |
| 08/13/2002 | US6433422 Semiconductor integrated circuit having semiconductor packages for mounting integrated circuit chips on both sides of a substrate |
| 08/13/2002 | US6433421 Semiconductor device |
| 08/13/2002 | US6433420 Semiconductor package with heat sink having air vent |
| 08/13/2002 | US6433419 Face-up semiconductor chip assemblies |
| 08/13/2002 | US6433418 Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism |
| 08/13/2002 | US6433417 Electronic component having improved soldering performance and adhesion properties of the lead wires |
| 08/13/2002 | US6433416 Interconnection for integrated high voltage electronic devices |
| 08/13/2002 | US6433414 Method of manufacturing flexible wiring board |
| 08/13/2002 | US6433413 Three-dimensional multichip module |
| 08/13/2002 | US6433412 Semiconductor device and a method of manufacturing the same |
| 08/13/2002 | US6433411 Packaging micromechanical devices |
| 08/13/2002 | US6433409 Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same |
| 08/13/2002 | US6433408 Highly integrated circuit including transmission lines which have excellent characteristics |
| 08/13/2002 | US6433406 Semiconductor device and manufacturing method of the same |
| 08/13/2002 | US6433405 Integrated circuit having provisions for remote storage of chip specific operating parameters |
| 08/13/2002 | US6433404 Electrical fuses for semiconductor devices |
| 08/13/2002 | US6433403 Integrated circuit having temporary conductive path structure and method for forming the same |
| 08/13/2002 | US6433397 N-channel metal oxide semiconductor (NMOS) driver circuit and method of making same |
| 08/13/2002 | US6433394 Over-voltage protection device for integrated circuits |
| 08/13/2002 | US6433390 Bonded substrate structures and method for fabricating bonded substrate structures |
| 08/13/2002 | US6433386 Sense FET having a selectable sense current ratio and method of manufacturing the same |
| 08/13/2002 | US6433381 Semiconductor device and method of manufacturing the same |
| 08/13/2002 | US6433332 Adjustment of surface tension |
| 08/13/2002 | US6433287 Connection structure |
| 08/13/2002 | US6433285 Printed wiring board, IC card module using the same, and method for producing IC card module |
| 08/13/2002 | US6433277 Plastic integrated circuit package and method and leadframe for making the package |
| 08/13/2002 | US6433276 Surface mount feedthrough |
| 08/13/2002 | US6433071 Aromatic polysulfone resin composition and molded article thereof |
| 08/13/2002 | US6432845 Semiconductor device and method for manufacturing the same |
| 08/13/2002 | US6432844 Implanted conductor and methods of making |
| 08/13/2002 | US6432840 Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package |
| 08/13/2002 | US6432839 Film forming method and manufacturing method of semiconductor device |
| 08/13/2002 | US6432834 Method for enhancing etch selectivity of metal silicide film to polysilicon film, and method for etching stacked film of metal silicide film and polysilicon film |
| 08/13/2002 | US6432820 Overcoating with metal using vacuum deposition, oxidation |
| 08/13/2002 | US6432819 Method and apparatus of forming a sputtered doped seed layer |
| 08/13/2002 | US6432818 Method of using tantalum-aluminum-nitrogen material as diffusion barrier and adhesion layer in semiconductor devices |
| 08/13/2002 | US6432813 Semiconductor processing method of forming insulative material over conductive lines |
| 08/13/2002 | US6432812 Method of coupling capacitance reduction |
| 08/13/2002 | US6432808 Method of improved bondability when using fluorinated silicon glass |
| 08/13/2002 | US6432796 Method and apparatus for marking microelectronic dies and microelectronic devices |
| 08/13/2002 | US6432760 Method and structure to reduce the damage associated with programming electrical fuses |
| 08/13/2002 | US6432753 Method of minimizing package-shift effects in integrated circuits by using a thick metallic overcoat |
| 08/13/2002 | US6432752 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages |
| 08/13/2002 | US6432750 Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof |
| 08/13/2002 | US6432749 Method of fabricating flip chip IC packages with heat spreaders in strip format |
| 08/13/2002 | US6432748 Substrate structure for semiconductor package and manufacturing method thereof |
| 08/13/2002 | US6432747 Repair method for broken or missing microcircuit package terminal lead |
| 08/13/2002 | US6432746 Method for manufacturing a chip scale package having slits formed on a substrate |
| 08/13/2002 | US6432744 Wafer-scale assembly of chip-size packages |
| 08/13/2002 | US6432742 Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages |
| 08/13/2002 | US6432739 Method for generating electrical conducting or semiconducting structures in two or three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating |
| 08/13/2002 | US6432724 Buried ground plane for high performance system modules |
| 08/13/2002 | US6432540 Flame retardant molding compositions |
| 08/13/2002 | US6432539 Electronic packages |
| 08/13/2002 | US6432511 Thermoplastic adhesive preform for heat sink attachment |
| 08/13/2002 | US6432497 Double-side thermally conductive adhesive tape for plastic-packaged electronic components |
| 08/13/2002 | US6432479 Method for in-situ, post deposition surface passivation of a chemical vapor deposited film |
| 08/13/2002 | US6432353 Method for producing oxide type ceramic sintered body |
| 08/13/2002 | US6432253 Cover with adhesive preform and method for applying same |