Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2013
12/12/2013US20130329376 Electronic modules
12/12/2013US20130329358 Transient thermal management systems for semiconductor devices
12/12/2013US20130328221 Alignment mark design for semiconductor device
12/12/2013US20130328220 Integrated circuit packaging system with film assist and method of manufacture thereof
12/12/2013US20130328219 Package-on-package assembly with wire bond vias
12/12/2013US20130328218 Sealed semiconductor device having adhesive patch with inwardly sloped side surfaces
12/12/2013US20130328216 Integrated circuit packaging system with interposer and method of manufacture thereof
12/12/2013US20130328215 Die Edge Contacts for Semiconductor Devices
12/12/2013US20130328214 Through-hole electrode substrate
12/12/2013US20130328213 Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
12/12/2013US20130328212 Semiconductor package and manufacturing method thereof
12/12/2013US20130328211 Semiconductor package, semiconductor device, and method for manufacturing semiconductor package
12/12/2013US20130328210 Semiconductor device and method of manufacturing thereof
12/12/2013US20130328209 Stack Arrangement
12/12/2013US20130328208 Dual damascene dual alignment interconnect scheme
12/12/2013US20130328207 Embedded semiconductive chips in reconstituted wafers, and systems containing same
12/12/2013US20130328206 Chip arrangement and method for producing a chip arrangement
12/12/2013US20130328205 Integrated circuits having a continuous active area and methods for fabricating same
12/12/2013US20130328204 Solderless Die Attach to a Direct Bonded Aluminum Substrate
12/12/2013US20130328203 Method for applying a final metal layer for wafer level packaging and associated device
12/12/2013US20130328202 Through-silicon via and fabrication method thereof
12/12/2013US20130328201 Reliable interconnect for semiconductor device
12/12/2013US20130328200 Direct bonded copper substrate and power semiconductor module
12/12/2013US20130328199 Semiconductor device with spacers for capping air gaps and method for fabricating the same
12/12/2013US20130328198 Reverse damascene process
12/12/2013US20130328197 Electronic device and method for production
12/12/2013US20130328196 Semiconductor device with multi-layered storage node and method for fabricating the same
12/12/2013US20130328195 Utilization of a metallization scheme as an etching mask
12/12/2013US20130328194 Short and low loop wire bonding
12/12/2013US20130328193 Semiconductor device
12/12/2013US20130328192 Semiconductor package and method for manufacturing the same
12/12/2013US20130328191 Cte adaption in a semiconductor package
12/12/2013US20130328190 Methods and Apparatus of Packaging Semiconductor Devices
12/12/2013US20130328189 Bump-on-Lead Flip Chip Interconnection
12/12/2013US20130328187 Semiconductor device
12/12/2013US20130328186 Reduced stress tsv and interposer structures
12/12/2013US20130328185 Power Semiconductor Module, Method of Manufacturing Power Semiconductor Module, and Power Conversion Device
12/12/2013US20130328184 Composite member including substrate made of composite material
12/12/2013US20130328183 Method for manufacturing semiconductor devices having a glass substrate
12/12/2013US20130328182 Semiconductor memory device and method of fabricating the same
12/12/2013US20130328181 Electronic system with a composite substrate
12/12/2013US20130328180 Packaged semiconductor device with an exposed metal top surface
12/12/2013US20130328179 Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof
12/12/2013US20130328178 Shielding device
12/12/2013US20130328177 Stack semiconductor package and manufacturing the same
12/12/2013US20130328176 Emi-shielded semiconductor devices and methods of making
12/12/2013US20130328174 Edge Protection of Bonded Wafers During Wafer Thinning
12/12/2013US20130328172 Wafer-level flip chip device packages and related methods
12/12/2013US20130328132 Power semiconductor device and method therefor
12/12/2013US20130328125 Protection component and electrostatic discharge protection device with the same
12/12/2013US20130328046 Semiconductor device and a method of manufacturing the same
12/12/2013DE112012001049T5 Getriebesteuervorrichtung und elektronische Schaltungsvorrichtung Transmission control apparatus, and electronic circuit device
12/12/2013DE112008000040B4 Kühlstruktur einer Wärmesenke für eine Wärme erzeugende Komponente und Antriebseinheit Cooling structure of a heat sink for a heat-generating component and drive unit
12/12/2013DE112005003802B4 Verfahren zum Herstellen eines elektronischen Bauteils A method of manufacturing an electronic component
12/12/2013DE102013106049A1 Wärmeausdehnungskoeffizient-Anpassung in einem Halbleitergehäuse Thermal expansion coefficient adjustment in a semiconductor body
12/12/2013DE102013105736A1 Verwendung eines Metallisierungsschemas als Ätzmaske Using a Metallisierungsschemas as an etching mask
12/12/2013DE102012209709A1 Schutzvorrichtung für ein elektronisches Bauelement, elektrische Schaltung, elektrochemischer Energiespeicher, Verfahren zum Herstellen einer elektrischen Schaltung und Verwendung einer flexiblen Hülle Device for protecting an electronic component, electric circuit, electrochemical energy storage device, method of manufacturing an electric circuit and using a flexible sheath
12/12/2013DE102010060831B4 Bondmaterial mit exotherm reaktiven Heterostrukturen und Verfahren zum Befestigen mittels einer damit hergestellten Bondverbindung Bond material having exothermic reactive heterostructures and method for fixing by means of a bond produced therewith
12/12/2013DE102010000694B4 Leistungshalbleitermodul mit Druckkontaktfedern Power semiconductor module with pressure contact springs
12/12/2013DE102007020288B4 Elektrisches Bauelement Electrical component
12/12/2013DE102007020263B4 Verkrallungsstruktur Verkrallungsstruktur
12/11/2013EP2672789A2 Ultrathin buried die module and method of manufacturing thereof
12/11/2013EP2672512A2 Cold plate assembly incorporating thermal heat spreader
12/11/2013EP2672507A1 Bonding-sbstrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly
12/11/2013EP2671932A1 Curable composition for encapsulating optical semiconductor and optical semiconductor apparatus using the same
12/11/2013EP2671925A1 Resin composition and semiconductor device
12/11/2013EP2671435A2 Circuit assemblies including thermoelectric modules
12/11/2013EP2671252A1 Electronic component comprising a ceramic carrier and use of a ceramic carrier
12/11/2013EP2671250A1 Method for manufacturing two substrates connected by at least one mechanical and electrically conductive connection and the structure obtained
12/11/2013EP2671245A1 High density metal-insulator-metal trench capacitor with concave surfaces
12/11/2013EP1030349B2 Method and apparatus for treating electronic components mounted on a substrate, in particular semiconductor chips
12/11/2013CN203339165U Double-channel surface-mounted high-speed photoelectric coupler
12/11/2013CN203339162U Eight-layer stack-type chip packaging structure
12/11/2013CN203339160U Eight-layer stack-type chip packaging structure
12/11/2013CN203339159U Reverse packaging structure of multilayer wire substrate chip of metal plate
12/11/2013CN203339158U Multi-chip stack packaging structure of multilayer wire substrate of metal plate
12/11/2013CN203339157U Positive packaging structure of multilayer wire substrate chip of metal plate
12/11/2013CN203339156U Metal plate multilayer wire substrate structure
12/11/2013CN203339155U Lead frame with dovetail groove
12/11/2013CN203339154U Lead frame structure with alternative pins
12/11/2013CN203339153U Multi-chip packaging structure
12/11/2013CN203339152U Monolithic chip flat packaging part based on stamping framework
12/11/2013CN203339151U Gold line connection structure for chip and substrate
12/11/2013CN203339150U Eight-layer stack-type chip packaging structure
12/11/2013CN203339149U QFN packaging structure
12/11/2013CN203339148U Circuit protection element
12/11/2013CN203339147U Straight-placing packaging structure of multilayer wire substrate chip of metal plate
12/11/2013CN203339146U A multi-ceramic-layer patterned structural substrate for optical and electronic devices
12/11/2013CN203339145U A multilayer composite ceramic layer patterned structural substrate for optical and electronic devices
12/11/2013CN203339144U 半导体装置 Semiconductor device
12/11/2013CN203339143U 半导体装置 Semiconductor device
12/11/2013CN203339142U FCQFN packaging part filled with bottom filling material
12/11/2013CN203339141U GPS system grade support plate packaging structure
12/11/2013CN203339140U A patterned structural substrate for optical and electronic devices
12/11/2013CN203339139U A patterned functional structural substrate for optical and electronic devices
12/11/2013CN203339138U Modified injection molding packaging structure of high-power semiconductor module
12/11/2013CN203339137U Conductive copper plate box
12/11/2013CN203337968U Array substrate and display device
12/11/2013CN103444273A Method for forming copper wiring, method for manufacturing wiring substrate, and wiring substrate
12/11/2013CN103444271A Through wiring board, electronic device package, and electronic component
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