| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/20/2002 | US6437653 Method and apparatus for providing a variable inductor on a semiconductor chip |
| 08/20/2002 | US6437454 Semiconductor base material having fine dot mark |
| 08/20/2002 | US6437453 Wire bonding method, semiconductor device, circuit board, electronic instrument and wire bonding device |
| 08/20/2002 | US6437452 Substrate having vias with pre-formed leads connecting semiconductor to substrate circuitry; for use in high density, high performance semiconductor packaging; low cost |
| 08/20/2002 | US6437450 Method of mounting semiconductor chip |
| 08/20/2002 | US6437449 Making semiconductor devices having stacked dies with biased back surfaces |
| 08/20/2002 | US6437448 Semiconductor device adapted for mounting on a substrate |
| 08/20/2002 | US6437447 Dual-sided chip package without a die pad |
| 08/20/2002 | US6437446 Semiconductor device having first and second chips |
| 08/20/2002 | US6437443 Multiphase low dielectric constant material and method of deposition |
| 08/20/2002 | US6437441 Wiring structure of a semiconductor integrated circuit and a method of forming the wiring structure |
| 08/20/2002 | US6437440 Thin film metal barrier for electrical interconnections |
| 08/20/2002 | US6437438 Eddy current limiting thermal plate |
| 08/20/2002 | US6437437 Semiconductor package with internal heat spreader |
| 08/20/2002 | US6437436 Integrated circuit chip package with test points |
| 08/20/2002 | US6437435 Vertically mountable interposer, assembly and method |
| 08/20/2002 | US6437434 Semiconductor device and semiconductor device mounting interconnection board |
| 08/20/2002 | US6437432 Semiconductor device having improved electrical characteristics and method of producing the same |
| 08/20/2002 | US6437431 Die power distribution system |
| 08/20/2002 | US6437430 Semiconductor apparatus and frame used for fabricating the same |
| 08/20/2002 | US6437429 Semiconductor package with metal pads |
| 08/20/2002 | US6437428 Ball grid array type semiconductor package having a flexible substrate |
| 08/20/2002 | US6437427 Lead frame used for the fabrication of semiconductor packages and semiconductor package fabricated using the same |
| 08/20/2002 | US6437426 Semiconductor integrated circuit having an improved grounding structure |
| 08/20/2002 | US6437425 Semiconductor devices which utilize low K dielectrics |
| 08/20/2002 | US6437423 Method for fabricating semiconductor components with high aspect ratio features |
| 08/20/2002 | US6437421 Self-aligned dual-base semiconductor process and structure incorporating multiple bipolar device types |
| 08/20/2002 | US6437420 Semiconductor elements for semiconductor device |
| 08/20/2002 | US6437418 High quality factor, integrated inductor and production method thereof |
| 08/20/2002 | US6437411 Semiconductor device having chamfered silicide layer and method for manufacturing the same |
| 08/20/2002 | US6437409 Semiconductor device |
| 08/20/2002 | US6437365 Raised tungsten plug antifuse and fabrication processes |
| 08/20/2002 | US6437364 Internal probe pads for failure analysis |
| 08/20/2002 | US6437254 Apparatus and method for printed circuit board repair |
| 08/20/2002 | US6437253 Terminal structure to which an electronic component is to be bonded |
| 08/20/2002 | US6437240 Microelectronic connections with liquid conductive elements |
| 08/20/2002 | US6437026 Hardener for epoxy molding compounds |
| 08/20/2002 | US6436842 Semiconductor wafer including a dot mark of a peculiar shape and method of forming the dot mark |
| 08/20/2002 | US6436839 Increasing programming silicide process window by forming native oxide film on amourphous Si after metal etching |
| 08/20/2002 | US6436827 Fabrication method of a semiconductor device |
| 08/20/2002 | US6436826 Chemical enhancer layer formed on damascene pattern which is filled with copper using mocvd; enhancer exposed to plasma or radical plasma process so that it remains only within a bottom portion of damascene pattern. |
| 08/20/2002 | US6436819 Formation of a metal nitride/metal stack suitable for use as a barrier/liner exposed to a treatment step in a nitrogen-containing environment, e.g., a plasma. the plasma treatment modifies the entire metal nitride layer |
| 08/20/2002 | US6436814 Interconnection structure and method for fabricating same |
| 08/20/2002 | US6436813 Interlayer insulating film formed on one main surface of the semiconductor substrate and having a concave portion, a liner film formed on the inner surface of concave wire layer |
| 08/20/2002 | US6436812 Multilayer; etch barrier, hard mask and antireflectivity layer |
| 08/20/2002 | US6436807 Method for making an interconnect layer and a semiconductor device including the same |
| 08/20/2002 | US6436804 Semiconductor integrated circuit device, semiconductor integrated circuit wiring method, and cell arranging method |
| 08/20/2002 | US6436803 Manufacturing computer systems with fine line circuitized substrates |
| 08/20/2002 | US6436802 Method of producing contact structure |
| 08/20/2002 | US6436738 Silicide agglomeration poly fuse device |
| 08/20/2002 | US6436737 Method for reducing soft error rates in semiconductor devices |
| 08/20/2002 | US6436736 Method for manufacturing a semiconductor package on a leadframe |
| 08/20/2002 | US6436735 Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact |
| 08/20/2002 | US6436734 Method of making a support circuit for a semiconductor chip assembly |
| 08/20/2002 | US6436733 Bonding layer method in a semiconductor device |
| 08/20/2002 | US6436731 Connecting semiconductor chip to housing; precleaning |
| 08/20/2002 | US6436730 Microelectronic package comprising tin copper solder bump interconnections and method for forming same |
| 08/20/2002 | US6436726 Methods and circuits for mask-alignment detection |
| 08/20/2002 | US6436723 Ozone water containing an oxidation agent having an oxidation-reduction potential of 2v or more is supplied onto a metal compound film such as srruo film or the like, and the metal compound film is etched by oxidation-reduction reaction |
| 08/20/2002 | US6436602 Method of repairing a defective portion in an electronic device |
| 08/20/2002 | US6436585 Creating an electrical fuse on a semiconductor structure comprising: determining a pattern for a desired electrical fuse, said pattern including a fuse portion of substantially constant width except for a localized region |
| 08/20/2002 | US6436550 Sintered compact and method of producing the same |
| 08/20/2002 | US6436506 Transferrable compliant fibrous thermal interface |
| 08/20/2002 | US6436331 Method of resin sealing a gap between a semiconductor chip and a substrate |
| 08/20/2002 | US6436316 Thick film conductors |
| 08/20/2002 | US6436302 Post CU CMP polishing for reduced defects |
| 08/20/2002 | US6435883 High density multichip interconnect decal grid array with epoxy interconnects and transfer tape underfill |
| 08/20/2002 | US6435414 Electronic module for chip card |
| 08/20/2002 | US6435400 Bondhead lead clamp apparatus and method |
| 08/20/2002 | US6435396 Print head for ejecting liquid droplets |
| 08/20/2002 | US6435394 Transporter for lead frames and transport assembly |
| 08/20/2002 | US6435267 Apparatus to enhance cooling of electronic device |
| 08/20/2002 | US6434817 Method for joining an integrated circuit |
| 08/20/2002 | CA2115553C Plated compliant lead |
| 08/15/2002 | WO2002063934A1 Interconnect |
| 08/15/2002 | WO2002063896A1 Wireless local loop antenna |
| 08/15/2002 | WO2002063688A1 Hybrid integrated circuit device and method for fabricating the same and electronic device |
| 08/15/2002 | WO2002063687A2 Screening device for integrated circuits |
| 08/15/2002 | WO2002063686A2 High performance silicon contact for flip chip |
| 08/15/2002 | WO2002063684A2 Single layer surface mount package |
| 08/15/2002 | WO2002063683A2 Method of manufacturing a semiconductor device and a semiconductor device obtained by means of said method |
| 08/15/2002 | WO2002063682A2 Lithographic type microelectronic spring structures with improved contours |
| 08/15/2002 | WO2002063681A1 Semiconductor integrated circuit device and its manufacturing method |
| 08/15/2002 | WO2002063676A2 A slot via filled dual damascene structure without middle stop layer and method for making the same |
| 08/15/2002 | WO2002063675A1 Integrated circuit, method of testing integrated circuit and method of manufacturing integrated circuit |
| 08/15/2002 | WO2002063674A1 Lead-free solder structure and method for high fatigue life |
| 08/15/2002 | WO2002063672A1 Method for multilevel copper interconnects for ultra large scale integration |
| 08/15/2002 | WO2002062588A1 Electronic device and method of manufacturing the same |
| 08/15/2002 | WO2002026479A3 Carbon-carbon fiber composite heat spreader |
| 08/15/2002 | WO2002025777A3 Press (non-soldered) contacts for high current electrical connections in power modules |
| 08/15/2002 | WO2002019427A3 Integrated circuit package incorporating camouflaged programmable elements |
| 08/15/2002 | WO2001047016A9 Method and apparatus for encoding information in an ic package |
| 08/15/2002 | WO2001039255A9 Radiation shield and radiation shielded integrated circuit device |
| 08/15/2002 | WO2001039220A9 Inductor for integrated circuit and methods of manufacture |
| 08/15/2002 | WO2001026145A9 Seed layers for interconnects and methods and apparatus for their fabrication |
| 08/15/2002 | WO2001013431A9 Apparatuses for forming wire bonds from circuitry on a substrate to a semiconductor chip, and methods of forming semiconductor chip assemblies |
| 08/15/2002 | US20020111420 Core-shell polymers; encapsulation |
| 08/15/2002 | US20020111055 Anisotropic conductive film and production method thereof |
| 08/15/2002 | US20020111054 Ball grid array package and its fabricating process |
| 08/15/2002 | US20020111053 Interconnection structure of semiconductor element |