Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2002
08/15/2002US20020111051 Bare chip carrier and method for manufacturing semiconductor device using the bare chip carrier
08/15/2002US20020111050 Press (non-soldered) contacts for high current electrical connections in power modules
08/15/2002US20020111022 Method of forming embedded copper interconnections and embedded copper interconnection structure
08/15/2002US20020111016 Method and apparatus for injection molded flip chip encapsulation
08/15/2002US20020111012 Partially-overlapped interconnect structure and method of making
08/15/2002US20020111010 Common ball-limiting metallurgy for I/O sites
08/15/2002US20020111009 Reliable metal bumps on top of I/O pads after removal of test probe marks
08/15/2002US20020111008 Integrated circuit packages and the method for the same
08/15/2002US20020111007 Semiconductor package and fabricating method thereof
08/15/2002US20020111004 Semiconductor device having a fuse and a fabrication process thereof
08/15/2002US20020111003 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
08/15/2002US20020110999 Reliable interconnects with low via/contact resistance
08/15/2002US20020110982 Method for fabricating a semiconductor device
08/15/2002US20020110981 Method for fabricating a semiconductor device
08/15/2002US20020110956 Chip lead frames
08/15/2002US20020110955 Electronic device including at least one chip fixed to a support and a method for manufacturing such a device
08/15/2002US20020110954 Semiconductor device and method of fabricating same
08/15/2002US20020110953 Wafer on wafer packaging and method of fabrication for full-wafer burn-in and testing
08/15/2002US20020110943 6699733 not granted per USPTO
08/15/2002US20020110942 System and method for prototyping and fabricating complex microwave circuits
08/15/2002US20020110936 Inductor recognition method, layout inspection method, computer readable recording medium in which a layout inspection program is recorded and process for a semiconductor device
08/15/2002US20020110757 Low cost integrated out-of-plane micro-device structures and method of making
08/15/2002US20020110271 Visual inspection method and visual inspection apparatus
08/15/2002US20020110270 Nonlot based method for assembling integrated circuit devices
08/15/2002US20020110162 Solid-state laser cooling
08/15/2002US20020109973 Lead frame and method for fabricating resin-encapsulated semiconductor device using the same
08/15/2002US20020109970 Heat sink for cooling electronic chip
08/15/2002US20020109797 TFT LCD device having multi-layered pixel electrodes
08/15/2002US20020109590 Bonded structure using reacted borosilicate mixture
08/15/2002US20020109575 Ceramic chip-type device having glass coating film and fabricating method thereof
08/15/2002US20020109242 Semiconductor device and a method of manufacturing the same
08/15/2002US20020109241 Molded flip chip package
08/15/2002US20020109240 Integrated circuit device having C4 and wire bond connections
08/15/2002US20020109239 Semiconductor device capable of preventing solder balls from being removed in reinforcing pad
08/15/2002US20020109237 Semiconductor device and method for making the same
08/15/2002US20020109236 Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof
08/15/2002US20020109235 Enhanced barrier liner formation for vias
08/15/2002US20020109234 Semiconductor device having multi-layer copper line and method of forming the same
08/15/2002US20020109232 Chip structure and process for forming the same
08/15/2002US20020109229 Semiconductor device with improved metal interconnection and method for forming the metal interconnection
08/15/2002US20020109228 Bilayer wafer-level underfill
08/15/2002US20020109227 Metal bump
08/15/2002US20020109226 Enhanced die-down ball grid array and method for making the same
08/15/2002US20020109225 Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate
08/15/2002US20020109223 High-frequency integrated circuit and high-frequency circuit device using the same
08/15/2002US20020109222 Multi-die integrated circuit package structure and method of manufacturing the same
08/15/2002US20020109220 Method for surface mounted power transistor with heat sink
08/15/2002US20020109219 Semiconductor package with heat sink having air vent
08/15/2002US20020109218 Method and apparatus for packaging flip chip bare die on printed circuit boards
08/15/2002US20020109217 Apparatus for die bonding
08/15/2002US20020109216 Integrated electronic device and integration method
08/15/2002US20020109215 Semiconductor device
08/15/2002US20020109214 Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
08/15/2002US20020109213 Methods of making microelectronic assemblies including compliant interfaces
08/15/2002US20020109212 Lead frames including inner-digitized bond fingers on bus bars and semiconductor device package including same
08/15/2002US20020109211 Semiconductor device and method of manufacturing same
08/15/2002US20020109210 Lead structure for sealing package
08/15/2002US20020109205 Semiconductor device, method of creating pattern of the same, method of manufacturing the same, and apparatus for creating pattern of the same
08/15/2002US20020109203 Power transistor with internally combined low-pass and band-pass matching stages
08/15/2002US20020109201 Rectifying device and method of fabrication thereof
08/15/2002US20020109195 Semiconductor device with multiple emitter contact plugs
08/15/2002US20020109156 Semiconductor device having signal line above main ground or main VDD line, and manufacturing method thereof
08/15/2002US20020109152 Power semiconductor module
08/15/2002US20020109133 Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip
08/15/2002US20020109000 Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween
08/15/2002US20020108940 Circuit and method for heating an adhesive to package or rework a semiconductor die
08/15/2002US20020108781 Printed wiring board and production thereof
08/15/2002US20020108780 Multilayered laminate
08/15/2002US20020108769 Plastic integrated circuit package and method and lead frame for making the package
08/15/2002US20020108768 I/C chip assembly and method of forming same
08/15/2002US20020108744 Heat sink assembly for non-planar integrated circuit package
08/15/2002US20020108743 Porous media heat sink apparatus
08/15/2002US20020108685 Controlled in material's crystal orientations
08/15/2002US20020108632 Method of reducing defects in anti-reflective coatings and semiconductor structures fabricated thereby
08/15/2002CA2471305A1 Wireless local loop antenna
08/14/2002EP1231825A1 Multilayer substrate module and portable wireless terminal
08/14/2002EP1231639A1 Power module
08/14/2002EP1231638A1 Power supply wiring of an integrated circuit
08/14/2002EP1231637A2 High dielectric constant composite material and multilayer wiring board using the same
08/14/2002EP1231636A2 Semiconductor device, production method therefor, and electrophotographic apparatus
08/14/2002EP1231635A1 Method for manufacturing an electronic power device and a diode in a same package
08/14/2002EP1231634A1 Duct flow-type fan
08/14/2002EP1231633A1 Material of heat-dissipating plate on which semiconductor is mounted, method for fabricating the same, and ceramic package produced by using the same
08/14/2002EP1231632A2 Heat sink with fins
08/14/2002EP1231627A2 Marking apparatus and process therefor
08/14/2002EP1231616A1 Out-of-plane micro-device structures
08/14/2002EP1231615A1 Integrated inductor structure
08/14/2002EP1231248A1 Conductive and resistive materials with electrical stability for use in electronics devices
08/14/2002EP1231242A1 Curable organosiloxane compositions and semiconductor devices
08/14/2002EP1230711A1 Arrangement for electrically connecting chips in a circuit that is embodied in a three-dimensional manner
08/14/2002EP1230680A2 Method for integrating a chip in a printed board and integrated circuit
08/14/2002EP1230679A2 Method for producing a support element for an integrated circuit (ic) component
08/14/2002EP1230678A1 Self-aligned metal caps for interlevel metal connections
08/14/2002EP1230676A1 Advanced flip-chip join package
08/14/2002EP0969964A4 A thermal storage and transfer device
08/14/2002DE10146227A1 Siliciumnitrid-Produkt Silicon nitride product
08/14/2002DE10117929A1 Verfahren zum Verbinden eines Chips mit einem Substrat unter Verwendung einer isotropen Verbindungsschicht und Verbundsystem aus Chip und Substrat A method for connecting a chip to a substrate using an isotropic tie layer and the composite system of the chip and substrate
08/14/2002DE10107666C1 Herstellungsverfahren für eine integrierte Schaltung, insbesondere eine Antifuse Manufacturing process for an integrated circuit, in particular a antifuse
08/14/2002DE10104731A1 Ionenbindende Polymerbeschichtung zur Toxizitätsminderung von Halbleitersubstraten Ion-binding polymer coating on the toxicity reduction of semiconductor substrates
08/14/2002DE10104267A1 Elektronisches Bauteil mit mindestens einer Isolationslage Electronic component with at least one layer of insulation
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