H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2002
08/22/2002	US20020113307 High-density flip-chip interconnect
08/22/2002	US20020113306 Semiconductor packages
08/22/2002	US20020113305 Dual-die integrated circuit package
08/22/2002	US20020113304 Dual die package and manufacturing method thereof
08/22/2002	US20020113303 Mounting structure for semiconductor devices
08/22/2002	US20020113302 Semiconductor device
08/22/2002	US20020113301 Leadless semiconductor package
08/22/2002	US20020113300 System and method for suppressing RF resonance in a semiconductor package
08/22/2002	US20020113299 Stress reduction feature for LOC lead frame
08/22/2002	US20020113298 Electronic part and method of fabricating thereof
08/22/2002	US20020113297 Method and structure of a precision mim fusible circuit elements using fuses and antifuses
08/22/2002	US20020113296 Wafer level hermetic sealing method
08/22/2002	US20020113295 Semiconductor device and method for its manufacture
08/22/2002	US20020113292 Additional capacitance for MIM capacitors with no additional processing
08/22/2002	US20020113291 Fuse structure with thermal and crack-stop protection
08/22/2002	US20020113290 Integrated inductance structure
08/22/2002	US20020113289 Method and apparatus for thermal management of integrated circuits
08/22/2002	US20020113288 Method and structure for providing improved thermal conduction for silicon semiconductor devices
08/22/2002	US20020113287 Semiconductor integrated circuit device with capacitor formed under bonding pad
08/22/2002	US20020113278 Stacked semiconductor integrated circuit device and manufacturing method thereof
08/22/2002	US20020113273 Semiconductor device having contact plug and method for manufacturing the same
08/22/2002	US20020113271 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
08/22/2002	US20020113259 Scratch protection for direct contact sensors
08/22/2002	US20020113247 Electronic device integrating an insulated gate bipolar transistor power device and a diode into a protective package
08/22/2002	US20020113239 Semiconductor device with a tapered hole formed using multiple layers with different etching rates
08/22/2002	US20020113237 Semiconductor memory device for increasing access speed thereof
08/22/2002	US20020113208 Process for precise arrangement of micro-bodies
08/22/2002	US20020113142 Spray cooling system for a device
08/22/2002	US20020113141 Passive spray coolant pump
08/22/2002	US20020113131 Smart card module, smart card with the smart card module, and method for producing the smart card module
08/22/2002	US20020112965 Bond enhancement antitarnish coatings
08/22/2002	US20020112884 Circuit board and method of manufacturing the same
08/22/2002	US20020112882 Ceramic circuit board
08/22/2002	US20020112881 Substrate of semiconductor package
08/22/2002	US20020112879 Electronic parts mounting board and production method thereof
08/22/2002	US20020112847 Cooling device for heat source
08/22/2002	US20020112846 Heat sink with fins
08/22/2002	US20020112498 Modular sprayjet cooling system
08/22/2002	US20020112497 Spray cooling with local control of nozzles
08/22/2002	US20020112496 Variably configured sprayjet cooling system
08/22/2002	US20020112491 Spray cooling system with cooling regime detection
08/22/2002	DE10203353A1 Halbleitermodul und elektronische Komponente Semiconductor and electronic component module
08/22/2002	DE10154556A1 Gestapelte Halbleiterbauelementestruktur Stacked semiconductor device structure
08/22/2002	DE10147955A1 Halbleitervorrichtung Semiconductor device
08/22/2002	DE10136283A1 Halbleiteranordnung Semiconductor device
08/22/2002	DE10122191A1 Halbleiterbauelement mit einem Halbleiterkörper und einem Gehäuse A semiconductor device comprising a semiconductor body and a housing
08/22/2002	DE10111029C1 Depassivierungssensor als Analysierschutz für Halbleiterbauelemente oder integrierte Schaltungen Depassivierungssensor as Analysierschutz for semiconductor devices or integrated circuits
08/22/2002	DE10106564A1 Bondierungsanschlussflächenanordnung Bondierungsanschlussflächenanordnung
08/22/2002	DE10105351A1 Elektronisches Bauelement mit Halbleiterchip und Herstellungsverfahren desselben The same electronic device with the semiconductor chip and manufacturing processes
08/22/2002	DE10104219A1 Anordnung zur aktiven Kühlung eines Halbleiterbausteins Arrangement for active cooling a semiconductor device
08/22/2002	DE10104063A1 Elektronisches Bauteil mit einem Halbleiterchip Electronic component having a semiconductor chip
08/22/2002	DE10103472A1 Halbleitermodul Semiconductor module
08/22/2002	DE10103390A1 Verfahren und System zum Herstellen einer im Wesentlichen ringförmigen Lotverbindung A method and system for producing a substantially annular solder joint
08/22/2002	DE10103340A1 Verfahren zum Wachsen von Kohlenstoff-Nanoröhren oberhalb einer elektrisch zu kontaktierenden Unterlage sowie Bauelement A method for growing carbon nanotubes above a electrically contacting pad and component
08/22/2002	DE10103298A1 Integrierte Anti-Fuse-Struktur Integrated anti-fuse structure
08/22/2002	DE10103297A1 MOS-Transistor MOS transistor
08/22/2002	CA2438494A1 A cooling arrangement for an integrated circuit
08/21/2002	EP1233454A2 Semiconductor memory device and method of manufacturing the same
08/21/2002	EP1233453A2 Semiconductor integrated circuit having anti-fuse, method of fabricating, and method of writing data in the same
08/21/2002	EP1233449A2 A method of fabricating a semiconductor device
08/21/2002	EP1233448A2 Reliable interconnects with low via/contact resistance
08/21/2002	EP1233446A2 Thermosetting resin composition and semiconductor device using the same
08/21/2002	EP1233444A2 Membrane dielectric isolation ic fabrication
08/21/2002	EP1233372A1 Circuit and method for protecting a chip arrangement against manipulation and/or against abuse
08/21/2002	EP1232679A1 Printed circuit board employing lossy power distribution network to reduce power plane resonances
08/21/2002	EP1232677A2 Flip chip package, circuit board thereof and packaging method thereof
08/21/2002	EP1232526A1 Method and apparatus for personalization of semiconductor
08/21/2002	EP1232525A2 Conductive interconnection
08/21/2002	EP1232524A1 Method of protective coating bga solder alloy spheres
08/21/2002	EP0833578B1 Fan attachment clip for heat sink
08/21/2002	CN2507144Y IC pin assembly
08/21/2002	CN2507143Y Fixator for radiation fan
08/21/2002	CN2507142Y Heat sink
08/21/2002	CN2507141Y Heat radiator
08/21/2002	CN2507140Y Radiation air guiding hood
08/21/2002	CN2507139Y Upper and lower clamping type CPU sink fastener
08/21/2002	CN2507138Y Heat radiator for computer
08/21/2002	CN2507137Y Fastener snap for heat sink component
08/21/2002	CN2507136Y Stress reduced chip package
08/21/2002	CN2507055Y CPU heat sink
08/21/2002	CN1365521A Semiconductor device, method of manufacturing electronic device, electronic device and portable information terminal
08/21/2002	CN1365517A Component and method for the production thereof
08/21/2002	CN1365516A Semiconductor device and process for designing mask
08/21/2002	CN1365146A Semiconductor device and its producing method
08/21/2002	CN1365145A Heat collecting end of heat conduction tube
08/21/2002	CN1365144A Power source semiconductor module and cooling element for holding semiconductor module
08/21/2002	CN1365140A Method for producing semiconductor device and semiconductor device
08/21/2002	CN1089493C Power semiconductor module and its producing method
08/21/2002	CN1089491C 半导体器件 Semiconductor devices
08/21/2002	CN1089457C Surface complemental heat dissipation device
08/20/2002	US6438733 IC substrate noise modeling with improved surface gridding technique
08/20/2002	US6438504 Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with radiation fins
08/20/2002	US6438014 High speed access compatible memory module
08/20/2002	US6437990 Multi-chip ball grid array IC packages
08/20/2002	US6437986 Fuse relay junction block for use in automobiles
08/20/2002	US6437984 Thermally enhanced chip scale package
08/20/2002	US6437983 Vapor chamber system for cooling mobile computing systems
08/20/2002	US6437982 External attached heat sink fold out
08/20/2002	US6437981 Thermally enhanced microcircuit package and method of forming same
08/20/2002	US6437669 Microwave to millimeter wave frequency substrate interface

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