Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2002
08/27/2002US6440821 Method and apparatus for aligning wafers
08/27/2002US6440781 Method of adding bias-independent aluminum bridged anti-fuses to a tungsten plug process
08/27/2002US6440779 Semiconductor package based on window pad type of leadframe and method of fabricating the same
08/27/2002US6440777 Method of depositing a thermoplastic polymer in semiconductor fabrication
08/27/2002US6440775 Method and apparatus for edge connection between elements of an integrated circuit
08/27/2002US6440774 Electronic device, method of manufacturing the same, and apparatus for manufacturing the same
08/27/2002US6440773 Semiconductor device
08/27/2002US6440772 Bow resistant plastic semiconductor package and method of fabrication
08/27/2002US6440770 Integrated circuit package
08/27/2002US6440759 Method of measuring combined critical dimension and overlay in single step
08/27/2002US6440750 Method of making integrated circuit having a micromagnetic device
08/27/2002US6440641 Deposited thin film build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates
08/27/2002US6440574 Substrate for high-voltage modules
08/27/2002US6440570 Stable thin film oxide standard
08/27/2002US6440262 Resist mask having measurement marks for measuring the accuracy of overlay of a photomask disposed on semiconductor wafer
08/27/2002US6440230 Electrodeposited on a substrate and converted, at least in part, to a layer comprising nitrogen and the electrodeposited material. chromium nitride and chromium oxynitride are examples of nitrogen-comprising material
08/27/2002US6439969 Apparatus and method of chamfering wafer
08/27/2002US6439898 Method and apparatus for interconnecting devices using an adhesive
08/27/2002US6439897 Socket apparatus for removably mounting electronic packages with improved contacting system
08/27/2002US6439896 IC socket and method of assembling the IC socket
08/27/2002US6439894 Contact assembly for land grid array interposer or electrical connector
08/27/2002US6439299 Heatsink apparatus
08/27/2002US6438984 Refrigerant-cooled system and method for cooling electronic components
08/27/2002US6438830 Process of producing plastic pin grid array
08/27/2002US6438825 Method to prevent intrusions into electronic circuitry
08/26/2002CA2371417A1 Laser welding components to an optical micro-bench
08/22/2002WO2002065592A1 Demountable clamping means for land grid array connectors
08/22/2002WO2002065573A1 Solid electrolyte cell and production method thereof
08/22/2002WO2002065549A1 A cooling arrangement for an integrated circuit
08/22/2002WO2002065548A2 Integrated circuit arrangement consisting of a flat substrate
08/22/2002WO2002065547A2 METHOD OF OBTAINING LOW TEMPERATURE ALPHA-Ta THIN FILMS USING WAFER BIAS
08/22/2002WO2002065546A1 Semiconductor device manufacturing method and semiconductor device
08/22/2002WO2002065545A2 Overlay alignment metrology using diffraction gratings
08/22/2002WO2002065543A2 Bonded structure using reacted borosilicate mixture
08/22/2002WO2002065542A2 Underfill compositions
08/22/2002WO2002065540A1 A common ball-limiting metallurgy for i/o sites
08/22/2002WO2002065539A1 Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures
08/22/2002WO2002065492A2 Integrated transformer
08/22/2002WO2002065475A2 Self-aligned conductive line for cross-point magnetic memory integrated circuits
08/22/2002WO2002065030A1 Improved efficiency thermoelectrics utilizing thermal isolation
08/22/2002WO2002064496A2 Method for forming microelectronic spring structures on a substrate
08/22/2002WO2002064364A1 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film
08/22/2002WO2002041395A3 A high-performance fin configuration for air-cooled heat dissipation device
08/22/2002WO2002027768A3 Fabrication of semiconductor devices
08/22/2002WO2002023674A3 Thick film millimeter wave transceiver module
08/22/2002US20020116686 Continuously variable dummy pattern density generating systems, methods and computer program products for patterning integrated circuits
08/22/2002US20020115414 RF oscillator apparatus and transceiver apparatus
08/22/2002US20020115356 Graded metallic leads for connection to microelectronic elements
08/22/2002US20020115325 Semiconductor device having signal contacts and high current power contacts
08/22/2002US20020115308 Semiconductor device with porous interlayer insulating film
08/22/2002US20020115302 Aggregate dielectric layer to reduce nitride consumption
08/22/2002US20020115295 Process of manufacturing semiconductor device
08/22/2002US20020115292 Method for forming electromigration-resistant structures by doping
08/22/2002US20020115290 Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same
08/22/2002US20020115287 Method and apparatus for forming improved metal interconnects
08/22/2002US20020115282 Chip structure and process for forming the same
08/22/2002US20020115281 Semiconductor integrated circuit device and method for making the same
08/22/2002US20020115280 Bond-pad with pad edge strengthening structure
08/22/2002US20020115279 Use of palladium in IC manufacturing
08/22/2002US20020115278 Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier
08/22/2002US20020115277 Transverse hybrid LOC package
08/22/2002US20020115274 Semiconductor device and method of manufacturing the same
08/22/2002US20020115263 Method and related apparatus of processing a substrate
08/22/2002US20020115260 Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same
08/22/2002US20020115239 Esd protection network used for soi technology
08/22/2002US20020115238 Stitched plane structure for package power delivery and dual referenced stripline i/o performance
08/22/2002US20020115236 Methods of making compliant semiconductor chip packages
08/22/2002US20020115234 Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture
08/22/2002US20020115233 Semiconductor device and method for fabricating the same
08/22/2002US20020114969 Covercoats to protect the circuitry
08/22/2002US20020114963 Depositing layer of chromium onto diamond component; depositing metal selected from tungsten, molybdenum, tantalum, niobium, or their alloy with chromium; depositing layer of silver or gold or copper; heating
08/22/2002US20020114726 Electronic device
08/22/2002US20020114496 Scratch-resistant coating for a semiconductor component
08/22/2002US20020114191 Semiconductor memory device and method of manufacturing the same
08/22/2002US20020114144 Molded flip chip package
08/22/2002US20020114143 Chip-scale packages stacked on folded interconnector for vertical assembly on substrates
08/22/2002US20020114137 Heatsink mounting with shock absorbers
08/22/2002US20020114136 External attached heat sink fold out
08/22/2002US20020114135 Heat sink chip package
08/22/2002US20020114134 Electromagnetic interference and heatsinking
08/22/2002US20020114133 Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same
08/22/2002US20020114129 Ultra-low impedance power interconnection system for electronic packages
08/22/2002US20020113663 Energy conditioning circuit assembly
08/22/2002US20020113523 Piezoelectric device and package thereof
08/22/2002US20020113325 Semiconductor package and mounting structure on substrate thereof and stack structure thereof
08/22/2002US20020113324 Method for forming three-dimensional circuitization and circuits formed
08/22/2002US20020113323 Integrated semiconductor circuit
08/22/2002US20020113322 Semiconductor device and method to produce the same
08/22/2002US20020113321 Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture
08/22/2002US20020113320 Flip-chip with matched signal lines, ground plane and ground bumps adjacent signal bumps
08/22/2002US20020113319 Flip chip semiconductor device having signal pads arranged outside of power supply pads
08/22/2002US20020113318 Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate
08/22/2002US20020113317 A semiconductor device having hydogen diffusion and barrier layers and a method of producing the same
08/22/2002US20020113316 Semiconductor device and method of manufacturing the same
08/22/2002US20020113314 Method of forming iridium conductive electrode/barrier structure
08/22/2002US20020113313 Semiconductor device bonding pad resistant to stress and method of fabricating the same
08/22/2002US20020113312 Via plug adapter
08/22/2002US20020113311 Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the two
08/22/2002US20020113309 Shielding of RF devices
08/22/2002US20020113308 Semiconductor package with heat dissipating structure
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