H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2002
08/29/2002	US20020119676 Method of forming porous forming film wiring structure
08/29/2002	US20020119658 Semiconductor device and method for making the same
08/29/2002	US20020119657 Bonding copper nucleation layer to barrier undercoatings
08/29/2002	US20020119651 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
08/29/2002	US20020119650 Die testing using top surface test pads
08/29/2002	US20020119640 Methods of forming semiconductor circuitry, methods of forming logic circuitry, and semiconductor circuit constructions
08/29/2002	US20020119630 Method for manufacturing a semiconductor device
08/29/2002	US20020119623 Dram device and method of manufacturing the same background of the invention
08/29/2002	US20020119609 Thin film semiconductor device, polycrystalline semiconductor thin film production process and production apparatus
08/29/2002	US20020119605 Fluoropolymers
08/29/2002	US20020119604 Semiconductor device encapsulators, methods of encapsulating semiconductor devices and methods of forming electronic packages
08/29/2002	US20020119603 Semiconductor device and method of manufacturing same
08/29/2002	US20020119602 Insert-moldable heat spreader, semiconductor device using same, and method for manufacturing such semiconductor device
08/29/2002	US20020119600 Wafer-interposer using a ceramic substrate
08/29/2002	US20020119599 Method for making semiconductor device
08/29/2002	US20020119598 Semiconductor device, and a method of producing semiconductor device
08/29/2002	US20020119596 Semiconductor device including edge bond pads and methods
08/29/2002	US20020119595 Semiconductor package using tape circuit board with a groove for preventing encapsulant from overflowing and manufacturing method thereof
08/29/2002	US20020119594 Method of manufacturing a semiconductor device and a semiconductor device obtained by means of said method
08/29/2002	US20020119583 Selectable decoupling capacitors for integrated circuit and methods of use
08/29/2002	US20020119317 Mixture containing phosphorous compound
08/29/2002	US20020118560 Substrate-level DC bus design to reduce module inductance
08/29/2002	US20020118528 Substrate layout method and structure for reducing cross talk of adjacent signals
08/29/2002	US20020118527 Cooling module grounding structure and method and electronic apparatus with the structure
08/29/2002	US20020118523 Electronic circuit equipment using multilayer circuit board
08/29/2002	US20020118522 Ball grid array package with interdigitated power ring and ground ring
08/29/2002	US20020118515 Compliant off-chip interconnects
08/29/2002	US20020118513 Heat sink assembly retainer for electronic integrated circuit package
08/29/2002	US20020118512 Clip for heat sink
08/29/2002	US20020118511 Heat dissipation device
08/29/2002	US20020118331 Liquid crystal display with control electrodes for preventing lateral leak of electric field
08/29/2002	US20020118044 Switching circuit device
08/29/2002	US20020117774 Epoxy resin, a hardener and a hardening accelerator are melt mixed together followed by regulating viscosity at a given temperature
08/29/2002	US20020117764 Lead-on-chip type of semiconductor package with embedded heat sink
08/29/2002	US20020117763 Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device
08/29/2002	US20020117762 Surface mountable chip type semiconductor device and manufacturing method
08/29/2002	US20020117760 Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics
08/29/2002	US20020117759 Stacked via with specially designed landing pad for integrated semiconductor structures
08/29/2002	US20020117758 Planarizers for spin etch planarization of electronic components and methods of use thereof
08/29/2002	US20020117757 Semiconductor integrated circuit device and wiring arranging method thereof
08/29/2002	US20020117756 Semiconductor device and method for manufacturing semiconductor device
08/29/2002	US20020117755 Semiconductor device
08/29/2002	US20020117754 Hybrid low-k interconnect structure comprised of 2 spin-on dielectric materials
08/29/2002	US20020117753 Three dimensional packaging
08/29/2002	US20020117751 Semiconductor die package having mesh power and ground planes
08/29/2002	US20020117750 Semiconductor device
08/29/2002	US20020117749 Heat transfer material for an improved die edge contacting socket
08/29/2002	US20020117748 Integrated circuit power supply
08/29/2002	US20020117747 Flexible semiconductor device support with integrated thermoelectric cooler and method for making same
08/29/2002	US20020117746 Composite devices of laminate type and processes
08/29/2002	US20020117744 Stitched plane structure and process for package power delivery and dual referenced stripline I/O performance
08/29/2002	US20020117743 Component built-in module and method for producing the same
08/29/2002	US20020117742 Semiconductor device
08/29/2002	US20020117741 High bandwidth 3d memory packaging technique
08/29/2002	US20020117740 Lead frame for plastic molded type semiconductor package
08/29/2002	US20020117739 Wiring board and semiconductor device using the same
08/29/2002	US20020117737 Interconnect structure with precise conductor resistance and method to form same
08/29/2002	US20020117735 Semiconductor wafer with process control modules
08/29/2002	US20020117730 Semiconductor device
08/29/2002	US20020117729 Semiconductor integrated circuit device
08/29/2002	US20020117724 Semiconductor integrated circuit having anti-fuse, method of fabricating, and method of writing data in the same
08/29/2002	US20020117707 Methods of forming field effect transistor gates, and methods of forming integrated circuitry
08/29/2002	US20020117703 Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formed
08/29/2002	US20020117696 Semiconductor switching device
08/29/2002	US20020117695 Gallium nitride materials including thermally conductive regions
08/29/2002	US20020117691 Thin film transistor array substrate using low dielectric insulating layer and method of fabricating the same
08/29/2002	US20020117688 Semiconductor device carrying a plurality of circuits
08/29/2002	US20020117669 Flexible substrate, electro-optical device and electronic equipment
08/29/2002	US20020117659 Nanosensors
08/29/2002	US20020117481 On-the-fly beam path error correction for memory link processing
08/29/2002	US20020117470 Method for controlling the sheet resistance of thin film resistors
08/29/2002	US20020117468 Method for forming a recognition mark on a substrate for a KGD
08/29/2002	US20020117399 Barrier composed of highly resistive materials include metal oxides, and tantalum nitride, coated onto the sidewalls and bottom of via hole intented for copper metallization
08/29/2002	US20020117330 Resilient contact structures formed and then attached to a substrate
08/29/2002	US20020117329 Components with releasable leads
08/29/2002	US20020117292 Arrangement for dissipating thermal energy generated by heat source
08/29/2002	US20020117200 By-pass rectifier element and terminal housing for solar battery modules using a by-pass rectifier element
08/29/2002	US20020116815 Manufacturing method of printed circuit board using dry film resist
08/29/2002	DE10203354A1 Verfahren zum Bilden eines Verbindungsmusters in einer Halbleitervorrichtung A method for forming an interconnection pattern in a semiconductor device
08/29/2002	DE10149093A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
08/29/2002	DE10121969C1 Schaltungsanordnung in Druckkontaktierung und Verfahren zu seiner Herstellung Circuit arrangement in pressure contact and process for its preparation
08/29/2002	DE10108324A1 Fokalebenenplatte für eine hochauflösende Kamera mit lichtempfindlichen Halbleitersensoren Fokalebenenplatte for a high resolution camera with light-sensitive semiconductor sensors
08/29/2002	DE10103456C1 Vorrichtung mit mindestens einem Halbleiterbauteil und einer Leiterplatte und Verfahren zur Herstellung einer elektromechanischen Verbindung zwischen beiden A device with at least one semiconductor device and a circuit board and method for producing an electro-mechanical connection between the two
08/29/2002	CA2438726A1 Liquid epoxy resin emulsions, method for the production and use thereof
08/29/2002	CA2438566A1 On-the-fly beam path error correction for memory link processing
08/29/2002	CA2438126A1 Semiconductor package and method of preparing same
08/28/2002	EP1235471A1 A stackable module
08/28/2002	EP1235357A1 High-frequency composite switch module
08/28/2002	EP1235350A2 Semiconductor switching device
08/28/2002	EP1235276A1 Semiconductor device and process for fabrication thereof
08/28/2002	EP1235275A1 Semiconductor device
08/28/2002	EP1235274A1 Temperature monitoring device for microprocessor cooling devices
08/28/2002	EP1235273A2 Semiconductor device formed by mounting semiconductor chip on support substrate, and the support substrate
08/28/2002	EP1235272A2 Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device
08/28/2002	EP1235269A2 Wafer testing and marking process for semiconductor components with fusing structures
08/28/2002	EP1235267A1 Two-metal tab tape, double-sided csp tape, bga tape, and method for manufacturing the same
08/28/2002	EP1235264A2 Direct etch for thin film resistor using a hard mask
08/28/2002	EP1234331A1 Planar hybrid diode rectifier bridge
08/28/2002	EP1234330A2 Method relating to anodic bonding
08/28/2002	EP1234321A1 Active package for integrated circuit

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