| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/05/2002 | US20020123243 Low k dielectric composite layer for integrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning |
| 09/05/2002 | US20020123235 Ruthenium silicide wet etch |
| 09/05/2002 | US20020123233 Method for stacking semiconductor die within an implanted medical device |
| 09/05/2002 | US20020123228 Method to improve the reliability of gold to aluminum wire bonds with small pad openings |
| 09/05/2002 | US20020123225 Control of Vmin transient voltage drift by using a PECVD silicon oxynitride film at the protective overcoat level |
| 09/05/2002 | US20020123218 Semiconductor device and mehtod of manufacturing the same |
| 09/05/2002 | US20020123216 Method of manufacturing semiconductor device |
| 09/05/2002 | US20020123214 Control of Vmin transient voltage drift by using silicon formed with deuterium-based process gases |
| 09/05/2002 | US20020123213 Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods |
| 09/05/2002 | US20020123212 Semiconductor device manufacturing method |
| 09/05/2002 | US20020123202 Semiconductor device and method for manufacturing the same |
| 09/05/2002 | US20020123193 Semiconductor memory device and method for manufacturing the same |
| 09/05/2002 | US20020123181 Method for manufacturing semiconductor device and semiconductor device manufactured thereby |
| 09/05/2002 | US20020123172 Methods for forming a die package |
| 09/05/2002 | US20020123171 Semiconductor device including edge bond pads and methods |
| 09/05/2002 | US20020123160 Integrated semiconductor device including high-voltage interconnections passing through low-voltage regions |
| 09/05/2002 | US20020123159 Structure of merged vertical capacitor inside spiral conductor for RF and mixed-signal applications |
| 09/05/2002 | US20020122301 Electronic component and method of producing the same |
| 09/05/2002 | US20020122298 Adaptable heat dissipation device for a personal computer |
| 09/05/2002 | US20020122283 Capacitor, circuit board with built-in capacitor and method for producing the same |
| 09/05/2002 | US20020121924 System for providing electrostatic discharge protection for high-speed integrated circuits |
| 09/05/2002 | US20020121709 External connection terminal and semiconductor device |
| 09/05/2002 | US20020121708 Method of manufacturing semiconductor device |
| 09/05/2002 | US20020121707 Super-thin high speed flip chip package |
| 09/05/2002 | US20020121706 Semiconductor-chip mounting substrate and method of manufacturing the same |
| 09/05/2002 | US20020121705 Flip chip semiconductor package |
| 09/05/2002 | US20020121703 Semiconductor device and manufacturing method of semiconductor device |
| 09/05/2002 | US20020121702 Method and structure of in-situ wafer scale polymer stud grid array contact formation |
| 09/05/2002 | US20020121701 Semiconductor devices and methods for manufacturing the same |
| 09/05/2002 | US20020121699 Dual damascene Cu contact plug using selective tungsten deposition |
| 09/05/2002 | US20020121698 Cap attach surface modification for improved adhesion |
| 09/05/2002 | US20020121697 Process for the formation of RuSixOy-containing barrier layers for high-k dielectrics |
| 09/05/2002 | US20020121695 Molded ball grid array |
| 09/05/2002 | US20020121694 Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses |
| 09/05/2002 | US20020121693 Stacked die package |
| 09/05/2002 | US20020121692 Low fabrication cost, fine pitch and high reliability solder bump |
| 09/05/2002 | US20020121691 High temperature circuit apparatus |
| 09/05/2002 | US20020121690 Semiconductor memory module having double-sided stacked memory chip layout |
| 09/05/2002 | US20020121689 Flip chip type semiconductor device and method for manufacturing the same |
| 09/05/2002 | US20020121688 Semiconductor device, ball grid array connection system, and method of making |
| 09/05/2002 | US20020121687 Electronic component with stacked semiconductor chips |
| 09/05/2002 | US20020121686 Rearrangement sheet, semiconductor device and method of manufacturing thereof |
| 09/05/2002 | US20020121684 Surface-mounting semiconductor device and method of making the same |
| 09/05/2002 | US20020121683 Encapsulated die package with improved parasitic and thermal performance |
| 09/05/2002 | US20020121682 Strapless lead frame |
| 09/05/2002 | US20020121680 Ultra-thin semiconductor package device and method for manufacturing the same |
| 09/05/2002 | US20020121679 Mixed analog and digital integrated circuits |
| 09/05/2002 | US20020121677 Semiconductor device including edge bond pads and methods |
| 09/05/2002 | US20020121670 Lead frame |
| 09/05/2002 | US20020121651 Method of making a metallization line layout |
| 09/05/2002 | US20020121650 Resin-encapsulated semiconductor device and method for manufacturing the same |
| 09/05/2002 | US20020121365 Radial folded fin heat sink |
| 09/05/2002 | US20020121359 Method of installing heat source, and micro heat pipe module |
| 09/05/2002 | US20020121358 Heatsink and heatsink device using the heatsink |
| 09/05/2002 | US20020121094 Switch-mode bi-directional thermoelectric control of laser diode temperature |
| 09/05/2002 | US20020121072 Solder coated lid |
| 09/05/2002 | DE10149580A1 Halbleitervorrichtung Semiconductor device |
| 09/05/2002 | DE10142585A1 Halbleiteranordnung und Verfahren zu deren Herstellung A semiconductor device and process for their preparation |
| 09/05/2002 | DE10134665C1 Operating method for semiconductor element has differential resistance switched to lesser value above given current limit |
| 09/05/2002 | DE10133588A1 Semiconductor chip and conductive structure for contactless chip cards has capacitive coupling between integrated circuit and coil antenna |
| 09/05/2002 | DE10131014C1 Semiconductor element used in a chip card in the pay-per-view television sector comprises a chip, and a device for deactivating the chip consisting of a hollow chamber containing an activator |
| 09/05/2002 | DE10108129A1 Wäßrige Epoxidharzemulsionen, Verfahren zu ihrer Herstellung und ihre Verwendung Aqueous epoxy resin emulsion, process for their preparation and their use |
| 09/05/2002 | DE10107594A1 Process and device for marking individual semiconductor chips on wafers uses a small drop of fluid wax |
| 09/05/2002 | DE10107552A1 Conductive strip arrangement has openings in fixing surface to securely attach bond wires with sealing compound |
| 09/05/2002 | DE10106836A1 Integrierte Schaltungsanordnung aus einem flächigen Substrat Integrated circuit arrangement of a planar substrate |
| 09/05/2002 | DE10106729A1 Process for conductive lines in a conductor plane in a semiconductor element forms two contacting lines one above the other |
| 09/05/2002 | DE10105872A1 Arrangement used in the manufacture of matrix displays comprises a substrate having a recess, and a chip provided in the recess with a layer formed on the peripheral surface of the recess and/or chip |
| 09/05/2002 | DE10105725A1 Abschirmvorrichtung für integrierte Schaltungen Screening for integrated circuits |
| 09/04/2002 | EP1237397A2 Insulating substrate boards for semiconductor and power modules |
| 09/04/2002 | EP1237277A2 Semiconductor switching device |
| 09/04/2002 | EP1237202A2 Semiconductor device and method for making the same |
| 09/04/2002 | EP1237189A1 Arrangement and method for impedance matching |
| 09/04/2002 | EP1237188A2 Lead frame |
| 09/04/2002 | EP1237187A2 Resin-encapsulated semiconductor device and method for manufacturing the same |
| 09/04/2002 | EP1237186A2 By-pass rectifier element and terminal housing for solar battery modules using said element |
| 09/04/2002 | EP1237182A2 Aggregate dielectric layer to reduce nitride consumption |
| 09/04/2002 | EP1237164A1 Method for controlling the sheet resistance of thin film resistors |
| 09/04/2002 | EP1236228A1 Interposer device |
| 09/04/2002 | EP1194953A4 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent |
| 09/04/2002 | EP1082777A4 Wideband rf port structure using coplanar waveguide and bga i/o |
| 09/04/2002 | EP0976155B1 High-voltage, high-current multilayer circuit board, method for the production thereof |
| 09/04/2002 | EP0710400B1 Structures for preventing reverse engineering of integrated circuits |
| 09/04/2002 | CN2509719Y Dehumidifier for furniture |
| 09/04/2002 | CN2509718Y Radial air inlet axial air-out radiator |
| 09/04/2002 | CN2509717Y Radiating apparatus |
| 09/04/2002 | CN2509716Y Radiator of computer central processor |
| 09/04/2002 | CN2509715Y Lock joining device for radiator |
| 09/04/2002 | CN2509714Y Chip constructional structure |
| 09/04/2002 | CN2509713Y Positioning ring for electronic power device |
| 09/04/2002 | CN2509641Y Radiating device for chip |
| 09/04/2002 | CN1367946A Multi-functional energy conditioner |
| 09/04/2002 | CN1367642A Heat-pipe radiating device for heat radiation of microcomputer and electronic equipment |
| 09/04/2002 | CN1367556A Back radiation active small channel heat sink |
| 09/04/2002 | CN1367533A Semiconductor device with reliable connecting chip |
| 09/04/2002 | CN1367532A Press-contacting type semiconductor device |
| 09/04/2002 | CN1367527A Method for preparing semiconductor device |
| 09/04/2002 | CN1367205A Organosilicon precursor for interlayer medium film with low dielectric constant |
| 09/04/2002 | CN1367185A Cross-linked low medium electrical property high polymer material and film, base plate and electronic part using the same |
| 09/04/2002 | CN1367068A Method for making pathway pattern |
| 09/04/2002 | CN1090441C Electric component with lead terminals |